Through silicon via (TSV) filling method
A filling method and technology of through-silicon vias, which are applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as high cost and complex process, and achieve the effect of reducing process difficulty and cost
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[0034] Such as figure 1 Shown is a flowchart of an embodiment of the present invention. Such as Figure 2 to Figure 12 Shown is a schematic cross-sectional view of the silicon wafer during the manufacturing process of the method of the embodiment of the present invention. The method for filling TSV in the embodiment of the present invention includes the following steps:
[0035] Step one, such as figure 2 As shown, a pre-metal dielectric layer 2 is deposited on the silicon wafer 1. Such as image 3 As shown, the through silicon via area is defined by photolithography, the pre-metal dielectric layer 2 and the silicon wafer 1 in the through silicon via area are sequentially etched to form a deep trench or hole 3; the deep trench Or the depth of the hole 3 is 30 micrometers to 250 micrometers, preferably 50 micrometers to 100 micrometers, and the width is 1.5 micrometers to 5 micrometers, most preferably 2 micrometers to 3 micrometers; the metal front dielectric layer 2 is boropho...
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