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Method for preparing compound conductive layer on surface of epoxy resin

A composite conductive layer and epoxy resin technology, applied in the plating, coating, metal material coating process of superimposed layers, etc., can solve the problems of low heat resistance and poor aging resistance of polyethylene, and achieve excellent performance. , smoothness enhancement, the effect of enhancing conductivity

Inactive Publication Date: 2012-12-05
CHANGCHUN FAWAY ADIENT AUTOMOTIVE SYST CO LTD
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AI Technical Summary

Problems solved by technology

The base material is polyethylene, but polyethylene has poor aging resistance and low heat resistance.

Method used

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Embodiment Construction

[0017] The steps of the method of the present invention are as follows:

[0018] (1) Stress removal: The presence of stress on the specimen will affect the bonding force between the substrate and the coating. The stress detection method of plastic parts adopts the acetic acid immersion method, that is, the specimen is completely immersed in glacial acetic acid at about 24°C for 30 seconds, and immediately after taking it out Clean and dry, check the surface of the test piece; carefully check the appearance, if a small and dense crack is found somewhere, it means that there is stress in the test piece at this place; in the present invention, the epoxy resin is mixed in an acetone aqueous solution with a volume ratio of 25%. Soak for 30 minutes to remove the surface stress of the specimen;

[0019] (2), degreasing: the formula of degreasing agent is sodium carbonate 10-20g / L, sodium phosphate 10-20g / L, sodium silicate 10-20g / L, 2-3g / L emulsifier OP-10, Use a degreasing agent to...

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Abstract

The invention discloses a method for preparing a compound conductive layer on the surface of epoxy resin. The silver-nickel compound conductive layer is formed on the surface of the epoxy resin by chemical silver plating and nickel electroplating. The method comprises the steps as follows: 1, carrying out chemical silver plating, wherein the chemical silver plating process comprises the following concrete sub-steps of removing stress, removing oil, roughening, neutralizing, reducing, sensitizing and chemically plating silver, and forming a conductive silver layer on the surface of the epoxy resin; and 2, carrying out nickel electroplating on the epoxy resin with the conductive silver layer to obtain the silver-nickel conductive layer on the surface of the epoxy resin at last. Compared with the conventional chemical plating, the used time of the compound conductive layer prepared by the method is greatly shortened and the obtained compound conductive layer has the characteristics of bright and flat surface and strong bonding force; in addition, the nickel has the advantages of corrosion resistance and good conductivity, and the epoxy resin as a basis material has the advantages of high mechanical property, good process property and excellent chemical drug resistance, so that the usability of the whole material is greatly enhanced.

Description

technical field [0001] The invention belongs to the technical field of new material surface coatings, and in particular relates to a method for forming a silver-nickel composite conductive layer on the surface of epoxy resin by means of electroless silver plating and electroplating nickel. Background technique [0002] With the development of modern science and technology, plastics, glass, ceramics and other non-metallic materials are more and more widely used in production and life. Using these materials can save metal, reduce production costs, and increase labor productivity. However, due to the defects of non-metallic materials such as non-conductivity, poor thermal conductivity, poor wear resistance, easy deformation, and unsightly appearance, they cannot meet some special requirements for use, which limits their scope of use. Sometimes in order to meet the special requirements of some products, metal can be plated on the surface of non-metallic materials. Through this...

Claims

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Application Information

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IPC IPC(8): C23C28/02C23C18/44C25D3/12
Inventor 孙军王守军安慧董娟姚卫国方程管东波付涛
Owner CHANGCHUN FAWAY ADIENT AUTOMOTIVE SYST CO LTD
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