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Preparation method of organosilicon hollow microsphere

A technology of hollow microspheres and organosilicon, which is applied in the field of preparation of organosilicon hollow microspheres, can solve problems such as complex process, high preparation cost, and unsuitability for mass production, and achieve simple preparation process, reduced preparation cost, and good formability Effect

Inactive Publication Date: 2013-11-06
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims to solve the problems that existing methods for preparing organic silicon hollow microspheres have complex processes, high preparation costs, and are not suitable for mass production, and provide a method for preparing organic silicon hollow microspheres

Method used

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  • Preparation method of organosilicon hollow microsphere
  • Preparation method of organosilicon hollow microsphere
  • Preparation method of organosilicon hollow microsphere

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specific Embodiment approach 1

[0009] Specific embodiment one: the preparation method of a kind of organosilicon hollow microspheres of the present embodiment is specifically completed according to the following steps:

[0010] 1. Ultrasonic dispersion: use water as a solvent to prepare the surfactant into a surfactant aqueous solution; then add a silicone resin solution, and disperse ultrasonically at 80kHz-120kHz for 2-10 minutes to obtain a uniformly mixed milky white mixture; 2. Adjust the pH value : Add alkaline solution to the milky white mixed solution prepared in step 1 at 200-300 rpm to obtain a mixed solution with a pH value of 9-11, and continue stirring at 200-300 rpm for 5-10 minutes to obtain a uniform mixed solution; 3. Forming: Seal the reaction vessel with the homogeneous mixture prepared in step 2 at 500-600 rpm, and heat in a water bath at 50°C-80°C for 8h-24h to obtain the crude silicone hollow microspheres, which are then centrifugally washed once with an organic solvent , and finally w...

specific Embodiment approach 2

[0015] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the tensio-active agent described in step one is sodium dodecylbenzenesulfonate, sodium dodecylsulfonate, dodecylsulfuric acid Sodium or Sodium Pentadecyl Carboxylate. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0016] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the aqueous surfactant solution described in step 1 is dodecylbenzene with a molar concentration of 0.001mol / L to 0.005mol / L Sodium sulfonate, sodium dodecylsulfonate with a molar concentration of 0.015mol / L to 0.045mol / L, sodium dodecyl sulfate with a molar concentration of 0.012mol / L to 0.036mol / L or, a molar concentration of 0.0012 mol / L~0.0056mol / L sodium pentadecyl carboxylate. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a preparation method of an organosilicon, aiming at solving the problems of complicated process, high preparation cost, and unsuitability of batch production of preparation methods of organosilicon hollow microspheres in the prior art. The method comprises the following steps: A, carrying out ultrasonic dispersion; B, adjusting the pH value; and C, molding. The method has the following advantages that: 1, a hydrolysis step is avoided, a hard template preparation is not needed, thus the synthetic method is simplified, and the preparation cost is reduced; 2, the method is simple and easy to implementation, and can be used for batch production of the organosilicon hollow microspheres; and 3, the prepared organosilicon hollow microspheres has good moldability and good thermostability at a temperature of within 500 DEG C, and can be used as light heat insulation fillers. The method is mainly applied for preparing organosilicon hollow microspheres.

Description

technical field [0001] The invention relates to a preparation method of organosilicon hollow microspheres. Background technique [0002] Organosilicon is widely used in aircraft tanks, submarines, rockets, satellites, automobiles, electronics, building materials, textiles and other industries due to its non-toxic, stable, high temperature resistance, and hydrophobic properties. Silicone hollow microspheres have the heat resistance of silicone shell materials and the light-weight characteristics of hollow structures, and can be used as lightweight heat-insulating fillers. [0003] The existing preparation of organic silicon hollow microspheres is through the template method: first prepare polymer or inorganic microsphere particles, then carry out surface modification, and then absorb organic silicon monomers, so that the organic silicon monomers are hydrolyzed on the surface of the microsphere template, Polycondensation to form a shell, and finally the organic silicon hollow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J13/02
Inventor 徐慧芳吕通张海礁宋建伟高北岭韦华伟
Owner HARBIN INST OF TECH