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Cleaning agent for clearing away resins and soldering

A cleaning agent and welding trace technology, which is applied in the direction of detergent composition, non-surface active cleaning solvent, non-surface active detergent composition, etc., can solve the problems of strong corrosion ability and low stability, and achieve less loss and better recovery Easy and safe to use

Active Publication Date: 2012-05-02
华阳新兴科技(天津)集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The patent application number is 201010128398.9, which discloses a modified hydrocarbon cleaning agent. Alcohols, esters and ether additives are added to the hydrocarbon cleaning agent. Although the modified cleaning agent has strong cleaning ability and low pollution, But there are still some shortcomings, such as low stability and strong corrosion ability

Method used

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  • Cleaning agent for clearing away resins and soldering
  • Cleaning agent for clearing away resins and soldering
  • Cleaning agent for clearing away resins and soldering

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A cleaning agent for removing resin and welding marks, its composition and weight are as follows: (take 1000g product as an example)

[0030]

[0031] A kind of preparation method of the cleaning agent that is used to remove resin and welding mark is as follows:

[0032] (1) 1 gram of 2.6 di-tert-butyl-p-cresol is dissolved in a hydrocarbon solvent of 50-100 g with a beaker, and is added to the reaction kettle together with the remaining hydrocarbon solution;

[0033] (2) Use a beaker to dissolve 1 gram of benzotriazole in 50-100 g of alcohol ether solvent, and add it to the reaction kettle together with the remaining alcohol ether solution

[0034] (3) Add pine oil and stir evenly to obtain this product.

[0035] The quality standard of this environment-friendly resin and solder trace cleaning agent:

[0036] Appearance: colorless transparent liquid;

[0037] Odor: Solvent smell;

[0038] Specific gravity: 0.79-0.80g / ml;

[0039] Flash point (closed): ≥50°C;

...

Embodiment 2

[0045] A cleaning agent for removing resin and welding marks, its composition and weight are as follows: (take 1000g product as an example)

[0046]

[0047] The steps of its preparation method are the same as in Example 1.

[0048] The cleaning agent quality standard for removing resin and solder traces:

[0049] Appearance: colorless transparent liquid

[0050] Odor: Slight solvent smell

[0051] Specific gravity: 0.79-0.80g / ml

[0052] Flash point (closed): ≥50°C

[0053] Boiling range: 150-174°C

[0054] Hazardous chemical grade: Class 3.3, high flash point, flammable liquid;

[0055] Acute oral toxicity (LD50mg / Kg): >15000;

[0056] Ozone destruction coefficient: 0.00;

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Abstract

The invention relates to a cleaning agent for clearing away resins and soldering, comprising the following components in weight ratios: 20-60% alcohol-ether solvent, 0-5% rosin solvent, 0.001-0.01% corrosion inhibitor, 0.001-0.01% antioxidant, and a hydrocarbon solvent added to 100%. The cleaning agent has strong capability of dissolving resins, soldering and oil contaminations, and short in cleaning time, which only needs 10-15 min, and has no corrosion on an integrated circuit board; the used cleaning agent can be recycled through distillation; and more importantly, such an environment-friendly resin and soldering cleaning agent contains no halogenated hydrocarbons which are strong in toxicity and have damage influence on the atmosphere; therefore, the cleaning agent is a substitute product for the halogenated hydrocarbon cleaning agents.

Description

technical field [0001] The invention belongs to the field of chemical cleaning agents, in particular to a cleaning agent used for removing resin and welding traces. Background technique [0002] In the field of precision industrial cleaning, particle dirt, rosin solder traces, and resin on electronic components and semiconductor integrated circuits must be cleaned. Since printed circuit boards are made of metals with poor corrosion resistance and plastics with poor solvent resistance, the choice of cleaning agent is particularly important. As components of printed circuit boards become smaller and denser, it becomes more difficult to clean solder residue. The traditional cleaning agents are F113 (trifluorotrichloroethane), 1.1.1 trichloroethane, dichloromethane, trichloroethylene, tetrachloroethylene, toluene, xylene, etc. The destruction of the ozone layer by chlorofluorocarbons is being gradually banned. The mutagenicity and carcinogenicity of chlorinated hydrocarbons, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D7/26C11D7/50C11D7/60
Inventor 朱国梅赵国胜
Owner 华阳新兴科技(天津)集团有限公司
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