Stereolithography rapid protoyping photosensitive resin prepared by using polypropylene glycol diglycidyl ether diacrylate as prepolymer, and preparation method for stereolithography rapid protoyping photosensitive resin

A technology of diglycidyl ether and diacrylate, which is applied in the field of rapid prototyping, can solve the problems of high irritation, pollution of the working environment, and high viscosity of the prepolymer, and achieve the effect of simple steps, good photosensitivity, and high precision

Inactive Publication Date: 2012-05-02
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In these two patents, the acrylate prepolymers used in the preparation of photosensitive resins are bisphenol A epoxy acrylate, novolac epoxy acrylate and pentaerythritol triacrylate. The disadvantages of these prepolymers are The cured product is brittle and the viscosity of the prepolymer is relatively high, so it is necessary to add thinners such as trimethylolpropane triacrylate, tripropylene glycol diacrylate and 1,6-hexanediol diacrylate to adjust the viscosity. The viscosity of photosensitive resin, and these diluents are highly volatile and irritating, and have certain pollution to the working environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 1000 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 500 g, bisphenol A type epoxy resin (E-51) 410 grams, polypropylene glycol diglycidyl ether diacrylate 820 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 170 grams.

[0027] 2. Heat to 50°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.1mJ / cm2 , The test method is the method reported in "Zhao Yi. Experimental Research on Properties of Photosensitive Resin in Laser Rapid Prototyping [J]. Polymer Materials Science and Engineering, 2004, 20 (1): 184-186".

[0028] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors...

Embodiment 2

[0030] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 900 g, bisphenol A type epoxy resin (E-51) 600 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, 800 grams of polypropylene glycol diglycidyl ether diacrylate, 110 grams of 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 190 grams of triarylsulfonium hexafluoroantimonate.

[0031] 2. Heat to 40°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 14.9 mJ / cm 2 .

[0032] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=-0.02 were measured.

Embodiment 3

[0034] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 500g, bisphenol A type epoxy resin (E-51) 900g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, polypropylene glycol diglycidyl ether diacrylate 900 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 200 grams.

[0035] 2. Heat to 50°C and stir for 20 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.3mJ / cm 2 .

[0036] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=-0.03 were measured.

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PUM

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Abstract

The invention discloses a stereolithography rapid protoyping photosensitive resin prepared by using polypropylene glycol diglycidyl ether diacrylate as prepolymer, and a preparation method for the stereolithography rapid protoyping photosensitive resin. The resin is characterized by being prepared from the following raw materials in percentage by mass: 10 to 70 percent of polypropylene glycol diglycidyl ether diacrylate, 5 to 75 percent of epoxy resin, 5 to 55 percent of oxacyclobutane compound, 1 to 12 percent of cationic initiator, and 1 to 10 percent of free radical photopolymerization initiator. The method comprises the following steps of: mixing the raw materials in the mass ratio, and stirring at the temperature of between 20 and 80 DEG C for 5 to 120 minutes to ensure that a mixture becomes transparent faint yellow uniform liquid. The prepared photosensitive resin is low in irritation and volatile matter content, and is easy and convenient to prepare, and is high in photosensitiveness; and the critical exposure capacity Ec of the resin is less than 16.0mJ/cm<2>; formed parts are high in precision, and the camber factor CF(6) of the formed parts is +/-0.01, and CF (11) is +/-0.03. Parts with any complex shape and high precision can be directly prepared from the resin and the preparation cost of the resin is much lower than that of the photosensitive resins of the same kind.

Description

technical field [0001] The invention belongs to the field of rapid prototyping, and relates to the use of polypropylene glycol diglycidyl ether diacrylate as a prepolymer in the preparation of stereolithography rapid prototyping photosensitive resins and its application. Background technique [0002] The emergence of rapid prototyping has made it simple and fast to manufacture complex parts or molds. The commonly used rapid prototyping process is ultraviolet laser curing rapid prototyping (commonly known as: stereolithography rapid prototyping), which uses ultraviolet laser to scan point by point on the liquid surface of photosensitive resin according to the shape of two-dimensional cross-section, so that the resin is cured, and the cured resin A two-dimensional figure is formed, which is scanned and solidified layer by layer, and finally a complete three-dimensional entity can be obtained. In stereolithography rapid prototyping, the photosensitive resin used is developed o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08G59/20C08F283/10C08F2/48
Inventor 黄笔武陈新平
Owner NANCHANG UNIV
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