Silver-plated copper powder and preparation method thereof

A silver-plated copper powder and copper powder technology, applied in the chemical field, can solve the problems of difficulty in forming a continuous plating layer, fast chemical plating reaction speed, and easy failure and decomposition of the plating solution, and achieve excellent electromagnetic shielding performance, good economic effect, and energy saving. Effect of precious metal silver material

Inactive Publication Date: 2012-12-12
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, the nucleation of silver particles on the copper surface is relatively slow, and it is difficult to form a continuous coating, resulting in loose coating; the other method is to use redox reactions, using reducing agents such as formaldehyde and hydrazine hydrate, to reduce silver ions from the plating solution. come out to form a silver layer. Although this method can obtain a continuous covering coating, the stability of the plating solution is poor, the plating solution is prone to failure and decomposition, and the chemical plating reaction speed is fast, which is not easy to control

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Weigh 50g of copper powder, clean it with degreasing agent, and then rinse it with distilled water. Add the copper powder to 50ml of sulfuric acid solution with a concentration of 5% by mass, and stir magnetically for 5 minutes to remove oxides on the surface of the copper powder; wash and filter with distilled water; then add 10g / L 100ml sodium lauryl sulfate solution to the Disperse in copper powder, add 100g / L 50ml reducing agent solution under electromagnetic stirring condition (the mass ratio of tartaric acid to glucose is 5:4); , ethylenediamine 2ml), react for 30 minutes to reduce the dense silver-plated layer on the surface of the copper powder; after the reaction is completed, the copper powder with the silver-plated layer is washed with water, cleaned and centrifugally filtered in a vacuum drying oven at 60 ° C to 80 ° C Drying at a lower temperature will give silver-plated copper powder with a silver content of 5%.

Embodiment 2

[0031] Weigh 50g of copper powder, clean it with degreasing agent, and then rinse it with distilled water. Add copper powder to 50ml of sulfuric acid solution with a concentration of 5% by mass, stir magnetically for 5 minutes to remove oxides on the surface of copper powder; rinse with distilled water and filter; then add 20g / L 80ml polyethylene glycol solution to copper powder Medium dispersion, under the condition of combined ultrasonic and mechanical stirring, add 100g / L 80ml reducing agent solution (tartaric acid); Tetramine 5ml), reacted for 40 minutes to reduce a dense silver-plated layer on the surface of copper powder; after the reaction was completed, it was washed with water, cleaned and centrifugally filtered in a vacuum drying oven, and dried at 60°C to 80°C to obtain a silver content of 10°C. % silver-plated copper powder.

Embodiment 3

[0033] Weigh 50g of copper powder, clean it with degreasing agent, and then rinse it with distilled water. Add copper powder to 40ml of hydrochloric acid solution with a concentration of 5% by mass, and stir magnetically for 5 minutes to remove oxides on the surface of copper powder; rinse with distilled water and suction filter; then add 20g / L 50ml polyethylene glycol solution to copper powder Add 100g / L 100ml reducing agent solution under mechanical stirring conditions (the mass ratio of tartaric acid to glucose is 1:2); add slowly dropwise 200ml of silver nitrate complex solution under mechanical stirring conditions (including 14g of silver nitrate, ethylene di Amine 3.5ml), reacted for 40 minutes to reduce the dense silver-plated layer on the surface of copper powder; after the reaction was completed, it was washed with water, cleaned and centrifugally filtered in a vacuum drying oven, and dried at 60 ° C to 80 ° C to obtain a silver content of 15 % silver-plated copper po...

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Abstract

The invention relates to silver-plated copper powder and a preparation method thereof; the powder comprises the following raw materials by the percentage of the raw materials in the total weight: 5 percent to 30 percent of silver, and the balance of copper. According to the invention, a method for replacing and reducing composite plating silver by copper powder is adopted, the prepared silver-plated copper powder has good coating performance, strong oxidation resistance and low volume resistivity, and can be widely applied to various electromagnetic shielding fillers, conductive adhesives and conducting coatings.

Description

technical field [0001] The invention relates to a silver-plated copper powder and a preparation method thereof, belonging to the chemical field. Background technique [0002] With the development of integrated circuit packaging technology, high-performance conductive adhesives are gradually replacing solder as the main connecting material. At present, silver-based conductive adhesives are widely used, but silver is prone to migration under the action of DC bias, resulting in short circuits. , greatly reducing the safety factor of the application. In the field of electromagnetic shielding materials and conductive coatings, silver-plated copper powder is gradually replacing pure silver powder and becoming the main filler in this field due to its stable conductivity, low resistivity, and low price. [0003] At present, there are two commonly used chemical methods for preparing silver-plated copper powder: one is to use the potential difference between copper and silver, use co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C18/44
Inventor 宋曰海王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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