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Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached

A technology of dust-proof film components and dust-proof film, which is applied to the original parts for photomechanical processing, photoplate process of pattern surface, optics, etc., to improve light resistance, reduce film thickness, and maintain exposure quality Effect

Inactive Publication Date: 2014-02-05
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, before the problem occurs, the method of replacing the dustproof film has to be adopted.

Method used

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  • Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached
  • Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached
  • Dustproof pellicle film, manufacturing method thereof, and dustproof pellicle component with pellicle film attached

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] Such as Figure 4 The pellicle frame 41 made of A5052 aluminum alloy having the shape shown is produced by machining. The shape of the dust-proof membrane module frame 41 is that the outer dimension of each corner is 1146x1392mm, the inner dimension is a rectangle of 1124x1370mm, and the thickness is 5.8mm. The shape of each corner is R2 inside and R6 outside. In addition, four concave holes 43 with a diameter of 2.5 mm and a depth of 2 mm are provided on the long side for processing, and grooves 42 with a height of 2 mm and a depth of 3 mm are provided at two places on the short side and the long side. Further, on both long sides, 8 vent holes 46 with a diameter of 1.5 mm are provided.

[0078] The pellicle frame was transported into a class 10 clean room, washed well with a surfactant and pure water, and dried. Then, one end face of the pellicle frame is provided with a silicone adhesive layer as the pellicle adhesive layer 45, and the other end face is used as the ...

Embodiment 2

[0085] Same as in Example 1, an A5052 aluminum alloy dust-proof film module frame with an outer dimension of 280×280, an inner dimension of 270×270, and a height of 4.8 mm was produced, and the process was carried out in a class 10 clean room with surfactants and pure water. Rinse well and dry completely. Thereafter, on one end face, a silicone adhesive (trade name: X-40-3004A, manufactured by Shin-Etsu Chemical Co., Ltd.) layer as an adhesive layer attached to a photomask was provided, and on the other end face, as an adhesive layer for the present invention. The adhesive for bonding the dustproof film is coated with a silicone adhesive (trade name: KR3700, manufactured by Shin-Etsu Chemical Co., Ltd.), and cured by heating in an oven. Then, a release sheet obtained by coating a 150-μm-thick PET film with fluorine-modified silicone was cut into a frame shape having almost the same outer dimension as the frame, and attached to the above-mentioned adhesive layer.

[0086] Next...

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Abstract

PURPOSE: A pellicle film, a manufacturing method of the same, and a pellicle with the same are provided to improve exposure quality and throughput by being used under higher exposure intensity. CONSTITUTION: A pellicle film(15) for a pellicle which is used for a lithography process irradiating ultraviolet rays of a wavelength range between 350nm and 450 nm. The pellicle film includes an ultraviolet ray absorbent layer(22) on at least the surface of a raw pellicle film toward exposure light source. An anti-reflective layer is further arranged on the ultraviolet ray absorbent layer. A binding resin for the ultraviolet ray absorbent layer is a silicon resin.

Description

technical field [0001] The present invention relates to a pellicle used as a dustproof material in the manufacture of semiconductor devices, IC packages, printed substrates, liquid crystal displays, organic EL displays, etc. 405nm) or g-line (436nm), or a pellicle used in ultraviolet photolithography in which they are combined, its manufacturing method, and a pellicle assembly that is tightly attached to the film. Background technique [0002] In the manufacture of semiconductors such as LSI and super LSI, IC packages, circuit boards such as printed circuit boards, liquid crystal displays, and organic EL displays, photoresist is placed on the surface of semiconductor wafers, packaging substrates, or original boards for displays, and then, with The patterned photomask is developed by shining light on it to create the pattern. If there is dust on the photomask or reticle (hereinafter referred to as photomask) used at this time, the dust absorbs light or bends light, so that t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/48G03F1/46
CPCG03F1/22G03F1/38G03F1/62G03F1/64G03F7/70916
Inventor 関原一敏
Owner SHIN ETSU CHEM IND CO LTD