Backboard fabricating method

A manufacturing method and backplane technology, applied in the direction of ion implantation plating, coating, metal material coating process, etc., can solve the problems of intergranular cracking, immaturity, and insufficiently uniform grains, and achieve the effect of uniform grains

Active Publication Date: 2012-07-04
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
  • Description
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Problems solved by technology

However, the method for uniformly refining the grains of the backplane by the forging process is not yet mature.
Taking the brass backplane as an example, the brass backplane contains a certain amount of zinc element. Zinc is a body-centered cubic metal, and the backplane is prone to temperature brittleness during forging; at the same time, because the brass backplane also contains There are trace a

Method used

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Embodiment Construction

[0035] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0036] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways than those described here, so the present invention is not limited by the specific embodiments disclosed below.

[0037] As mentioned in the background art section, the internal structure of the backplane produced in the prior art is uneven and not refined enough, and distortion and deformation appear. In order to overcome the above-mentioned defects, the present invention provides a manufacturing method of the backboard, which changes the internal organizational structure of the backboard so that the organizational structure of the backboard is more ...

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Abstract

The invention discloses a backboard fabricating method, comprising the following steps of: providing a backboard casting piece; forging the backboard casting piece at a temperature of 800-1000 DEG C so as to form a backboard blank; and processing the backboard blank so as to form a backboard. According to the backboard fabricating method disclosed by the invention, the backboard with a finer and more uniform inner organization structure can be obtained, so that the backboard is prevented from distortion and deformation. On one hand, a deviation between each part of a target and a silicon wafer substrate is reduced, and the quality of a coating film is improved; and on the other hand, the service life of a sputtering target assembly is prolonged.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a manufacturing method of a backplane. Background technique [0002] In the modern large-scale integrated circuit manufacturing process, magnetron sputtering has become the most excellent substrate coating process due to its advantages such as high sputtering rate, low substrate temperature rise, and good film-substrate bonding force. [0003] In the magnetron sputtering coating process, the target assembly is composed of a target meeting the sputtering performance and a back plate combined with the target and having a certain strength. The back plate not only plays a supporting role when the target assembly is assembled to the sputtering base station, but also has the effect of conducting heat, and is used for heat dissipation of the target in the magnetron sputtering process. In the process of magnetron sputtering coating, the working environment of target components is relativel...

Claims

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Application Information

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IPC IPC(8): C23C14/34C22F1/08C22F1/04
Inventor 姚力军相原俊夫大岩一彦潘杰王学泽周园
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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