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High thermal conductivity graphite whisker/copper composite and preparation method thereof

A technology of high thermal conductivity graphite and graphite whiskers is applied in the field of metal matrix composite materials, which can solve the problems of poor interface wettability and poor thermal conductivity of composite materials, and achieve the effects of low production cost, low density and easy processing.

Inactive Publication Date: 2012-07-18
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Studies have shown that when copper and carbon are combined, the thermal conductivity of the composite is poor due to poor interfacial wettability

Method used

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  • High thermal conductivity graphite whisker/copper composite and preparation method thereof
  • High thermal conductivity graphite whisker/copper composite and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Electroless copper plating is used to plate a 1 μm copper layer on the surface of graphite whiskers: First, put graphite whiskers in 20% NaOH solution and boil for 15 minutes, then rinse with distilled water until neutral. Add 20% HNO 3 The solution was boiled for 15 minutes, rinsed with distilled water until neutral. Put the washed graphite whiskers into 20ml / LHCl+20g / LSnCl 2 Stir vigorously in the solution for 15 minutes until the solution is blue-gray, indicating that the reaction is complete. After washing with water, add 20ml / L HCl+0.5g / LPdCl to the graphite whisker 2 The solution was vigorously stirred for 15 minutes, and the reaction was complete when the solution turned light brown. Pour the sensitized and activated graphite whiskers into the copper plating solution. The formula of the solution is copper sulfate pentahydrate 15g / L, potassium sodium tartrate 14g / L, EDTA 19.5g / L, bipyridine 0.02g / L, Potassium ferrocyanide 0.01g / L. And add formaldehyde [w (HCHO...

Embodiment 2

[0027] A molybdenum layer with a thickness of 1.5 μm was coated on the graphite whisker surface by salt bath plating. Graphite whiskers and NaCl / KCl mixed salt with a certain amount of ammonium paramolybdate added were put into a ball mill and mixed for 30 minutes. The molar ratio of NaCl and KCl in the mixed salt was 1:1, and the mass fraction of ammonium paramolybdate in the mixed salt 10%. After mixing evenly, put it into a tube furnace with a protective atmosphere and heat it to 1000°C, keep it warm for 120 minutes and then cool it with the furnace. The coated whiskers are washed with water and then sieved to remove excess impurities to obtain molybdenum-coated graphite whiskers. Using this process, a molybdenum layer with a thickness of 1.5 μm is uniformly plated on the surface of the graphite whisker, and the graphite whisker and the molybdenum layer react to form a molybdenum carbide layer.

[0028] Copper powder with a particle size of 40 μm and molybdenum-coated gra...

Embodiment 3

[0030] A molybdenum layer with a thickness of 1 μm was plated on the surface of graphite whiskers by salt bath plating. Graphite whiskers and NaCl / KCl mixed salt with a certain amount of ammonium paramolybdate added were put into a ball mill and mixed for 30 minutes. The molar ratio of NaCl and KCl in the mixed salt was 1:1, and the mass fraction of ammonium paramolybdate in the mixed salt 10%. After mixing evenly, put it into a tube furnace with a protective atmosphere and heat it to 1000°C, keep it warm for 60 minutes and then cool it with the furnace. The coated whiskers are washed with water and then sieved to remove excess impurities to obtain molybdenum-coated graphite whiskers. Using this process, a molybdenum layer with a thickness of 1 μm is evenly plated on the surface of the graphite whisker, and the graphite whisker and the molybdenum layer react to form a molybdenum carbide layer.

[0031] Copper powder with a particle size of 20 μm and molybdenum-coated graphit...

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Abstract

The invention belongs to the research field of metal matrix composites and relates to a high thermal conductivity graphite whisker / copper composite and a preparation method thereof. The composite comprises two parts, namely matrix pure copper and plated reinforced phase high thermal conductivity graphite whisker, wherein the volume fraction of the pure copper is 40 to 70 percent, and the volume fraction of the plated graphite whisker is 30 to 60 percent. The composite adopts the following production process steps: firstly, the surface of graphite whisker is plated with copper or molybdenum byadopting a chemical plating or salt bath plating method, so as to form a plating with the thickness of 1 to 2 Mum; and secondly, the plated graphite whisker and copper powder are uniformly mixed in the proportion of (30 to 60) to (70 to 40), and then the mixture is sintered at 820 to 980 DEG C by adopting an SPS Spark Plasma Sintering powder metallurgic method, so as to prepare the graphite whisker / copper composite. The invention provides the preparation method of the graphite whisker / copper composite used in the electronic packaging field, and the graphite whisker / copper composite has the advantages of high thermal conductivity, controllable thermal expansion coefficient, high density, easiness in processing and the like, thereby meeting requirements in the modern electronic packaging field.

Description

technical field [0001] The invention belongs to the technical field of metal matrix composite materials, and relates to a preparation method of a high thermal conductivity graphite whisker / copper composite material. Background technique [0002] The development and design of electronic packaging materials has always been an important part of the thermal management of electronic equipment. Modern thermal management requires electronic packaging materials to have high thermal conductivity (TC), low coefficient of expansion (CTE), good processability and low price. Traditional materials such as Cu / Mo, Cu / W, Al / SiC, and AlN are often used in the field of electronic packaging. These materials have certain limitations, such as Cu / Mo, Cu / W density is too high, Al / SiC, AlN Diamond composite materials with high CTE and high thermal conductivity are limited by price and processing performance. [0003] The new generation of graphite whiskers has low thermal expansion coefficient, hig...

Claims

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Application Information

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IPC IPC(8): C22C47/04C22C47/14C22C49/00C22C101/10C22C121/02
Inventor 何新波刘骞张昊明任淑彬吴茂曲选辉
Owner UNIV OF SCI & TECH BEIJING
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