Adhesive tape for protecting surface of semiconductor wafer

A technology for semiconductors and wafers, applied in the field of tapes for surface protection of semiconductor wafers, can solve problems such as edge cracks and wafer breakage, and achieve the effects of reducing drop errors and warping

Active Publication Date: 2012-10-24
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Furthermore, when the adhesive sheet for processing a semiconductor wafer of Patent Document 3 is bonded to a semiconductor wafer on which a polyimide film is formed, and the back surface of the semiconductor wafer is ground, although the wafer with the adhesive sheet is conveyed There is no problem in terms of , but in the case of grinding a semiconductor wafer to a thin film with a thickness of 50 μm or less, edge cracks or wafer breakage may sometimes occur

Method used

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  • Adhesive tape for protecting surface of semiconductor wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0136] With respect to 100 parts by weight of an acrylic copolymer having a weight-average molecular weight of 800,000 each having a radiation-curable carbon-carbon double bond-containing group, a hydroxyl group-containing group, and a carboxyl group-containing group, the mixed adduct-based isocyanate-based crosslinking agent Coronate 1 mass part of L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) and 3 mass parts of photopolymerization initiator Irgacure 184 (trade name, manufactured by Ciba Japan Co., Ltd.) were adjusted with ethyl acetate to prepare an adhesive composition.

[0137] In addition, with respect to 100 parts by mass of an acrylic copolymer (acid value 10, hydroxyl value 2) containing n-butyl methacrylate as the main component and other components having hydroxyl and carboxyl groups, the adduct-based isocyanate 2 parts by mass of a crosslinking agent Coronate L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) and 2 parts by mass of an epox...

Embodiment 2

[0149] With respect to 100 parts by mass of an acrylic copolymer having a weight average molecular weight of 800,000 each having a radiation-curable carbon-carbon double bond-containing group, a hydroxyl group-containing group, and a carboxyl group-containing group, the adduct-based isocyanate crosslinking agent Coronate L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) and 3 parts by mass of photopolymerization initiator Irgacure 184 (trade name, manufactured by Ciba Japan Co., Ltd.) were adjusted with ethyl acetate to prepare an adhesive composition.

[0150] In addition, with respect to 100 parts by mass of an acrylic copolymer (acid value 11, hydroxyl value 3) having n-butyl methacrylate as the main component and other components having hydroxyl and carboxyl groups, the adduct-based isocyanate 1 part by mass of the crosslinking agent Coronate L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) and 2 parts by mass of the epoxy-based crosslinking agent T...

Embodiment 3

[0154] With respect to 100 parts by mass of an acrylic copolymer having a weight average molecular weight of 800,000 each having a radiation-curable carbon-carbon double bond-containing group, a hydroxyl group-containing group, and a carboxyl group-containing group, the adduct-based isocyanate crosslinking agent Coronate L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) and 3 parts by mass of photopolymerization initiator Irgacure 184 (trade name, manufactured by Ciba Japan Co., Ltd.) were adjusted with ethyl acetate to prepare an adhesive composition.

[0155] In addition, an isocyanate crosslinking agent TKA-100 (trade name, manufactured by Asahi Kasei Chemical Co., Ltd.) was mixed with respect to 100 parts by mass of an acrylic copolymer (hydroxyl value: 35) having n-butyl methacrylate as one of its constituents and having a hydroxyl group. 12 parts by mass, the concentration was adjusted with ethyl acetate to prepare an intermediate resin layer composition.

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Abstract

An adhesive tape for protecting the surface of a semiconductor wafer comprises a substrate resin film and an adhesive layer directly on the substrate resin film with an intermediate resin layer, in which base resin components containing an acrylic polymer and / or polyurethane acrylate are cross-linked, interposed therebetween. The repulsion coefficient (?) obtained by dividing repulsion force (a) per unit width, which is found from the load of loop stiffness obtained by measuring the adhesive tape for protecting the surface of the semiconductor wafer under a specific condition, by the square of the thickness (ss) of a substrate is 100 mN / mm3 or more, the repulsion force (a) is 13 mN / mm or less, and the difference between tensile fracture elongations in a longitudinal direction and a lateral direction is 35% or less.

Description

technical field [0001] The present invention relates to an adhesive tape (adhesive tape) for protecting the surface of a semiconductor wafer. In more detail, it is related with the tape for semiconductor wafer surface protections used when grinding a semiconductor wafer into a thin film. Background technique [0002] The semiconductor package is manufactured by slicing high-purity single crystal silicon to obtain a semiconductor wafer, and then forming an integrated circuit on the surface of the wafer by ion implantation, etching, or the like, thereby manufacturing the semiconductor package. The semiconductor wafer can be made into a desired thickness by grinding, polishing, or the like on the back surface of the semiconductor wafer on which the integrated circuit is formed. At this time, in order to protect the integrated circuit formed on the surface of the semiconductor wafer, the tape for semiconductor wafer surface protection is used. After the backside grinding is co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683C09J5/02C09J7/02C09J133/00H01L21/304C09J7/20
CPCC08G18/6229H01L21/6836C09J133/00C09J2433/003C09J2203/326C09J2467/006H01L2221/6834C09J2475/003C08G18/6254C09J7/02C09J2433/00C09J7/20H01L21/683C09J5/02H01L21/304
Inventor 横井启时冈祥文矢野正三
Owner FURUKAWA ELECTRIC CO LTD
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