Cutting method of crystal blank

Abstract

The invention relates to a cutting method of a crystal blank. The cutting method comprises the following steps of: determining a cutting position of a sapphire crystal blank, and drawing a labeled line and making a cutting position mark; then, fixedly installing the sapphire crystal blank on a cutting worktable, and adjusting the vertical height of a diamond wire and the sapphire crystal blank; then, cooling the sapphire crystal blank through a cooling fluid, and utilizing the diamond wire to cut the sapphire crystal blank along the labeled line in a swinging manner; and finally, taking down the material of a cutting part. According to the cutting method provided by the invention, a swinging cutting manner of the diamond wire is adopted, so that not only can the cutting efficiency, cutting quality and cutting precision of the crystal blank be improved, but also oddments can be effectively utilized, the utilization ratio of the crystal blank is improved, and the processing cost is lowered.

Description

technical field [0001] The invention relates to a processing method of a crystal blank, in particular to a cutting method of a large-size sapphire crystal blank. Background technique [0002] The molecular formula of colorless sapphire is α-Al 2 o 3 , composed of three oxygen atoms and two aluminum atoms in the form of covalent bonds, its crystal structure is hexagonal crystal structure, sapphire hardness is very high (Mohs hardness level 9), second only to diamond, it is often used There are A-Plane, C-Plane and R-Plane for cutting planes. Sapphire crystal is a unique combination of excellent optical properties, physical properties and chemical properties. Its excellent properties make sapphire crystal an important basic material for modern industry. It is not only used by military infrared devices, missiles, submarines, satellite space technology, detection and In addition to the wide application of cutting-edge technologies such as high-power and strong lasers, it also...

AI Technical Summary

Problems solved by technology

The inner and outer circular cutting methods use metal discs inlaid with diamond particles on the edge of the blade to cut crystals. The crystals obtained by cutting have low dimensional accuracy, poor flatness, and cannot be cut continuously, and the cutting efficiency is low; Cutting with a metal saw blade that crosses emery. The disadvantages of this cutting method are: low cutting efficiency, poor surface quality of cut crystals, especially for large-sized sapphire crystals, and the metal substrate carrying emery is prone to breakage , the saw band has a short service life and needs to be replaced frequently; while the linear feed cutting method of the diamond wire uses the high-speed reciprocating motion of the diamond wire to realize the cutting of the crystal. It is to place the sapphire crystal blank above the diamond wire and wait for the diamond wire When the wire runs at high speed, the sapphire crystal blank is forced to press the diamond wire, and the high-speed diamond wire rubs against the arc surface of the sapphire crystal blank to start a linear cutting operation. When the diamond wire is cut from one side of the sapphire crystal blank to the other side When the sapphire crystal blank is cut into sapphire wafers, although this diamond wire linear feed cutting method improves the surface quality of the cut crystal, however, when the cylindrical sapphire crystal is half cut, it is different from the initial cut. Compared with time, the diamond wire and the sapphire crystal blank have the largest contact surface due to the wire contact method, and the diamond wire suffers from the largest running resistance, which has a poor cooling effect, and a large amount of heat will be generated during the cutting process. At the same time, when cutting halfway, The diamond wire has the largest stroke and slow cutting, which causes the problem of low cutting efficiency

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