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Heat-conducting silicon rubber composite material and preparation method thereof

A technology of heat-conducting silicone rubber and composite materials, which is applied in the field of silicone rubber materials, can solve the problem that the thermal conductivity of heat-conducting silicone rubber has not been improved, and achieve the effect of reducing the coefficient of thermal expansion, enhancing the coefficient of thermal conductivity, and the method is simple and easy to implement

Active Publication Date: 2012-10-31
HEFEI GENIUS NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese Invention Patent (Application No. 200910040823.6) discloses a method for preparing a filled heat-conducting silicone rubber composite material using carbon-coated copper nanoparticles as a heat-conducting filler. This method is similar to the preparation method in the previous patent, except that the filler becomes carbon Copper-coated nanoparticles, but the thermal conductivity of the thermally conductive silicone rubber obtained by this method has not improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] (1) Pretreated thermally conductive filler: After drying 40 parts of alumina and 39 parts of silicon carbide at 100°C for 4 hours, put them into the high mixer, start the high mixer, and slowly drop them from the small hole on the top of the high mixer 1 part of coupling agent A-151, after the dropwise addition is completed, stir for 30 minutes to obtain alumina and silicon carbide coated with the coupling agent, and set aside;

[0037] (2) Add 15 parts of VMQ-0.03% to the roller, add raw rubber after wrapping the roller, 0.05 parts of hydroxyl silicone oil, 2.35 parts of precipitated silica, the pretreated thermally conductive filler obtained in step (1); on the roller Repeated mixing evenly, thin pass 4 to 7 times.

[0038] (3) Add 0.1 part of vulcanizing agent Shuang25 and 2.5 parts of carbon nanotubes, and then knead evenly, and thinly pass the lower sheet to obtain a silicone rubber compound.

[0039] (4) Put the kneaded silicone rubber into the mold, and after fi...

Embodiment 2

[0044] (1) Pretreated thermally conductive filler: After drying 40 parts of alumina and 31 parts of silicon carbide at 100°C for 4 hours, put the thermally conductive filler into the high-mixer, start the high-mixer, and remove the heat from the small hole on the high-mixer Slowly add 0.8 parts of coupling agent A-151 dropwise, stir for 30 minutes after the dropwise addition is completed, and set aside;

[0045] (2) Add 15 parts of VMQ-0.03% and 5 parts of VMQ-0.05% to the roller, after wrapping the roller with raw rubber, 0.08 part of hydroxyl silicone oil, 4 parts of fumed silica, the pretreatment heat conduction obtained in step (1) Filler; knead repeatedly on the rollers evenly, thin pass 4 to 7 times.

[0046] (3) Add 0.12 parts of vulcanizing agent Shuang25 and 4 parts of carbon nanotubes, then knead evenly, and thinly pass the next sheet to obtain a silicone rubber compound.

[0047] (4) Put the kneaded silicone rubber into the mold, and after filling the mold with col...

Embodiment 3

[0052] (1) Pretreated thermally conductive filler: After drying 40 parts of alumina and 25 parts of silicon carbide at 100°C for 4 hours, put the thermally conductive filler into the high-mixer, start the high-mixer, and start the high-mixer from the small hole on the high-mixer Slowly add 0.6 parts of coupling agent A-151 dropwise, stir for 30 minutes after the dropwise addition is completed, and set aside;

[0053](2) Add 25 parts of VMQ-0.05% to the roller, after the raw rubber wraps the roller, 0.1 part of hydroxyl silicone oil, 4.65 parts of fumed silica, the pretreatment thermally conductive filler obtained in step (1); repeatedly on the roller Mix evenly, thin pass 4 to 7 times.

[0054] (3) Add 0.15 parts of vulcanizing agent Shuang25 and 4.5 parts of carbon nanotubes, then knead evenly, and thinly pass the lower sheet to obtain a silicone rubber compound.

[0055] (4) Put the kneaded silicone rubber into the mold, and after filling the mold with cold pressure, place ...

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Abstract

The invention belongs to the technical field of silicon rubber materials and discloses a heat-conducting silicon rubber composite material and a preparation method thereof. The heat-conducting silicon rubber composite material comprises the following components by weight: 15 to 25 parts of high-temperature vulcanized silicon rubber raw rubber, 65 to 79 parts of heat-conducting filler, 2.5 to 4.5 parts of carbon nanotube, 0.05 to 0.1 part of hydroxyl silicon oil, 0.1 to 0.15 part of vulcanizing agent, 2 to 5 parts of white carbon black and 0.6 to 1 part of coupling agent. The invention further discloses the preparation method for the heat-conducting silicon rubber composite material. The heat-conducting silicon rubber composite material can effectively transfer heat, reduces the thermal expansion coefficient of the material and effectively prevents invasion of dust, water and the like on electronic devices. The method is simple and practical and the filler is easy to treat.

Description

technical field [0001] The invention belongs to the technical field of silicone rubber materials, and in particular relates to a heat-conducting silicone rubber composite material and a preparation method thereof. Background technique [0002] Silicone rubber is a special synthetic rubber with silicon-oxygen bonds as the main chain. Its special structure determines that it has high and low temperature resistance, ozone resistance, radiation resistance, weather resistance and excellent chemical inertness to lubricating oil and other media. In addition, it also has a wide application range from -50°C to 300°C, and has good elasticity, but the thermal conductivity of silicone rubber as a filler is poor, and its thermal conductivity can be improved by filling with thermally conductive fillers. Thermally conductive materials are widely used in aviation, aerospace, electronics, electrical, automotive and other fields that require heat dissipation and heat transfer. With the advanc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/06C08K13/06C08K3/34C08K3/22C08K3/36C08K7/00C08K3/04C08K5/14
Inventor 郭雪晴
Owner HEFEI GENIUS NEW MATERIALS
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