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Polysiloxane curing agent

A polysiloxane and curing agent technology, used in adhesives, electrical solid devices, semiconductor/solid device components, etc., can solve the problems of poor light transmittance, decreased strength, and brittle epoxy resin.

Active Publication Date: 2012-09-12
RUNHE ORGANICSILICONE NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional semiconductor components are packaged with epoxy resin, but yellowing will occur during use, which will make the light transmittance worse. The epoxy resin will become brittle and its strength will decrease after repeated use.
In order to solve the above problems, silicone-modified epoxy resin composition, silica gel, etc. are used as packaging materials for semiconductor elements, which improves the UV and thermal aging resistance. However, with the continuous increase in the power of semiconductor elements, silicone modified The epoxy resin encapsulation material still can not satisfy the requirement of semiconductor components, the introduction of phenyl in the semiconductor encapsulation glue raw material involved in the present invention solves the above problems preferably

Method used

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  • Polysiloxane curing agent
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preparation example Construction

[0032] One, the preparation of polysiloxane A

[0033] The general structural formula that the present invention relates to polysiloxane A is:

[0034]

[0035] where R 1 Is an alkyl group, such as methyl, ethyl, propyl, butyl, etc., preferably methyl; R 2 Is alkyl or alkenyl, such as methyl, vinyl, allyl, butenyl, etc., preferably vinyl; R 3 Aryl, such as phenyl, tolyl, naphthyl, etc., preferably phenyl. a+b+c+d+e=100, a=1~20, b=0~20, c=0~20, d=0~20, e=30~60.

[0036] The preparation method of the present invention relates to polysiloxane A: add catalyst, solvent, end-capping agent, methyl siloxane, methyl vinyl siloxane, phenyl siloxane dropwise while stirring at room temperature or under heating Phenyltrialkoxysilane, after dripping phenyltrialkoxysilane, react at room temperature or under heating for 3~18 hours, stand still, separate the upper layer of acid water, add water to the lower oil phase, wash the oil phase into the middle properties, and then at 150 ° C,...

Embodiment 1

[0044]Put 20g of 30% sulfuric acid, 54g of toluene, 40g of hexamethyldisiloxane, 22g of octamethylcyclotetrasiloxane and 26g of tetramethyltetravinylcyclotetrasiloxane into a four-necked bottle, start stirring, Slowly add phenyltrimethoxysilane dropwise, after dripping 178g of phenyltrimethoxysilane, react at room temperature for 18 hours, stand still, separate the upper layer of acid water, add water to the lower oil phase, and wash the oil phase to neutral , and then at 150 ° C, -0.099Mpa to pull out the low fraction to obtain a colorless and transparent product A1.

Embodiment 2

[0046] Put 25g of 30% sulfuric acid, 107g of toluene, 30g of hexamethyldisiloxane, 88g of dimethyldimethoxysilane and 49g of tetramethyltetravinylcyclotetrasiloxane into a four-necked bottle, and put it under reflux Turn on the stirring tube, start to slowly add phenyltrimethoxysilane dropwise, after dripping 400g of phenyltrimethoxysilane, stir at room temperature for 16 hours, stand still, remove the upper layer of acid water, and wash the lower layer of oil phase with water , wash the oil phase to neutrality, and then pull out the low fraction at 150°C and -0.099Mpa to obtain a colorless and transparent product A2.

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Abstract

The invention relates to a semiconductor packaging adhesive, in particular to a polysiloxane curing agent for the semiconductor packaging adhesive. Each molecule of the polysiloxane curing agent at least contains two hydrogen atoms bonded to silicon and oxysilane of aryl. The curing agent has a structural formula as follows: (R1R4SiO1 / 2) O . (R12SiO2 / 2) p . ( R1R4SiO2 / 2) q . (R3SiO2 / 2) r . (R3SiO3 / 2) s, wherein R1 is alkyl, R3 is aryl, R4 is an H atom or alkyl, o + p + q + r + s is equal to 100, o is 1 to 20, p is 10 to 20, q is 0 to 20, r is 0 to 10, and s is 30 to 60. The organic silicone semiconductor packaging adhesive cured by the product provided by the invention has the characteristics of high refractive index, high light transmittance, high physical strength, resistance to yellowing, and resistance to ultraviolet and thermal aging.

Description

technical field [0001] The invention relates to a semiconductor encapsulation adhesive, in particular to a polysiloxane curing agent for the semiconductor encapsulation adhesive. Background technique [0002] Traditional semiconductor components are packaged with epoxy resin, but yellowing will occur during use, resulting in poor light transmission. The epoxy resin tends to become brittle and its strength decreases during repeated use. In order to solve the above problems, silicone-modified epoxy resin composition, silica gel, etc. are used as packaging materials for semiconductor elements, which improves the UV and thermal aging resistance. However, with the continuous increase in the power of semiconductor elements, silicone modified The epoxy resin encapsulation material still cannot meet the requirements of semiconductor components, and the introduction of phenyl group into the semiconductor encapsulation adhesive raw material involved in the present invention solves the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/12C09J183/07C09J183/05H01L23/29H01L33/56
Inventor 许银根
Owner RUNHE ORGANICSILICONE NEW MATERIAL
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