Stereolithography rapid protoyping photosensitive resin prepared by using polypropylene glycol diglycidyl ether diacrylate as prepolymer, and preparation method for stereolithography rapid protoyping photosensitive resin
A technology of diglycidyl ether and diacrylate, which is applied in the field of rapid prototyping, can solve the problems of high irritation, pollution of the working environment, and high viscosity of the prepolymer, and achieve the effect of simple steps, good photosensitivity, and high precision
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Embodiment 1
[0026] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 , ,4 , - Epoxycyclohexyl methyl ester 1000 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 500 g, bisphenol A type epoxy resin (E-51) 410 grams, polypropylene glycol diglycidyl ether diacrylate 820 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 170 grams.
[0027] 2. Heat to 50°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.1mJ / cm2 , The test method is the method reported in "Zhao Yi. Experimental Research on Properties of Photosensitive Resin in Laser Rapid Prototyping [J]. Polymer Materials Science and Engineering, 2004, 20 (1): 184-186".
[0028] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors...
Embodiment 2
[0030] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 , ,4 , - Epoxycyclohexyl methyl ester 900 g, bisphenol A type epoxy resin (E-51) 600 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, 800 grams of polypropylene glycol diglycidyl ether diacrylate, 110 grams of 2-hydroxy-2-methyl-1-phenyl-1-propanone, and 190 grams of triarylsulfonium hexafluoroantimonate.
[0031] 2. Heat to 40°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 14.9 mJ / cm 2 .
[0032] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=-0.02 were measured.
Embodiment 3
[0034] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 , ,4 , - Epoxycyclohexyl methyl ester 500g, bisphenol A type epoxy resin (E-51) 900g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, polypropylene glycol diglycidyl ether diacrylate 900 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 200 grams.
[0035] 2. Heat to 50°C and stir for 20 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.3mJ / cm 2 .
[0036] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=-0.03 were measured.
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