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Flexible metal-clad laminate and manufacturing method thereof
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A metal cladding, flexible metal technology, applied in metal layered products, printed circuit manufacturing, chemical instruments and methods, etc., can solve problems such as circuit pattern dislocation and dimensional changes, and achieve small dimensional changes and good appearance. Effect
Inactive Publication Date: 2012-05-02
SK INNOVATION CO LTD
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In particular, when a reflow operation (in which a polyimide film having a circuit pattern is immersed in a lead bath heated to a high temperature) is performed, dimensional changes due to exposure to high temperatures may often occur, resulting in damage to electronic components. Generation of dislocations between the circuit pattern and the circuit pattern of the metal-clad laminate
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[0064] Examples and experiments will be described below. The following examples and experiments are for illustrative purposes only and are not intended to limit the scope of the invention.
[0074] The coefficient of linear thermal expansion is obtained based on thermal mechanical analysis (TMA) by taking the average value of the thermal expansion values at 100°C-250°C from the thermal expansion values measured when the sample is heated to 400°C at a rate of 5°C / min. In addition, an inflection point in the thermal expansi...
preparation Embodiment 1
[0084] First, 1,809 g of PDA and 591 g of ODA were completely dissolved into 25,983 g of DMAc solution under nitrogenatmosphere with stirring. Next, 6,000 g of BPDA was added thereto as dianhydride in several portions. Then, the resulting mixture was continuously stirred for about 24 hours to provide a polyamic acid solution. The polyamic acid solution thus prepared was cast to prepare a film having a thickness of 20 μm, and then the laminate was raised (heated) to 350° C. over 60 minutes and kept at 350° C. for 30 minutes for complete curing. It was shown that the glass transition temperature and linear thermal expansion coefficient of the laminate were 314° C. and 9.9 ppm / K, respectively.
preparation Embodiment 2-7
[0086] Except using the composition and amounts as described in Table 1, Preparation Example 1 was repeated to provide a laminate.
[0087] [Table 1]
[0088]
[0089] * CTE: coefficient of thermal expansion
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Abstract
Provided are a flexible metal clad laminate and a method for manufacturing the same. The flexible metal clad laminate is obtained by applying a polyimide precursor resin convertible into a polyimide resin many times onto a metal clad, followed by drying, and by converting the polyimide precursor resin into a polyimide resin through infraredray (IR) heat treatment. The polyimide resin layer that is in direct contact with the metal clad has a glass transition temperature of 300 DEG C or higher, and the polyimide resin layer has an overall linear thermal expansion coefficient of 20 ppm / K or lower. It is possible to obtain a flexible metal clad laminate for flexible printed circuit boards that causes no curling before and after etching, shows a small change in dimension caused by heat treatment, and has high adhesion to a metal clad and excellent appearance after completing imidization.
Description
technical field [0001] The present invention relates to flexible metal-clad laminates, and more particularly, to non-curling before and after etching, exhibiting small dimensional changes caused by heat treatment, having excellent appearance after completion of imidization, and being industrially acceptable. Flexible metal-clad laminates available on , and methods of making the same. Background technique [0002] Flexible metal clad laminates are laminates of conductive metal foils and dielectric resins that are suitable for microcircuit processing and can be bent in tight spaces. Therefore, it has been increasingly used in various applications as current electronic devices have been miniaturized in size and weight. The flexible metal-clad laminate is classified into a double-layer type and a three-layer type. A three-layer type flexible metal-clad laminate using an adhesive exhibits lower heat resistance and flame resistance, and generates a larger dimensional change duri...
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