Texturing method of quasi-single crystal silicon wafer

Abstract

The invention relates to a texturing method of a quasi-single crystal silicon wafer. The texturing method is characterized in that the method comprises the following steps that: a wet etching method is employed to remove a mechanical damage layer on a quasi-single crystal silicon wafer that based on crystal grain crystal grains; and according to a proportion for which the crystal grains account, plasma etching and reactive ion etching are employed to carry out single crystal texturing. Therefore, there is no need for deionized water to carry out the plasma etching and the reactive ion etching; and less chemical reagent dosages are required. Meanwhile, pollution of reaction product discharging is low as well as safety and environmental-friendly performances are realized. Moreover, reflectivity of the textured quasi-single crystal silicon wafer is less than 15%; the surface light tripping effect is good; and the cell slice gives full play to advantages of the quasi-single crystal silicon wafer; the textured surface texturing is independent of conditions of the crystal orientation and the substrate; and advantages of high reliability, easiness for control and less silicon chip consumption are realized; and the utilization of the method is beneficial for application of thin silicon chips.

Description

technical field [0001] The invention relates to a texturing method, in particular to a texturing method for a quasi-single crystal silicon wafer. Background technique [0002] Texturing is the process of preparing silicon surfaces with anti-reflective properties. In the preparation process of solar cells, through the texturing process, the surface light trapping effect is used to promote the absorption of sunlight and improve the photoelectric conversion efficiency of solar cells. [0003] Industrialized silicon wafers at home and abroad mainly include monocrystalline silicon wafers and polycrystalline silicon wafers. The corresponding manufacturing methods are Czochralski single crystal slicing process and ingot polycrystalline slicing process. Czochralski monocrystalline solar cells have high conversion efficiency (>18%), and the manufacturing cost of corresponding silicon wafers is also relatively high; on the contrary, cast polycrystalline solar cells have become the...

AI Technical Summary

Problems solved by technology

In the production process of this type of silicon wafer battery, if the texturing process is not improved, no matter whether the alkali texturing used for traditional single crystal or the acid texturing used for polycrystalline is used, the prepared cells will not be able to play a quasi-mono The advantages of crystalline silicon wafers, the appearance gap of cells is also obvious, which affects the appearance of later packaged components