Copper/aluminum ultrasonic liquid-phase diffusion brazing process and brazing device

A technology of liquid phase diffusion and brazing technology, which is applied in auxiliary devices, metal processing, manufacturing tools, etc., can solve problems such as ultrasonic brazing difficulties, and achieve the effects of simple structure, ingenious design, and low brazing temperature
CN102513635AInactive Publication Date: 2012-06-27SHANDONG JIANZHU UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANDONG JIANZHU UNIV
Publication Date
2012-06-27
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a copper / aluminum ultrasonic liquid-phase diffusion brazing process and a brazing device. The brazing process adopts the technical scheme that the copper / aluminum ultrasonic liquid-phase diffusion brazing process adopts Sn-9Zn eutectic alloy brazing filler metal, and does not adopt brazing flux; the brazing temperature is low; and the requirements on the surface and the structure of a copper / aluminum brazing connector are not high. The brazing process has the beneficial effects that the brazing process is accomplished in brazing filler metal at a molten state, and the problem of heat preservation of the brazing filler metal during the brazing is eliminated; the controllability of brazing technological parameters is high, the operation process is simple, and the efficiency is high; the copper / aluminum connector adopting the brazing process is smooth, and the performances of the copper / aluminum connector are remarkably improved; and the anti-corrosion capability and both the high and low temperature impact resistance of the copper / aluminum brazing connector meet the requirements of national relevant standards.
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Description

technical field

[0001] The invention relates to a brazing process and a brazing device, in particular to a copper / aluminum ultrasonic liquid phase diffusion brazing process and a brazing device. Background technique

[0002] The patent (US 7 624 906 B2. Dec.1, 2009) discloses a copper / aluminum brazing method. The method is to apply ultrasonic waves to the base material, and transmit the ultrasonic energy to the joint placed on the joint to be welded through the base material. The molten solder at one end makes the solder quickly fill the brazing seam to realize the brazing process. Its disadvantage is that this method needs to use flux in the brazing process, which has higher requirements on the surface state and structure of copper / aluminum joints. For joints with complex structures, such as aluminum wire and copper wire commonly used in the electrical and electronic industry The joint structure of the lead-out end (the copper terminal is half-surrounded by the aluminum wi...

Claims

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