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Organosilicone modified phenolic aldehyde injection molding material and preparation method thereof

A silicone and injection molding technology, which is applied in the field of organic silicon modified phenolic injection molding and its preparation, can solve the problems of inability to improve the heat resistance and storage stability of injection molding, high production costs, and limitations in application fields, and achieve Improved water absorption and weather resistance, long storage time, and good fluidity

Active Publication Date: 2012-11-07
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The U.S. patent with publication number US 6664343B2 discloses a preparation method of a phenolic composite material, its main component includes more than 70% thermoplastic phenolic resin, plus a certain amount of silicone rubber component and curing agent, its curing speed is fast , good moisture resistance, but due to the large amount of silicone rubber and phenolic resin used as raw materials, its production cost is high and its application field is limited
[0005] The Chinese patent whose publication number is CN 101270219B discloses a kind of rubber toughened phenolic injection molding, and its weight composition is: rubber toughened phenolic resin 30~45%, curing agent 5~10%, organic fiber 20~30%, mineral powder 10-30% plasticizer, 0.5-5% plasticizer, 0.5-5% co-curing agent, 0-1% colorant, in which the rubber is evenly dispersed in the resin to play the role of internal toughening, with fast curing rate and flow Good properties, but this treatment does not improve the heat resistance and storage stability of injection molding materials

Method used

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  • Organosilicone modified phenolic aldehyde injection molding material and preparation method thereof
  • Organosilicone modified phenolic aldehyde injection molding material and preparation method thereof
  • Organosilicone modified phenolic aldehyde injection molding material and preparation method thereof

Examples

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preparation example 1

[0043] (1) Preparation of organosilicon modifier: Add eugenol (164kg, 1000mol) and 15g of chloroplatinic acid into the synthesis reaction kettle, stir and heat up to about 60°C, and add 1,1,3,3-tetramethyldisilazol Oxygen (67kg, 500mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction was carried out until the end of the heating phenomenon and then continued for 2-3 hours to obtain the organosilicon modifier with a yield of 93% , the structural formula and nuclear magnetic spectrum of the organosilicon modifier are as follows figure 1 shown.

[0044] (2) Preparation of organosilicon-modified thermoplastic phenolic resin: Add 80 kg of phenol and 10 kg of organosilicon modifier prepared by the above method into the synthesis reaction kettle, heat up and stir, add an appropriate amount of oxalic acid to adjust the pH<2, and the temperature rises to about 85°C Add dropwise 45 kg of formaldehyde solution with a mass perc...

preparation example 2

[0047] (1) Preparation of organosilicon modifier: Add eugenol (82kg, 500mol) and 9g of chloroplatinic acid into the synthesis reaction kettle, stir and heat up to about 60°C, and add 1,1,3,3-tetramethyldisilica Oxane (33.5kg, 250mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction was carried out until the end of the temperature rise phenomenon and continued for 2-3 hours to obtain an organosilicon modifier with a yield of 94 %.

[0048] (2) Preparation of organosilicon-modified thermoplastic phenolic resin: add 100kg of phenol and 10kg of organosilicon modifier prepared by the above method to the synthesis reaction kettle, add oxalic acid to adjust the pH of the system to about 2, heat up and stir, and the temperature rises to about 85°C, drop 55kg of 37% formaldehyde solution by mass and keep it warm for 2 hours until the system becomes turbid, then vacuumize and dehydrate under reduced pressure under heating, sto...

preparation example 3

[0051] (1) Preparation of organosilicon modifier: Add 2-allylphenol (133kg, 1000mol) and 15g of chloroplatinic acid into the synthesis reaction kettle, stir and heat up to about 60°C, and mix 1,1,3,3-tetra Methyldisiloxane (67kg, 500mol) was added dropwise into the reactor in batches to keep the temperature not higher than 80°C, and the reaction continued for 2-3 hours after the end of the temperature rise phenomenon, and the organosilicon modifier was obtained. Yield 91%.

[0052] (2) Preparation of organosilicon-modified thermoplastic phenolic resin: Add 80kg of phenol and 10kg of organosilicon modifier prepared by the above method into the synthesis reaction kettle, add oxalic acid to adjust the pH of the system to about 2, heat up and stir, and the temperature rises to about Add 45 kg of formaldehyde solution with a mass percentage of 37% dropwise at 85°C, keep it warm for 2 hours until the system becomes turbid, then vacuumize and dehydrate the system under heating until ...

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Abstract

The invention discloses an organosilicone modified phenolic aldehyde injection molding material and a preparation method of the organosilicone modified phenolic aldehyde injection molding material. The phenolic aldehyde injection molding material comprises, by weight, of 40-70% of organosilicone modified thermoplastic phenolic resin, 5-30% of wood flour, 10-30% of packing material, 0.5-2% of release agent, 0.25-1.5% of coloring agent, 2.5-15% of curing agent and 0.25-5% of auxiliary curing agent. The organosilicone modified phenolic aldehyde injection molding material is prepared by mixing, smashing or pelleting the components. The phenolic aldehyde injection molding material is long in storage time, not apt to become damp, excellent in weather fastness, small in relative density and low in cost of production, and solidified materials are excellent in toughness and heat resistance. Plastic parts made of the organosilicone modified phenolic aldehyde injection molding material has the advantages of being good in toughness, small in relative density, high in volume mass resistivity and excellent in heat resistance.

Description

technical field [0001] The invention relates to the field of phenolic injection molding materials, in particular to an organosilicon-modified phenolic injection molding molding material and a preparation method thereof. Background technique [0002] Phenolic injection molding is a thermosetting plastic material prepared mainly from thermoplastic phenolic resin and other fillers. It has the characteristics of low price, excellent mechanical properties, good insulation performance, and easy and quick molding. It is widely used in military industry, electrical components, instruments, and buildings. and other fields. However, this type of material also has defects such as brittleness, difficulty in storage, and limited heat resistance. [0003] The U.S. patent with the publication number US 6838509B2 discloses a phenolic molding compound. The heat resistance and mechanical strength of the material are improved by adding organic clay, but at the same time, the loss of productio...

Claims

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Application Information

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IPC IPC(8): C08L61/14C08L97/02C08K13/02C08G8/28
Inventor 范宏李诚卜志扬李伯耿
Owner ZHEJIANG UNIV
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