Preparation process of transparent epoxy nanocomposite material for encapsulating high-power LED (light-emitting diode)

Abstract

The invention discloses a preparation process of a transparent epoxy nanocomposite material for encapsulating a high-power LED (light-emitting diode). The process comprises the following steps that epichlorohydrin is used as a raw material, an acid catalyst is added to carry out ring opening polymerization reaction, alkali is added to carry out closure reaction, and extraction and other processes are carried out to obtain a flexibilizer; amine terminated polyether curing agent and isophorone diamine are mixed, and ortho-hydroxy diphenyl ketone, benzotriazole ultraviolet vapor, hindered amine light stabilizer are added to carry out concerted reaction with nano SiO2 to obtain the required curing agent; ethanol and zinc acetate are mixed and distilled to obtain residual fractions; the residual fractions are mixed with an ethanol solution of lithium hydrate to obtain an ethanol solution of ZnO-QD, and tetraethoxysilane and ammonia water are added for centrifugation and drying to obtain ZnO-QD / SiO2; and the components are mixed and then mechanically dispersed, vacuumized, defoamed, poured and cured to obtain a ZnO-QD / SiO2 / epoxy encapsulating material.

Description

technical field [0001] The invention relates to a preparation method of a lighting encapsulation material, in particular to a preparation process of a transparent epoxy nano-composite material for high-power LED encapsulation. Background technique [0002] With the promotion of semiconductor energy-saving and environmentally friendly lighting projects, the general lighting market has a huge demand for high-brightness LED devices. Replacing traditional lighting sources such as incandescent and fluorescent lamps with LED solid-state lamps has become the future development goal of this century. Therefore, the research on the most important packaging materials in the LED industry has also become the focus of research at home and abroad. [0003] Both at home and abroad are scrambling to carry out research on LED lighting. However, in the field of LED packaging materials for white lighting, although foreign research work has made progress, large-scale industrialization has not ...

AI Technical Summary

Problems solved by technology

Therefore, it cannot fundamentally solve the problems of serious light decay of phosphors during use

There are also many problems in the light stability of transparent epoxy resins for LEDs: the traditional method is to use nano-inorganic materials for modification, the compatibility of nanoparticles and polymer matrix is ​​poor, and nanoparticles are in polymers. Dispersion is also very difficult to achieve

There are many types of toughening agents to choose from, such as carboxyl-terminated nitrile rubber, polybutyl acrylate, liquid polysulfide rubber, etc., but the traditional toughening agent has poor compatibility with epoxy resin, and the transparency after toughening modification Significantly lower and cannot be applied to LED packaging materials

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