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High thermal conductivity membrane adhesive, adhesive composition and semiconductor package using the adhesive and manufacturing method thereof

A high thermal conductivity and adhesive technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as insufficient adhesion of the attached body, and achieve excellent adhesion and wear rate. The effect of small size and excellent thermal conductivity

Active Publication Date: 2012-09-19
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the film adhesive described in Patent Document 3 has high thermal conductivity and insulating properties, it still has insufficient adhesion to the substrate.

Method used

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  • High thermal conductivity membrane adhesive, adhesive composition and semiconductor package using the adhesive and manufacturing method thereof
  • High thermal conductivity membrane adhesive, adhesive composition and semiconductor package using the adhesive and manufacturing method thereof
  • High thermal conductivity membrane adhesive, adhesive composition and semiconductor package using the adhesive and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0121] First, weigh 55 parts by mass of triphenylmethane-type epoxy resin (trade name: EPPN-501H, weight average molecular weight: 1000, softening point: 55°C, solid, epoxy equivalent: 167, manufactured by Nippon Kayaku Co., Ltd.) , Bisphenol A type epoxy resin (trade name: YD-128, weight average molecular weight: 400, softening point: 25° C. or less, liquid, epoxy equivalent: 190, manufactured by Nichika Epoxy Co., Ltd.) 49 parts by mass , and 30 parts by mass of bisphenol A / F type phenoxy resin (trade name: YP-70, weight average molecular weight: 55000, Tg: 70°C, manufactured by Nichika Epoxy Co., Ltd.), and 91 parts by mass of formazan Using methyl isobutyl ketone (MIBK) as a solvent, heating and stirring at a temperature of 110° C. for 2 hours in a 500 ml separable flask was carried out to obtain a resin varnish. Then, 225 parts by mass of this resin varnish was moved to an 800ml planetary mixer, and aluminum nitride (trade name: H-Grade, average particle diameter 1.1 μm, ...

Embodiment 2

[0123] In addition to changing the amount of aluminum nitride (trade name: H-Grade, average particle size 1.1 μm, Mohs hardness 8, thermal conductivity 200W / (m·K), manufactured by Tokuyama Co., Ltd.) to 489 parts by mass, The rest were performed in the same manner as in Example 1 to obtain a film-like adhesive. The same measurement as in Example 1 was performed on the obtained film adhesive. The obtained results are shown in Table 1 together with the composition of the film adhesive.

Embodiment 3

[0125] In addition to changing the amount of aluminum nitride (trade name: H-Grade, average particle size 1.1 μm, Mohs hardness 8, thermal conductivity 200W / (m·K), manufactured by Tokuyama Co., Ltd.) to 267 parts by mass, The rest were performed in the same manner as in Example 1 to obtain a film adhesive. The same measurement as in Example 1 was performed on the obtained film adhesive. The obtained results are shown in Table 1 together with the composition of the film adhesive.

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Abstract

The invention provides a high thermal conductivity membrane adhesive, an adhesive composition and a semiconductor package using the adhesive and a manufacturing method thereof. The high thermal conductivity membrane adhesive composition is characterized by including epoxy resin (A), an epoxy hardener (B), an inorganic filler (C) and phenoxy resin (D). The inorganic filler (C) meets all the flowing conditions of (i)-(iii) and the content of the inorganic filler (C) is 30-70 volume%: (i) a mean grain size being 0.1-5.0 [mu] m; (ii) moh 's hardness being 1-8; (iii) thermal conductivity being above 30 w / (m.k).

Description

technical field [0001] The present invention relates to a composition for a highly thermally conductive film adhesive, a highly thermally conductive film adhesive, a semiconductor package using the highly thermally conductive film adhesive, and a method for producing the same. Background technique [0002] In recent years, the miniaturization and high performance of electronic equipment are progressing, and the performance of the semiconductor package mounted therein is also progressing, and the processing speed of the semiconductor element inside the semiconductor package is further increased. However, as the processing speed increases, heat tends to be generated on the surface of the semiconductor device, and the generated heat causes problems such as a reduction in the operating speed of the semiconductor device or failure of electronic equipment. [0003] In order to eliminate these adverse effects due to heat, thermal conductivity to discharge generated heat to the outs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J7/00H01L21/58H01L23/31
CPCH01L2224/92247H01L2224/83191H01L2924/10253H01L2224/73265H01L2224/48227H01L2224/32225H01L24/73H01L2924/00H01L2924/00012C09J7/22C09J7/30C09J7/35C09J11/04C09J163/00C09J2203/326C09J2301/40C09J2301/408C09J2301/50H01L21/02002H01L21/6836
Inventor 森田稔切替徳之矢野博之徳光明
Owner FURUKAWA ELECTRIC CO LTD
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