Cathode electrode foil for electrolytic capacitor and manufacturing method thereof
A technology of electrolytic capacitors and cathode electrodes, applied in electrolytic capacitors, capacitors, circuits, etc., to achieve the effects of increased strength and toughness, small contact resistance, and good stability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0032] This embodiment provides a cathode electrode foil, which is composed of aluminum foil and a functional material layer formed on the surface of the aluminum foil, and is prepared by the following steps:
[0033] (1) Provide aluminum foil with a thickness of 30μm;
[0034] (2) Mix 55% by weight of phenolic resin, 10% by weight of silver powder (maximum particle size of less than 2μm), and 35% by weight of graphite (average particle size of 1μm), add an appropriate amount of butyl acetate into a ball mill to disperse and debond. After filling, check and adjust to prepare a paste that can be applied. The slurry was applied to the upper and lower surfaces of the aluminum foil and dried. After drying, the thickness of the coating film was about 2.5 μm on one side.
[0035] (3) The aluminum foil formed with the coating film obtained in step (2) is placed in a nitrogen-filled protective atmosphere furnace, heated to 550° C., and kept for 2 hours to obtain the cathode electrode foil o...
Embodiment 2
[0037] This embodiment provides a cathode electrode foil, which is composed of copper foil and a functional material layer formed on the surface of the copper foil, and is prepared by the following steps:
[0038] (1) Provide copper foil with a thickness of 30μm;
[0039] (2) Mix 55% by weight of phenolic resin, 10% by weight of silver powder (maximum particle size of less than 2μm), and 35% by weight of graphite (average particle size of 1μm), add an appropriate amount of butyl acetate into a ball mill to disperse and debond. After filling, check and adjust to prepare a paste that can be applied. The slurry was applied to the upper and lower sides of the copper foil and dried. After drying, the thickness of the coating film was approximately 2.5 μm on one side.
[0040] (3) The copper foil formed with the coating film obtained in step (2) is placed in a nitrogen-filled protective atmosphere furnace, heated to 1250°C, and kept for 2 hours to obtain the cathode electrode foil of this...
Embodiment 3
[0042] This embodiment provides a cathode electrode foil, which is composed of aluminum foil and a functional material layer formed on the surface of the aluminum foil, and is prepared by the following steps:
[0043] (1) Provide copper foil with a thickness of 30μm;
[0044] (2) Mix well 55% by weight of phenolic resin, 10% by weight of nickel powder (maximum particle size of less than 2μm), and 35% by weight of graphite (average particle size of 1μm), add an appropriate amount of butyl acetate into a ball mill to disperse and debond. After discharging, inspect and adjust to prepare a slurry that can be coated. The slurry was applied to the upper and lower sides of the copper foil and dried. After drying, the thickness of the coating film was approximately 2.5 μm on one side.
[0045] (3) The copper foil formed with the coating film obtained in step (2) is placed in a nitrogen-filled protective atmosphere furnace, heated to 550° C., and kept for 2 hours to obtain the cathode electr...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| particle diameter | aaaaa | aaaaa |
| particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com
