Preparation process of transparent epoxy nanocomposite material for encapsulating high-power LED (light-emitting diode)

A nanocomposite material and LED packaging technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor compatibility between nanoparticles and polymer matrix, poor compatibility between toughener and epoxy resin, and nanoparticle dispersion. Difficult to solve and other problems, to achieve the effect of good transparency, not easy to crack, and low cost

Inactive Publication Date: 2012-09-19
唐来江
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Problems solved by technology

Therefore, it cannot fundamentally solve the problems of serious light decay of phosphors during use
There are also many problems in the light stability of transparent epoxy resins for LEDs: the traditional method is to use nano-inorganic materials for modification, the compatibility of nanoparticles and polymer matrix is ​​poor, and nanoparticles are in polymers. Dispersion is a

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  • Preparation process of transparent epoxy nanocomposite material for encapsulating high-power LED (light-emitting diode)
  • Preparation process of transparent epoxy nanocomposite material for encapsulating high-power LED (light-emitting diode)
  • Preparation process of transparent epoxy nanocomposite material for encapsulating high-power LED (light-emitting diode)

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments:

[0031] like figure 1 , 2 , 3 and 4: a preparation process of a transparent epoxy nanocomposite material for high-power LED packaging, comprising the following steps:

[0032] 1) Using epichlorohydrin as a raw material to add an acidic catalyst to carry out ring-opening polymerization;

[0033] 2) Add alkali to the reaction system of step 1) to carry out the closing reaction;

[0034] 3) Extracting, filtering, drying, distilling and vacuuming the solution obtained in step 2) to obtain a long-chain linear glycidyl ether epoxy resin, that is, an active toughening agent;

[0035] 4) Mix the above active toughening agent with transparent epoxy at high speed to obtain the required toughening agent, namely component A;

[0036] 5) Mix the amino-terminated polyether curing agent and isophorone diamine to obtain a mixed solution;

[0037] 6) Add o-...

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Abstract

The invention discloses a preparation process of a transparent epoxy nanocomposite material for encapsulating a high-power LED (light-emitting diode). The process comprises the following steps that epichlorohydrin is used as a raw material, an acid catalyst is added to carry out ring opening polymerization reaction, alkali is added to carry out closure reaction, and extraction and other processes are carried out to obtain a flexibilizer; amine terminated polyether curing agent and isophorone diamine are mixed, and ortho-hydroxy diphenyl ketone, benzotriazole ultraviolet vapor, hindered amine light stabilizer are added to carry out concerted reaction with nano SiO2 to obtain the required curing agent; ethanol and zinc acetate are mixed and distilled to obtain residual fractions; the residual fractions are mixed with an ethanol solution of lithium hydrate to obtain an ethanol solution of ZnO-QD, and tetraethoxysilane and ammonia water are added for centrifugation and drying to obtain ZnO-QD/SiO2; and the components are mixed and then mechanically dispersed, vacuumized, defoamed, poured and cured to obtain a ZnO-QD/SiO2/epoxy encapsulating material.

Description

technical field [0001] The invention relates to a preparation method of a lighting encapsulation material, in particular to a preparation process of a transparent epoxy nano-composite material for high-power LED encapsulation. Background technique [0002] With the promotion of semiconductor energy-saving and environmentally friendly lighting projects, the general lighting market has a huge demand for high-brightness LED devices. Replacing traditional lighting sources such as incandescent and fluorescent lamps with LED solid-state lamps has become the future development goal of this century. Therefore, the research on the most important packaging materials in the LED industry has also become the focus of research at home and abroad. [0003] Both at home and abroad are scrambling to carry out research on LED lighting. However, in the field of LED packaging materials for white lighting, although foreign research work has made progress, large-scale industrialization has not ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/50C08K13/02C08K3/22C08K3/36H01L33/56
Inventor 唐来江
Owner 唐来江
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