Cutting method of crystal blank

A cutting method and blank technology, which is applied in the field of cutting large-size sapphire crystal blanks, can solve the problems of short service life of saw bands, low crystal size accuracy, poor flatness, etc., and achieve simple cutting process, convenient operation, and reduced costs Effect

Inactive Publication Date: 2012-08-15
徐州协鑫光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inner and outer circular cutting methods use metal discs inlaid with diamond particles on the edge of the blade to cut crystals. The crystals obtained by cutting have low dimensional accuracy, poor flatness, and cannot be cut continuously, and the cutting efficiency is low; Cutting with a metal saw blade that crosses emery. The disadvantages of this cutting method are: low cutting efficiency, poor surface quality of cut crystals, especially for large-sized sapphire crystals, and the metal substrate carrying emery is prone to breakage , the saw band has a short service life and needs to be replaced frequently; while the linear feed cutting method of the diamond wire uses the high-speed reciprocating motion of the diamond wire to realize the cutting of the crystal. It is to place the sapphire crystal blank above the diamond wire and wait for the diamond wire When the wire runs at high speed, the sapphire crystal blank is forced to press

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  • Cutting method of crystal blank
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  • Cutting method of crystal blank

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0039] Example 1

[0040] The specific operation process of 85Kg sapphire crystal ingot cutting is as follows:

[0041] (1) Choose the diamond wire with a diameter of 0.25~0.35mm, adjust the wire wheel, tension wheel and guide wheel of the diamond wire installed on the cutting machine to ensure the uniform distribution of the tension of the diamond wire.

[0042] (2) Preparation of coolant: The coolant is preferably a special cutting fluid for sapphire, which is prepared at a volume ratio of cutting fluid and water 1: (15-30).

[0043] (3) Determine the area to be cut of the sapphire crystal ingot: first rough cut out the C surface of the sapphire crystal ingot, and initially determine the C direction by observing the surface of the sapphire crystal ingot, and mark the cutting position with a marker. Determine the area to be cut.

[0044] (4) Install and fix the sapphire crystal blank: paste the marked sapphire crystal ingot on the workpiece board with AB glue (two-component glue) or Q...

Example Embodiment

[0052] Example 2

[0053] The specific operation process of cutting the end face of sapphire ingot is as follows:

[0054] (1) Choose the diamond wire with a diameter of 0.25~0.35mm, adjust the wire wheel, tension wheel and guide wheel of the diamond wire installed on the cutting machine to ensure the uniform distribution of the tension of the diamond wire.

[0055] (2) Preparation of coolant: The coolant is preferably a special cutting fluid for sapphire, which is prepared in a volume ratio of cutting fluid and water 1: (15-30).

[0056] (3) Determine the end face of the sapphire ingot to be cut: Observe the internal quality of the ingot after the set of rods, determine the available area of ​​the ingot, mark the cutting position with a marker, and determine the end face to be cut.

[0057] (4) Install and fix the sapphire ingot: Paste the marked sapphire ingot on the workpiece board with AB glue (two-component glue) or Q glue, and then fix the workpiece board on the cutting table of t...

Example Embodiment

[0065] Example 3

[0066] The sapphire crystal ingot or crystal remnant after cutting of the crystal rod in the above-mentioned embodiment can be used for processing seed crystals, which improves crystal utilization and reduces processing costs.

[0067] The specific operation process of seed crystal processing is as follows:

[0068] (1) Choose the diamond wire with a diameter of 0.25~0.35mm, adjust the wire wheel, tension wheel and guide wheel of the diamond wire installed on the cutting machine to ensure the uniform distribution of the tension of the diamond wire.

[0069] (2) Preparation of coolant: The coolant is preferably a special cutting fluid for sapphire, which is prepared in a volume ratio of cutting fluid and water 1: (15-30).

[0070] (3) Determine the end face of the seed crystal to be cut: Determine the width of the seed crystal to be cut, mark the cutting position with a marker on the remaining crystal material, and determine the end face to be cut.

[0071] (4) Install ...

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Abstract

The invention relates to a cutting method of a crystal blank. The cutting method comprises the following steps of: determining a cutting position of a sapphire crystal blank, and drawing a labeled line and making a cutting position mark; then, fixedly installing the sapphire crystal blank on a cutting worktable, and adjusting the vertical height of a diamond wire and the sapphire crystal blank; then, cooling the sapphire crystal blank through a cooling fluid, and utilizing the diamond wire to cut the sapphire crystal blank along the labeled line in a swinging manner; and finally, taking down the material of a cutting part. According to the cutting method provided by the invention, a swinging cutting manner of the diamond wire is adopted, so that not only can the cutting efficiency, cutting quality and cutting precision of the crystal blank be improved, but also oddments can be effectively utilized, the utilization ratio of the crystal blank is improved, and the processing cost is lowered.

Description

technical field [0001] The invention relates to a processing method of a crystal blank, in particular to a cutting method of a large-size sapphire crystal blank. Background technique [0002] The molecular formula of colorless sapphire is α-Al 2 o 3 , composed of three oxygen atoms and two aluminum atoms in the form of covalent bonds, its crystal structure is hexagonal crystal structure, sapphire hardness is very high (Mohs hardness level 9), second only to diamond, it is often used There are A-Plane, C-Plane and R-Plane for cutting planes. Sapphire crystal is a unique combination of excellent optical properties, physical properties and chemical properties. Its excellent properties make sapphire crystal an important basic material for modern industry. It is not only used by military infrared devices, missiles, submarines, satellite space technology, detection and In addition to the wide application of cutting-edge technologies such as high-power and strong lasers, it also...

Claims

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Application Information

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IPC IPC(8): B28D5/04
Inventor 拾康谈佳华孙永超田野陈翼
Owner 徐州协鑫光电科技有限公司
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