Large-area contact type machining device for fused quartz by plasma discharge machining
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HARBIN INST OF TECH
- Publication Date
- 2012-10-17
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a plasma processing device under atmospheric pressure, in particular to a device for large-area plasma processing of fused quartz through a radio frequency power supply. Background technique
[0002] Fused silica is an amorphous (glassy) state of silicon oxide and is a typical glass. It is mainly used in industries such as precision casting, glass ceramics, refractory materials and electronic appliances. With good uniformity and radiation resistance, it is widely used in high-energy laser windows, aerospace, microelectronics and other optical fields. Currently, large-area processing is less efficient due to the properties of fused silica combined with high demands on precision components. The processing methods for high-precision fused silica surfaces are divided into two categories, grinding and polishing. Grinding has high processing efficiency, but it usually causes damage to the surface and sub-surface metamorphic layers,...