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Preparation method of organosilicon hollow microsphere

A technology of hollow microspheres and organosilicon, which is applied in the field of preparation of organosilicon hollow microspheres, can solve the problems of complex process, high preparation cost, and unsuitability for mass production, and achieve simple preparation process, reduced preparation cost, and good formability Effect

Inactive Publication Date: 2012-05-02
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims to solve the problems that existing methods for preparing organic silicon hollow microspheres have complex processes, high preparation costs, and are not suitable for mass production, and provide a method for preparing organic silicon hollow microspheres

Method used

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  • Preparation method of organosilicon hollow microsphere
  • Preparation method of organosilicon hollow microsphere
  • Preparation method of organosilicon hollow microsphere

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specific Embodiment approach 1

[0009] Specific embodiment 1: the preparation method of a kind of organosilicon hollow microsphere of the present embodiment is completed according to the following steps:

[0010] 1. Ultrasonic dispersion: use water as a solvent to prepare the surfactant into an aqueous surfactant solution; then add the silicone resin solution, and ultrasonically disperse it at 80kHz to 120kHz for 2 to 10min to obtain a uniformly mixed milky white mixture; 2. Adjust the pH value : Add alkaline solution to the milky white mixed solution prepared in step 1 at 200 to 300 rpm to obtain a mixed solution with a pH value of 9 to 11, and continue stirring for 5 to 10 min at 200 to 300 rpm to obtain a uniform mixed solution; 3. Forming: Seal the reaction vessel with the homogeneous mixture prepared in step 2 at 500-600 rpm, and heat it in a water bath at 50-80°C for 8-24 hours to obtain crude organosilicon hollow microspheres, which are then centrifuged and washed once with an organic solvent , and fi...

specific Embodiment approach 2

[0015] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the surfactants described in step 1 are sodium dodecylbenzenesulfonate, sodium dodecylsulfonate, dodecyl sulfate Sodium or sodium pentadecylcarboxylate. Others are the same as the first embodiment.

specific Embodiment approach 3

[0016] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the aqueous surfactant solution described in Step 1 is dodecylbenzene with a molar concentration of 0.001mol / L to 0.005mol / L Sodium sulfonate, sodium dodecyl sulfate with molar concentration of 0.015mol / L to 0.045mol / L, sodium dodecyl sulfate with molar concentration of 0.012mol / L to 0.036mol / L or, molar concentration of 0.0012 mol / L~0.0056mol / L of sodium pentadecylcarboxylate. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a preparation method of an organosilicon, aiming at solving the problems of complicated process, high preparation cost, and unsuitability of batch production of preparation methods of organosilicon hollow microspheres in the prior art. The method comprises the following steps: A, carrying out ultrasonic dispersion; B, adjusting the pH value; and C, molding. The method has the following advantages that: 1, a hydrolysis step is avoided, a hard template preparation is not needed, thus the synthetic method is simplified, and the preparation cost is reduced; 2, the method is simple and easy to implementation, and can be used for batch production of the organosilicon hollow microspheres; and 3, the prepared organosilicon hollow microspheres has good moldability and good thermostability at a temperature of within 500 DEG C, and can be used as light heat insulation fillers. The method is mainly applied for preparing organosilicon hollow microspheres.

Description

technical field [0001] The invention relates to a preparation method of organic silicon hollow microspheres. Background technique [0002] Silicone is widely used in aircraft tanks, submarines, rockets, satellites, automobiles, electronics, building materials, textiles and other industries because of its excellent properties such as non-toxicity, stability, high temperature resistance and water repellency. Silicone hollow microspheres have the heat resistance of silicone shell materials and the lightweight properties of hollow structures, and can be used as lightweight thermal insulation fillers. [0003] The existing preparation of organosilicon hollow microspheres is through the template method: firstly, the polymer or inorganic microsphere particles are prepared, and then the surface is modified, and then the organosilicon monomer is adsorbed, so that the organosilicon monomer is hydrolyzed on the surface of the microsphere template, Polycondensation to form a shell, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J13/02
Inventor 徐慧芳吕通张海礁宋建伟高北岭韦华伟
Owner HARBIN INST OF TECH
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