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Low-temperature co-fired ceramic material with high thermal conductivity and preparation method thereof

A technology of low-temperature co-fired ceramics and high thermal conductivity, which is applied in the field of electronic packaging materials, can solve the problems of no technological breakthrough and low thermal conductivity of AlN/glass composite system, and achieve simple synthesis process, promote phonon heat conduction, low cost effect

Active Publication Date: 2013-09-11
ZHEJIANG SIRAMIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the above-mentioned existing literature reports, although the thermal conductivity of the material has been improved to a certain extent, the thermal conductivity of the AlN / glass composite system is still relatively low, and there is no major technological breakthrough.

Method used

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  • Low-temperature co-fired ceramic material with high thermal conductivity and preparation method thereof
  • Low-temperature co-fired ceramic material with high thermal conductivity and preparation method thereof
  • Low-temperature co-fired ceramic material with high thermal conductivity and preparation method thereof

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Experimental program
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preparation example Construction

[0032] Preparation of glass-ceramic powder

[0033] Prepare No. 1 to No. 5 glass powder according to the proportioning in Table 1:

[0034] Table 1 The formula (wt%) of glass powder and its performance parameters:

[0035]

[0036] Accurately weigh 100 g of raw materials according to the percentage by weight in Table 1 (wherein, B 2 o 3 Use H 3 BO 3 As a starting material, MgCO 3 ·Mg(OH) 2 ·5H 2 O can be used as a starting material for MgO, CaCO 3 It can be used as the starting material of CaO), put it into an alumina mortar and mix it evenly, then transfer it to a quartz crucible, then place the quartz crucible in a high-temperature furnace, and raise it from room temperature to 1300-1500°C, with a heating rate of 5- 10°C / min, keep warm for 1-2h. Pour the molten glass directly into cold deionized water to form cullet particles. Put the obtained broken glass particles with 80 ml of ethanol and 400 g of zirconia balls into a ball mill jar and mill them in a planeta...

Embodiment 1

[0039] Weigh 5 g of the above No. 3 glass powder and 5 g of AlN powder, mix them with 10 ml of ethanol, 40 g of ZrO 2 The balls were put into a ball milling tank for 24 h, and then transferred to a glass container for drying at 90 °C. Weigh 0.5 g of the mixture powder, put it into a graphite grinding tool with a diameter of 10 mm, place it in an SPS sintering furnace, raise it from room temperature at 100 °C / min to 850 °C, press 40 MPa, and keep it warm for 5 min.

Embodiment 2

[0041] Take 3.5 g of the above No. 3 glass powder and 6.5 g of AlN powder, mix them with 10 ml of ethanol, 40 g of ZrO 2 The balls were put into a ball milling tank for 24 h, and then transferred to a glass container for drying at 90 °C. Weigh 0.5 g of the mixture powder, put it into a graphite grinding tool with a diameter of 10 mm, place it in an SPS sintering furnace, raise it from room temperature at 100 °C / min to 850 °C, press 40 MPa, and keep it warm for 5 min.

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Abstract

The invention relates to a low-temperature co-fired ceramic material with high thermal conductivity and a preparation method thereof. The low-temperature co-fired ceramic material is formed by compounding microcrystalline glass, ceramic fillers with high thermal conductivity and a one-dimensional material with high thermal conductivity, wherein the weight percentage content of the one-dimensional material with high thermal conductivity is 1 to 25 percent. The one-dimensional material with high thermal conductivity is provided and can be 'connected' with the ceramic fillers with high thermal conductivity to form a three-dimensional network-shaped heat-conducting structure, so that heat-conducting performance and mechanical strength of the material can be further enhanced.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials, and relates to a low-temperature co-fired ceramic material, especially a low-temperature co-fired ceramic material with high thermal conductivity and a preparation method thereof. Background technique [0002] Low temperature co-fired ceramics (Low temperature co~fired ceramics, LTCC) can be integrated with high conductivity metals (such as gold, silver, copper, etc.) Thermal expansion coefficient (matching that of silicon), high chemical stability and good mechanical properties, among other advantages, this technology has been successfully applied in the field of microelectronic packaging and device manufacturing for more than two decades. [0003] After more than 20 years of development, LTCC materials can be roughly divided into two categories according to different material systems: glass-ceramic systems and glass / ceramic composite systems. The glass-ceramic system LTCC material...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/00C04B35/622
Inventor 李永祥马名生刘志甫王依琳吴文骏
Owner ZHEJIANG SIRAMIC TECH CO LTD