Organosilicon coating and preparation method thereof

An elastic coating and silicone technology, applied in the coating and other directions, can solve the problems of poor substrate adhesion, long surface drying time, easy peeling, etc., and achieve excellent electrical insulation, fast curing speed, and low overall cost. Effect

Active Publication Date: 2012-07-11
CHENGDU TALY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are mainly four problems in the products made of this formula: 1. The surface drying time is long, and the internal curing speed is slow, which affects the use of customers; 2. When used as a conformal coating, the adhesion to the contact substrate is not good. Easy to peel off; 3. The paint film formed by the product has low strength, poor elasticity and high hardness, which eventually leads to poor toughness and is easy to break during use; 4. Co

Method used

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  • Organosilicon coating and preparation method thereof
  • Organosilicon coating and preparation method thereof
  • Organosilicon coating and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Select 90 parts of high-viscosity α, ω-dihydroxy polydimethylsiloxane, viscosity at 500mPa.s / 25°C, 10 parts of MQ resin, 10 parts of fumed silica, and knead them evenly in a kneader. The rubber material is transferred to a three-roll machine for grinding, and then transferred to a drying kettle to heat up and stir after being uniform. Keep the temperature of the rubber material at 100 ℃ and vacuum degree = 0.085 Mpa, stir and vacuum dry for 2 hours, and seal it for use.

[0038] Put the dried rubber into a planetary stirring tank, and when the rubber is sealed and cooled within 30°C, add 0.3 parts of a vulcanization accelerator formulated with organotin, 2 parts of methyl tributylketoximosilane and vinyl tributyl ketone silane 2 parts of butanone oximinosilane, 1 part of propylaminotriethoxysilane and 1 part of 3-glycidyloxypropyltrimethoxysilane, stirred at high speed for 20 minutes, added 70 parts of dry-treated 120# solvent oil, Stir for 20 minutes to obtain a silico...

Embodiment 2

[0040] Select 110 parts of high-viscosity α, ω-dihydroxy polydimethylsiloxane, viscosity 60000mPa.s / 25℃, 20 parts of MQ resin, 15 parts of fumed silica, knead evenly in the kneader, and glue Transfer the material to a three-roll machine for grinding, and then transfer it to a drying kettle for heating and stirring. Keep the temperature of the rubber material at 130 ℃ and vacuum degree = 0.090 Mpa. Stir and vacuum dry for 3 hours, and then seal it for use.

[0041] Put the dried rubber into a planetary stirring tank, and when the rubber is sealed and cooled within the range of 40 °C, add 0.6 parts of a vulcanization accelerator formulated with organotin, 2.3 parts of methyl tributylketoximosilane and vinyl tributyl ketone silane 2.3 parts of methyl ethyl ketoxime silane, 2 parts of propylaminotriethoxysilane and 1.5 parts of 3-glycidyl etheroxypropyl trimethoxysilane, stir at high speed for 25 minutes, add 80 parts of dry-treated 200# solvent gasoline, stir After 25 minutes, th...

Embodiment 3

[0043] Select 120 parts of high-viscosity α, ω-dihydroxy polydimethylsiloxane, viscosity at 100000 mPa.s / 25°C, 30 parts of MQ resin, 30 parts of precipitated white carbon black, knead evenly in the kneader, Transfer the rubber material to a three-roll machine for grinding, and then transfer it to a drying kettle for heating and stirring. Keep the temperature of the rubber material at 150 ℃ and vacuum degree = 0.095 Mpa. Stir and vacuum dry for 4 hours, and seal it for use.

[0044] Put the dried rubber material into the planetary stirring tank, and when the rubber material is sealed and cooled within the range of 50 ℃, add 1 part of vulcanization accelerator prepared by organotin, 3 parts of methyl tributylketoxime silane and vinyl tributyl ketone silane 3 parts of methyl ethyl ketoxime silane, 3 parts of propylaminotriethoxysilane and 1 part of 3-glycidyloxypropyltrimethoxysilane, stirred at high speed for 30 minutes, added 90 parts of dry-treated 200# solvent gasoline, Stir ...

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Abstract

The invention belongs to the field of organosilicon, and particularly relates to an organosilicon coating and a preparation method thereof. The organosilicon coating is characterized in that the organosilicon coating comprises 90 to 120 parts of Alpha, Omega-dihydroxy polydimethylpolysiloxane, 10 to 30 parts of MQ resin, 10 to 30 parts of white carbon black, 0.3 to 1 part of vulcanization accelerators, 2 to 3 parts of methyl-tri-(butanone-oxime) silane, 2 to 3 parts of vinyl tributanoximo silane, 1 to 3 parts of propylamino triethoxy silane, 1 to 2 parts of 3-glycidyl ether oxypropyl trimethoxysilane and 70 to 90 parts of solvent. The preparation method comprises the steps of raw material selection, raw material weighing, rubber compound drying, rubber compound preparation, and the like. The organosilicon elastic coating disclosed by the invention has low viscosity and high fluidity, can be rapidly self-leveled and filled after being coated, has a high curing speed at room temperature, needs short surface drying time and curing time, has excellent electric insulation performance, high strength, low hardness, high elasticity and good toughness after being cured, has self-repairing performance and an elongation percentage reaching 200 to 500 percent, has good bonding performance, has shear strength of 2 to 5MPa over aluminum, has little odor, cannot corrode a matrix, adopts solvent oil as the solvent, can effectively insulate and protect the surfaces of printed circuit boards (PCB) and electronic devices, and can also used as other elastic coatings needing insulation performance and anticorrosion performance.

Description

technical field [0001] The invention belongs to the field of organic silicon, in particular to an organic silicon coating and a preparation method thereof. [0002] Background technique [0003] In electronic products, printed circuit boards (i.e. PCB boards) are the main carrier to realize the interconnection between various electronic components. The PCB board is densely covered with conductive lines, and the surface is coated with a solder mask (usually green or brown) and a screen printing surface (ie, the icon surface). During the processing and use of the PCB board, the surface is "three-proof". " and insulation protection are particularly important, and general acrylic resin and polyurethane insulating coatings have poor adhesion to the solder mask layer, high hardness, poor elasticity, and are easy to break, and most of them require medium and high temperature curing or UV curing. In many occasions , especially not suitable for large-scale construction. [0004] W...

Claims

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Application Information

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IPC IPC(8): C09D183/06C09D183/04C09D7/12
Inventor 陶云峰张先银徐燕芬阮开敏方辉陈群跃
Owner CHENGDU TALY TECH CO LTD
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