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Choline-chloride-based chemical tinning solution and application method thereof

A technology of choline chloride and electroless tin plating, which is applied in the field of tin plating, can solve the problems of increasing waste liquid treatment costs and increasing costs, and achieve the effects of eliminating potential safety hazards, high wettability and solderability, and low cost

Inactive Publication Date: 2012-11-28
CHANGZHOU UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The traditional electroless tin plating method, or the high working temperature, needs to provide more energy; or there are many types of additives, which increases the cost; or uses a high concentration of reducing agent sodium hypophosphite, which increases the treatment cost of waste liquid

Method used

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  • Choline-chloride-based chemical tinning solution and application method thereof
  • Choline-chloride-based chemical tinning solution and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The preparation of embodiment 1 1L electroless tin plating solution

[0027] Get 500ml of choline chloride and deionized water according to the mixed solvent of molar ratio 1:8 configuration, add stannous chloride and be 40g, thiourea 150g, after dissolving, use choline chloride and water mixed solvent (molar ratio 1:8 ) to 1L. The electroless tin plating process using the electroless tin plating solution of the present invention is: first the copper substrate is placed in a 60°C degreasing solution (NaOH 10g / L, NaOH 2 CO 3 20g / L, Na 3 PO 4 12H 2 O 5g / L, OP-10 emulsifier 1g / L), washed with water after 1min; then placed in microetching solution at room temperature (H 2 SO 4 90ml / L), wash with water after 1min to remove the oxide film on the surface of the copper substrate; place the pretreated copper substrate in the electroless tin plating solution of the present invention at 40°C for 10min, then wash with water, and immediately remove the surface water traces,...

Embodiment 2

[0029] Embodiment 2 Preparation of 1L electroless tin plating solution

[0030] Get 500ml choline chloride and deionized water according to the mixed solvent of molar ratio 1:2 configuration, add stannous chloride and be 5g, thiourea 50g, after dissolving, use choline chloride and water mixed solvent (molar ratio 1:2 ) to 1L. See embodiment 1 for the electroless tin plating operation process. The results of coating thickness are listed in Table 1.

[0031]

Embodiment 3

[0032] Embodiment 3 Preparation of 1L electroless tin plating solution

[0033] Taking the test of its weldability as an example, comparing it with a copper rod of the same specification, and explaining its preparation method. The formula and operating process of electroless tin plating are shown in Example 1; in this example, a copper rod is used as the base material, and the results of the solderability of the coating are listed in Table 1.

[0034]

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Abstract

The invention discloses a choline-chloride-based chemical tinning solution and an application method thereof, belonging to the technical field of tinning. The choline-chloride-based chemical tinning solution comprises choline chloride, water, 5-40g / L tin salt, 50-150g / L complexing agent and a right amount of acidity regulator, wherein the mol ratio of choline chloride to water is 1:2-1:8. The invention also discloses a tinning technique based on the chemical tinning solution, which comprises the following steps: 1) pretreating a copper workpiece to be plated; 2) putting the pretreated copper workpiece into the choline chloride chemical tinning solution to carry out tinning; and 3) drying the tinned workpiece, and inspecting the finished product. The choline chloride chemical tinning water solution disclosed by the invention has the advantages of simple formula and components, high preparation convenience and easily operated technique, does not need strongly-corrosive acid, and can implement continuous deposition.

Description

[0001] technical field [0002] The invention relates to an electroless tin plating solution and a using method thereof, in particular to an electroless tin plating solution based on choline chloride and a using method thereof, belonging to the technical field of tin plating. Background technique [0003] In the production process of printed circuit boards (PCBs) for electronic products, the traditional method mostly uses the hot air leveling process (HASL), commonly known as "spray tin", spraying a layer of solder on the surface of the copper substrate to ensure that the PCB is in the assembly process. Electronic components have good solderability and other characteristics. [0004] In recent years, with the enhancement of people's awareness of environmental protection, environmental protection regulations have become more and more perfect and strict. Although tin-lead solder has excellent wettability, solderability, good mechanical properties and low price, lead and its co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/52
Inventor 王钰蓉何嘉伟王文昌陈智栋
Owner CHANGZHOU UNIV
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