Method for processing metal micro-structure
A technology of microstructure and processing method, applied in microstructure technology, microstructure device, manufacturing microstructure device, etc., can solve the problems of difficulty in releasing structural parts, difficult to fully cover with Parylene filling, and large CMP thinning stress, etc., to avoid Adverse effects, simple release, high repeatability effects
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Embodiment 1
[0033] Embodiment 1: This embodiment prepares micro-gear, and its technological process is as follows figure 2 As shown, the specific description is as follows:
[0034] a) Substrate preparation: use a tungsten sheet with a thickness of 500 μm as the substrate; on the back of the substrate, dry-etch double-sided alignment marks (such as figure 2 The notch on the left side of the back of the substrate in a) and the alignment mark of the blind hole on the back (such as figure 2 shown in the gap on the right side of the back of the substrate in a);
[0035] b) Define the mask pattern on the front of the substrate: first sputter aluminum with a thickness of 1.2 μm on the front of the substrate (the selection ratio of tungsten and aluminum is about 100:1); then throw AZ glue (Anzhi) on the front of the substrate, Perform double-sided alignment photolithography to form a mask pattern. The mask plate used is a glass plate coated with a fine-patterned chrome film on the surface; ...
Embodiment 2
[0041] Embodiment 2: This embodiment prepares tiny gear, and its technological process is as follows image 3 As shown, the specific description is as follows:
[0042] a) Substrate preparation: use a titanium sheet with a thickness of 500 μm as the substrate; on the back of the substrate, dry-etch double-sided alignment marks (such as image 3 The notch on the left side of the back of the substrate in a) and the alignment mark of the blind hole on the back (such as image 3 shown in the gap on the right side of the back of the substrate in a);
[0043] b) Make blind holes on the back: use micro-EDM to form a circular blind hole array with a diameter of 1 cm and a depth of 400 μm on the back of the titanium sheet;
[0044] c) PVD metal layer on the back of the substrate: sputter nickel with a thickness of 0.5 μm on the back of the substrate;
[0045] d) Define the mask pattern on the front of the substrate: coat a layer of SU-8 series negative glue with a thickness of 50 μm...
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Abstract
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