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Polyimide resin composition, adhesive agent and laminate each comprising same, and device

A polyimide resin, polyimide technology, applied in the direction of synthetic resin layered products, adhesives, semiconductor devices, etc., can solve the problem of low adhesion of inorganic substrates

Inactive Publication Date: 2012-10-03
MITSUI CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polyimide-based adhesives have a problem of low adhesion to inorganic substrates such as silicon, ceramics, and metals.

Method used

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  • Polyimide resin composition, adhesive agent and laminate each comprising same, and device
  • Polyimide resin composition, adhesive agent and laminate each comprising same, and device
  • Polyimide resin composition, adhesive agent and laminate each comprising same, and device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0105] The method for synthesizing such a block copolymer is not particularly limited, and includes, for example, the methods 1) and 2) below.

[0106]Method 1): As the first step, polysiloxane diamine (B) is reacted with excess aromatic tetracarboxylic dianhydride (D) to obtain the first imide block (imide block b1) . As a second step, diamines other than polysiloxane diamine (B) are further added to the solution containing the obtained first imide block, and diamines other than polysiloxane diamine (B) and The second imide block (imide block b2) obtained from the aromatic tetracarboxylic dianhydride (D) is connected to both ends of the first imide block to obtain a block copolymer.

[0107] Method 2): Polysiloxane diamine (B) is reacted with aromatic tetracarboxylic dianhydride (D) in a predetermined solvent to synthesize a compound containing the first imide block (imide block b1). solution; in a prescribed solvent, diamines other than polysiloxane diamine (B) are reacted...

Embodiment 1

[0190] Preparation of polyimide varnish

[0191] In a solvent prepared by NMP and mesitylene at a ratio of 7 / 3, four kinds of diamines (APB, 1-Si, 14EL, XTJ-542) and one acid dianhydride (s-BPDA) were mixed with APB: 1-Si: 14EL: XTJ-542: s-BPDA = 0.49: 0.1: 0.2: 0.21: 1.0 was blended in a molar ratio. The resulting mixture was stirred for more than 4 hours in a flask capable of introducing dry nitrogen to obtain a polyamic acid solution having a resin solid content of 20 to 25% by weight. After fully stirring, heat the reaction system to about 180°C while stirring in a flask with a Dean-Stark tube, and discharge the water produced by the dehydration reaction to the outside of the system. This gives a polyimide varnish. The viscosity that the polyimide varnish of gained is measured at 25 ℃ by E-type viscometer is 8.0 * 10 3 mPa s.

[0192] Membrane production

[0193] The obtained polyimide varnish solution was coated on the release-treated PET film at a rate of 10 mm / sec. ...

Embodiment 2

[0195] Four kinds of diamines (APB, 1-Si, 14EL, XTJ-542) and acid dianhydride (s-BPDA) with APB: 1-Si: 14EL: XTJ-542: s-BPDA = 0.29: 0.3: 0.2: A polyimide varnish was produced in the same manner as in Example 1 except that the molar ratio of 0.21:1.0 was mixed. The viscosity that the polyimide varnish of gained is measured at 25 ℃ by E-type viscometer is 5.0 * 10 3 mPa s. A polyimide film was produced from the obtained polyimide varnish in the same manner as in Example 1.

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Abstract

A polyimide resin composition containing a polyimide produced by fusing a diamine component comprising an aromatic diamine (A) represented by general formula (1-1) or the like, a silicone diamine (B) represented by general formula (2) and an aliphatic diamine (C) represented by general formula (3) to an acid anhydride component comprising a specific aromatic tetracarboxylic acid dianhydride (D); a laminate produced using the polyimide resin composition; and a device.

Description

technical field [0001] The present invention relates to a polyimide resin composition, an adhesive containing the composition, a laminate, and a device. Background technique [0002] Conventionally, polyamide-imide-based and polyamide-based hot-melt adhesives (see Patent Document 1), polyimide-based adhesives ( Refer to Patent Document 2) and thermosetting polyimide-based adhesives (see Patent Documents 3 and 4). However, the adhesive of Patent Document 1 is not suitable as an adhesive for electronic applications requiring reliability because the amide group has high hydrophilicity and high water absorption. In addition, since the adhesives of Patent Documents 2 to 4 are standard thermocompression bonding conditions of 275°C and 50kgf / cm 2 , 30 minutes, so it is not suitable for electronic parts that are sensitive to heat and pressure, and applications that require mass production. [0003] On the other hand, epoxy-based, phenol-based, and acrylic-based adhesives have the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10B32B9/00C08K3/00C08L79/08C09J179/08H01L23/14H05K1/03
CPCC08G73/1046C08G73/105H05K3/305H01L23/296C08L83/10H01L2224/32225C08G73/1042B32B27/281C08L79/08H01L2224/16225H05K2201/09036H05K2201/0154H01L2924/15311H01L2924/10253H05K2201/10515H01L2224/73204H05K3/285H05K2201/10674H05K2201/10537C08G77/455H01L2924/07811B32B27/34C08G73/1082C08G73/106H01L2224/48227H01L2924/3025Y10T428/24942Y02P70/50H01L2924/00012H01L2924/00C08G73/10B32B9/00C09J179/08
Inventor 饭田健二今川清水富田裕介
Owner MITSUI CHEM INC
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