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Method for preparing leaf-shaped nanometer silver-copper alloy

A nano-silver and copper alloy technology, which is applied in the field of preparing leaf-shaped nano-silver-copper alloys, can solve the problems that nano-silver-copper alloys have not been reported, and achieve good mechanical properties, easy to repeat operations, and increase the reaction rate.

Inactive Publication Date: 2013-06-19
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There have been patent reports that micron-sized silver-copper alloy powders have been prepared by ball milling, but there are still few reports on the preparation of nano-silver-copper alloys, and there have been no reports on the preparation of leaf-shaped nano-silver-copper alloys.

Method used

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  • Method for preparing leaf-shaped nanometer silver-copper alloy
  • Method for preparing leaf-shaped nanometer silver-copper alloy
  • Method for preparing leaf-shaped nanometer silver-copper alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Cut the copper-zinc alloy sheet with a thickness of 0.3mm and 38% zinc (mass fraction) into a size of about 10mm×10mm, and then use 1000# water sandpaper to grind the surface of the copper-zinc alloy to remove the oxide film on the surface, and put the polished copper-zinc Put the alloy into acetone and distilled water successively, each ultrasonic cleaning for 10 minutes, then rinse the copper-zinc alloy surface with absolute ethanol to remove impurities, dry it, and immerse the dried copper-zinc alloy in pre-prepared 10mmol / L Silver nitrate solution, after 5 seconds the surface of the copper-zinc alloy turns dark gray, take it out, wash it with distilled water to remove excess salt on the surface, dry it naturally, put the S-Y-S tubular resistance furnace in industrial pure nitrogen (oxygen partial pressure is about 0.0001atm) after heating up to 200°C and stabilizing for 30 minutes, put the copper-zinc alloy into a flat-bottomed crucible and place it in the middle of ...

Embodiment 2

[0029] Cut a copper-zinc alloy sheet with a thickness of 0.3mm and a zinc content of 36% (mass fraction) into a size of about 10mm×10mm, then use 1000# water-grinding sandpaper to grind the surface of the copper-zinc alloy to remove the oxide film on the surface, and put the polished copper-zinc Put the alloy into acetone and distilled water successively, each ultrasonic cleaning for 10 minutes, then rinse the surface of the copper-zinc alloy with absolute ethanol to remove impurities, dry it, and immerse the dried copper-zinc alloy in pre-prepared 5mmol / L Silver nitrate solution, after 60s the surface of the copper-zinc alloy becomes dark gray, take it out, wash it with distilled water to remove excess salt on the surface, dry it naturally, put the S-Y-S tubular resistance furnace in an argon-oxygen mixture with an oxygen partial pressure of 0.001atm After heating up to 100°C in air and stabilizing for 30 minutes, put the copper-zinc alloy into a flat-bottomed crucible and pla...

Embodiment 3

[0032] Cut the copper-zinc alloy sheet with a thickness of 0.3mm and 38% zinc (mass fraction) into a size of about 10mm×10mm, and then use 1000# water sandpaper to grind the surface of the copper-zinc alloy to remove the oxide film on the surface, and put the polished copper-zinc Put the alloy into acetone and distilled water successively, each ultrasonic cleaning for 10 minutes, then rinse the copper-zinc alloy surface with absolute ethanol to remove impurities, dry it, and immerse the dried copper-zinc alloy in pre-prepared 10mmol / L Silver nitrate solution, after 5 seconds, the surface of the copper-zinc alloy becomes dark gray, take it out, wash it with distilled water to remove excess salt on the surface, dry it naturally, put the S-Y-S tubular resistance furnace in the nitrogen oxygen with an oxygen partial pressure of 0.01atm After heating up to 300°C in the mixed gas and stabilizing for 30 minutes, put the copper-zinc alloy into a flat-bottomed crucible and place it in t...

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Abstract

A method for preparing leaf-shaped nanometer silver-copper alloy relates to a method for preparing nanometer silver-copper alloy. The method takes pinchbeck alloy as the base body and comprises the steps as follows: an oxidation film and other impurities on the surface of the alloy are removed, the alloy is immersed in a silver nitrate solution which is prepared in advance and has the concentration of 5 to 100 mmol / L for corrosion, the alloy is placed in a heating furnace after being cleaned and dried, the alloy is heated at the temperature of 100 to 650 DEG C for 10 to 720 min in the atmosphere containing oxygen, and then the alloy is taken out and cooled to the ambient temperature; therefore, leaf-shaped nanometer silver-copper alloy can be obtained on the surface of the pinchbeck alloy. The nanometer silver-copper alloy prepared in the method is leaf-shaped and has a larger specific surface area than that of common nano-structures, so that the performances of adsorption, conduction, electronic migration and the like of the surface can be enhanced; and the method has the advantages of simple process, low cost and easiness in repeated operation.

Description

technical field [0001] The invention relates to a method for preparing nano-silver-copper alloy, in particular to a method for preparing leaf-shaped nano-silver-copper alloy. Background technique [0002] Due to its quantum size effect, surface effect and macroscopic quantum tunneling effect, nanoparticles exhibit properties different from ordinary materials in terms of light, electricity, magnetism, thermodynamics and chemical catalytic reactions. Due to its excellent electrical conductivity, nano-silver Oxidation resistance and low-temperature sintering performance have attracted widespread attention. Nano-silver not only has high theoretical value, but also has strong practical value. In recent years, nano-silver has been widely used in electrodes of printed circuits, sensors in multilayer ceramic capacitors, etc. In addition, nano-silver is also commonly used as antibacterial materials, biosensor materials, and low-temperature superconducting materials. The preparation o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/24C23C18/44
Inventor 王俊鹏徐春花尤玉飞李炎许荣辉翟传鑫王道皓李香利王镜喆
Owner HENAN UNIV OF SCI & TECH
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