Texture surface making treatment method for silicon wafer
A processing method and technology of silicon wafers, applied in the direction of final product manufacturing, sustainable manufacturing/processing, electrical components, etc., can solve the problems of reducing production efficiency and achieve the effect of avoiding leakage
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
example 1
[0074] 1) Use Cl 2 , SF 6 , O 2 , Ar and other gases to etch the surface of the silicon wafer. At the same time, the ratio of various gases can be controlled, such as image 3 As shown in (a), an acicular suede structure with a depth h of 1 μm and a width w of 0.3 μm is formed, and the apex of the acicular suede is sharp.
[0075] 2) Hydrophobic treatment is performed on the bottom of the needle-like suede structure.
[0076] Next, the silicon wafer is immersed in hexane, and after taking it out, it is centrifugally dried at a speed below 1500RPM, such as image 3 As shown in (b), hexane remains at the bottom of the needle-like suede structure.
[0077] 3) supplying an etchant to the surface of the silicon wafer to cause a corrosion reaction on the upper portion of the needle-shaped textured structure to passivate the upper portion of the needle-shaped textured structure.
[0078] Firstly, the mixed solution of ammonia water and hydrogen peroxide is sprayed on the surface...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com