Control device and method for gas pressure in silver slurry curing oven

Abstract

The invention provides a control device for gas pressure in a silver slurry curing oven. The control device is provided with a pneumatic automatic air door, a manual negative pressure adjusting valve, a manual positive pressure adjusting valve, a main exhausting pipeline, a secondary exhausting pipeline, a drying oven, a temperature sensor and the like, wherein the drying oven is connected with the main exhausting pipeline; the secondary exhausting pipeline is connected to an intermediate section of the main exhausting pipeline; the pneumatic automatic air door and the manual negative pressure adjusting valve are arranged in the main exhausting pipeline; the manual positive pressure adjusting valve is arranged in the secondary exhausting pipeline; the temperature sensor is connected onto the drying oven; and a micropressure measuring meter is connected onto the main exhausting pipeline. When the control device disclosed by the invention is in use and the temperature of the drying oven is smaller than XDEGC, the pneumatic automatic air door is controlled to be opened by the temperature sensor through an automatic control device; and when the temperature of the drying oven is greater than the XDEGC, the pneumatic automatic air door is closed and residual glue volatile is discharged through the secondary exhausting pipeline. According to the control device disclosed by the invention, the problems of oxidation and contamination of the device in the glue curing process are solved, the bonding quality is improved and the service life of the device is prolonged. The control device can be widely applied to the packaging industry of electronic products.

Description

technical field [0001] The invention relates to a bonding device in the microelectronic assembly industry and a method for controlling the gas pressure inside an oven. Background technique [0002] In the process of semiconductor packaging process, the connection (bonding) between the chip and the lead frame is connected by gold wire, silver wire or copper wire welding or glue connection. 2 Solder joints or bondlines are cured in a protected oven. where N 2 (Nitrogen) flow is set and controlled depending on the size of the oven, and the curing temperature and curing time are determined by the type and amount of welding or bonding. The requirements for the curing process are: fully curing, ensuring the connection strength between the chip and the frame, and reducing the resistance of the connection layer; preventing the surface oxidation of the frame and chip, and contamination by glue volatiles, which not only ensures the connection strength, but also improves the reliabil...

AI Technical Summary

Problems solved by technology

The intelligent oven of the present invention is used for curing and drying the coating fabric slurry after coating and scraping. The inside of the oven is connected to the atmosphere and is not in a closed environment. The internal equipment is easy to oxidize and corrode, and the bonding strength is low, so it is not suitable for the bonding of precision devices such as electronic products. Curing use

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