Stereolithography rapid protoyping photosensitive resin prepared by using polypropylene glycol diglycidyl ether diacrylate as prepolymer, and preparation method for stereolithography rapid protoyping photosensitive resin

Abstract

The invention discloses a stereolithography rapid protoyping photosensitive resin prepared by using polypropylene glycol diglycidyl ether diacrylate as prepolymer, and a preparation method for the stereolithography rapid protoyping photosensitive resin. The resin is characterized by being prepared from the following raw materials in percentage by mass: 10 to 70 percent of polypropylene glycol diglycidyl ether diacrylate, 5 to 75 percent of epoxy resin, 5 to 55 percent of oxacyclobutane compound, 1 to 12 percent of cationic initiator, and 1 to 10 percent of free radical photopolymerization initiator. The method comprises the following steps of: mixing the raw materials in the mass ratio, and stirring at the temperature of between 20 and 80 DEG C for 5 to 120 minutes to ensure that a mixture becomes transparent faint yellow uniform liquid. The prepared photosensitive resin is low in irritation and volatile matter content, and is easy and convenient to prepare, and is high in photosensitiveness; and the critical exposure capacity Ec of the resin is less than 16.0mJ / cm<2>; formed parts are high in precision, and the camber factor CF(6) of the formed parts is + / -0.01, and CF (11) is + / -0.03. Parts with any complex shape and high precision can be directly prepared from the resin and the preparation cost of the resin is much lower than that of the photosensitive resins of the same kind.

Description

Technical field

[0001] The invention belongs to the field of rapid prototyping manufacturing and relates to the use of polypropylene glycol diglycidyl ether diacrylate as a prepolymer and its application in the preparation of stereolithography rapid prototyping photosensitive resin. Background technique

[0002] The emergence of rapid prototyping makes it easy and fast to manufacture complex parts or molds. The commonly used rapid prototyping process is UV laser curing rapid prototyping (commonly known as: stereolithography rapid prototyping). It uses ultraviolet laser to scan the photosensitive resin liquid surface point by point according to the shape of the two-dimensional cross-section to solidify the resin. The cured resin A two-dimensional figure is formed, which is scanned and solidified layer by layer, and finally a complete three-dimensional entity can be obtained. In stereolithography rapid prototyping, the photosensitive resin used is developed on the basis of tr...

Examples

Embodiment 1

[0026] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 1000 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 500 g, bisphenol A type epoxy resin (E-51) 410 grams, polypropylene glycol diglycidyl ether diacrylate 820 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 170 grams.

[0027] 2. Heat to 50°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.1mJ / cm2 , The test method is the method reported in "Zhao Yi. Experimental Research on Properties of Photosensitive Resin in Laser Rapid Prototyping [J]. Polymer Materials Science and Engineering, 2004, 20 (1): 184-186".

[0028] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors...

Embodiment 2

[0030] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 900 g, bisphenol A type epoxy resin (E-51) 600 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, 800 grams of polypropylene glycol diglycidyl ether diacrylate, 110 grams of 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 190 grams of triarylsulfonium hexafluoroantimonate.

[0031] 2. Heat to 40°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 14.9 mJ / cm 2 .

[0032] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=-0.02 were measured.

Embodiment 3

[0034] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 500g, bisphenol A type epoxy resin (E-51) 900g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, polypropylene glycol diglycidyl ether diacrylate 900 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 200 grams.

[0035] 2. Heat to 50°C and stir for 20 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.3mJ / cm 2 .

[0036] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=-0.03 were measured.

Technical field

[0001] The invention belongs to the field of rapid prototyping manufacturing and relates to the use of polypropylene glycol diglycidyl ether diacrylate as a prepolymer and its application in the preparation of stereolithography rapid prototyping photosensitive resin. Background technique

[0002] The emergence of rapid prototyping makes it easy and fast to manufacture complex parts or molds. The commonly used rapid prototyping process is UV laser curing rapid prototyping (commonly known as: stereolithography rapid prototyping). It uses ultraviolet laser to scan the photosensitive resin liquid surface point by point according to the shape of the two-dimensional cross-section to solidify the resin. The cured resin A two-dimensional figure is formed, which is scanned and solidified layer by layer, and finally a complete three-dimensional entity can be obtained. In stereolithography rapid prototyping, the photosensitive resin used is developed on the basis of tr...

Examples

Embodiment 1

[0026] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 1000 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 500 g, bisphenol A type epoxy resin (E-51) 410 grams, polypropylene glycol diglycidyl ether diacrylate 820 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 170 grams.

[0027] 2. Heat to 50°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.1mJ / cm2 , The test method is the method reported in "Zhao Yi. Experimental Research on Properties of Photosensitive Resin in Laser Rapid Prototyping [J]. Polymer Materials Science and Engineering, 2004, 20 (1): 184-186".

[0028] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors...

Embodiment 2

[0030] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 900 g, bisphenol A type epoxy resin (E-51) 600 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, 800 grams of polypropylene glycol diglycidyl ether diacrylate, 110 grams of 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 190 grams of triarylsulfonium hexafluoroantimonate.

[0031] 2. Heat to 40°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 14.9 mJ / cm 2 .

[0032] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=-0.02 were measured.

Embodiment 3

[0034] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 500g, bisphenol A type epoxy resin (E-51) 900g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, polypropylene glycol diglycidyl ether diacrylate 900 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 200 grams.

[0035] 2. Heat to 50°C and stir for 20 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.3mJ / cm 2 .

[0036] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=-0.03 were measured.