Thermal-conductive silicone grease with high thermal conductivity and high temperature resistance and preparation method thereof

A technology of thermal conductive silicone grease and high thermal conductivity, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of poor thermal conductivity, high price, short molecular chain diffusivity, etc., to improve heat dissipation efficiency and prolong service life The effect of longevity

Inactive Publication Date: 2012-10-31
邵成芬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For two-component thermal conductive silicone grease, since the base oil used is a reactive base oil, because it is a two-component package, it must be prepared and used immediately, and it is often cross-linked and cured in a short time after coating. It brings a lot of inconvenience to the site construction and later maintenance
[0004] For the one-component thermal conductive silicone grease, since the base oil used is non-reactive base oil, the viscosity is generally low, the molecular chain is short and the diffusion rate is large, and the crawling phenomenon is serious. During long-term use, the base oil and Thermally conducti

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0020] Example 1

[0021] Prepare nano-modified thermal conductive filler first: put the inorganic filler-aluminum powder into the reaction kettle, add nano-silver powder according to 20% of its weight and stir; then add hexamethyldisilazane, dimethyldiethyl, purified water to Mix it into a solution with a ratio of 1:3:10, and then adjust the solution to pH 5 with concentrated sodium hydroxide to obtain a colorless and transparent solution; then spray the transparent solution in the reaction kettle according to 5% of the weight of the inorganic filler, and fully Stir evenly, filter, evaporate, vacuum-dry, and bake at 150°C for 1 hour to prepare a nano-aluminum powder-modified thermally conductive filler containing 20% ​​silver and treated by surface nano-modification, for use as a spare;

[0022] Then select according to the following formula (parts by mass): 60 kg of the above-mentioned nano-aluminum powder modified thermally conductive filler, 30 kg of amino polysiloxane as ...

Example Embodiment

[0024] Example 2

[0025] Prepare nano-modified thermal conductive filler first: put inorganic filler-zinc powder into the reaction kettle, add nano-silver powder according to 35% of its weight and stir; then add hexamethyldisilazane, dimethyldiethyl, purified water in molar ratio Mix 1:5:15 to form a solution, then use concentrated sodium hydroxide to adjust the solution to pH 7 to obtain a colorless and transparent solution; then spray 10% of the weight of the inorganic filler into the reaction kettle to add the transparent solution, and stir well Evenly, after filtering, evaporating, vacuum drying, and roasting at 165°C for 2 hours, a nano-modified zinc powder thermal conductive filler containing 35% silver and treated by surface nano-modification is prepared for use as a spare;

[0026] Then select according to the following formula (parts by mass): 80 kg of the above-mentioned nano-modified zinc powder thermally conductive filler, 15 kg of hydroxyl polysiloxane as polysil...

Example Embodiment

[0028] Example 3

[0029] Prepare nano-modified thermal conductive filler first: put inorganic filler-oxide into the reaction kettle, add nano-silver powder according to 50% of its weight and stir; then add hexamethyldisilazane, dimethyldiethyl, and purified water in molar ratio Mix 1:4:12.5 to form a solution, then use concentrated sodium hydroxide to adjust the solution to pH 6 to obtain a colorless and transparent solution; then spray the transparent solution into the reaction kettle according to 7.5% of the weight of the inorganic filler, and stir thoroughly Evenly, after filtering, evaporating, vacuum drying, and roasting at 180°C for 3 hours, a nano-modified oxide heat-conducting filler containing 50% silver and treated by surface nano-modification is prepared for use;

[0030] Then select according to the following formula (parts by mass): 70 kg of the above-mentioned nano-modified oxide thermally conductive filler, 15 kg of phenylpolysiloxane as polysiloxane, 5 kg of d...

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Abstract

Disclosed is a thermal-conductive silicone grease with high thermal conductivity and high temperature resistance. The silicone grease comprises, by weight, 60 to 80% of nano modified conductive filler, 15% to 30% of polysiloxane, 1% to 20% of silicone oil and 1% to 5% of additives. The nano modified conductive filler is an inorganic filler through silver powder surface modification treatment; the polysiloxane is an active silicone oil compound; the silicone oil is one or two of dimethyl modified silicone oil and benzyl modified silicone oil; and the additives are one or more of sodium hexametaphosphate, trisodium phosphate and sodium tripolyphosphate. According to the thermal-conductive silicone grease with high thermal conductivity and high temperature resistance, oanoscale conductive filler coated silver powder is the filler, and the prepared thermal-conductive silicone grease with high thermal conductivity and high temperature resistance is not dried, hardened or melted at a temperature of 300 DEG C or even more than 320 DEG C for a long time, had no flavor or odor, and has no corrosiveness to metals of iron, copper, aluminum and the like. The thermal-conductive silicone grease with high thermal conductivity and high temperature resistance has the advantages of being capable of prolonging the service life, being insulating, shockproof, radiation aging resistant and the like, and accelerating the heat conduction speed of electrical devices and improving radiation efficiency.

Description

【Technical field】 [0001] The invention relates to a high thermal conductivity, high temperature resistant thermal conductive silicone grease and a preparation method thereof. 【Background technique】 [0002] With the development of modern technology, electronic products are becoming more dense, miniaturized and efficient. Because it generates a lot of heat energy during use (that is, heat accumulation problem) will directly affect its reliability and service life. Using a heat sink with better thermal conductivity can reduce the thermal resistance to the environment and keep the internal temperature from being much higher than the ambient temperature, but this requires a higher cost. In addition, the unavoidable problem is that when the heat sink is used for a period of time, dust is deposited on the heat sink of the lamp body shell, and the dielectric layer connected to the copper layer substrate on the aluminum alloy-based copper-clad plate is aged and debonded, which will...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/08C08L83/06C08L83/05C08L83/07C09K5/14C08K13/06C08K9/06C08K3/08C08K3/20C08K3/28C08K3/34C08K3/32
Inventor 邵成芬
Owner 邵成芬
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