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Horizontal pre-treatment method for improving copper exposing at bottom of blind drilling hole in soft gold electroplating

A technology of hole bottom and copper exposure, which is applied in the direction of electrical connection formation of printed components, can solve the problems of poor potion filling ability, copper exposure, blind drilling copper exposure, etc., to improve the poor copper exposure at the bottom of the hole. And the process is simple, the effect of improving the process ability

Active Publication Date: 2012-12-19
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0003] Electroplating soft gold is the process of first plating nickel on the copper surface, and then plating pure gold on the nickel surface. However, the electroplating nickel gold solution usually only considers electroplating the surface, and the hole filling ability of the solution is usually not good. Due to the impact of the blind drilling, the nickel-gold plating in the hole will not be plated with nickel-gold, resulting in copper exposure. Since the customer has a tinning requirement for the hole, blind drilling cannot produce copper-exposed defects. Otherwise, there will be defects of poor tinning

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Example 1 A method for improving the horizontal pre-treatment of copper exposed at the bottom of the hole when the blind drilled hole is electroplated with soft gold, the steps are:

[0018] (1) Sand blasting: use deionized water to prepare Al with a mass concentration of 10% 2 o 3 Suspension; under 10Bar pressure, with the configured Al 2 o 3 The suspension of the blind drilling workpiece to be processed is sandblasted for 30~40 seconds;

[0019] (2) High-pressure water washing: Wash the blind-drilled workpiece after sandblasting with high-pressure water at a pressure of 10 Bar for 10 seconds;

[0020] (3) Micro-etching: Use hydrogen peroxide with a mass concentration of 1.5%, heat it to 30°C, and perform spray pressure micro-etching on the blind drilled workpiece; the micro-etching amount is 20 microinches, the spray pressure is 0.8kg / cm, and the treatment time is 40 seconds;

[0021] (4) Composite water washing: The blind drilled workpiece after micro-etching is...

Embodiment 2

[0025] Embodiment 2 A method for improving the horizontal pre-treatment of copper exposed at the bottom of the hole when the blind drilled hole is electroplated with soft gold, the steps are:

[0026] (1) Sand blasting: use deionized water to prepare Al with a mass concentration of 15% 2 o 3 Suspension; under 15Bar pressure, with the configured Al 2 o 3 Sandblast the blind drilling workpiece to be processed for 35 seconds with suspension liquid;

[0027] (2) High-pressure water washing: wash the blind-drilled workpiece after sandblasting with high-pressure water at a pressure of 15 Bar for 15 seconds;

[0028] (3) Micro-etching: use hydrogen peroxide with a mass concentration of 2.5%, heat it to 35°C, and perform spray pressure micro-etching on the blind drilled workpiece; 35 seconds;

[0029] (4) Composite water washing: The blind drilled workpiece after micro-etching is subjected to composite water washing; the washing pressure is 1.5kg / cm, the water inflow is 5L / min, a...

Embodiment 3

[0033] Embodiment 3 A method for improving the horizontal pretreatment of copper exposed at the bottom of the hole when the blind drilled hole is electroplated with soft gold, the steps are:

[0034] (1) Sand blasting: use deionized water to prepare Al with a mass concentration of 20% 2 o 3 Suspension; under 20Bar pressure, with the configured Al 2 o 3 The suspension of the blind drilling workpiece to be processed is sandblasted for 30 seconds;

[0035] (2) High-pressure water washing: Wash the blind-drilled workpiece after sandblasting for 10 seconds with high-pressure water at a pressure of 20 Bar;

[0036] (3) Micro-etching: Use hydrogen peroxide with a mass concentration of 3.5%, heat it to 35°C, and perform spray pressure micro-etching on the blind drilled workpiece; the micro-etch volume is 40 microinches, the spray pressure is 1.2kg / cm, and the treatment time is 30 seconds;

[0037] (4) Composite water washing: The blind drilled workpiece after micro-etching is sub...

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Abstract

The invention provides a horizontal pre-treatment method for improving copper exposing at the bottom of a blind drilling hole in soft gold electroplating, which is mainly used for the products required to perform soft gold electroplating on the blind drilling holes, and belongs to the technical field of surface treatment. The method comprises the following steps of performing micro-coarsening on a copper surface in the hole by utilizing a way of mixing Al2O3 with water and a mechanical method, and performing fretting corrosion on the copper surface by utilizing hydrogen peroxide micro-corrosion, thus, the roughness of the copper surface by utilizing the polishing-like function of the hydrogen peroxide micro-corrosion is reduced, and the wettability of medical liquid on the copper surface in the hole is improved. As the horizontal pre-treatment process of a blind drilling plate is optimized, the disadvantage that the copper is exposed at the bottom of the blind drilling hole is improved, the process capability is improved, and both the method and the flow are very easy.

Description

technical field [0001] The invention discloses a horizontal pretreatment method for improving copper exposed at the bottom of a blind drilled hole when electroplating soft gold, which is mainly applied to products requiring soft gold electroplating for blind drilled holes, and belongs to the technical field of surface treatment. Background technique [0002] In the Printed circuit board (hereinafter referred to as PCB) industry, due to functional requirements, it is necessary to design blind holes on the product for the dual functions of fixing and tinning. In some blind drilling products, blind drilling needs to be electroplated Soft gold to achieve wire bonding performance at the same time. [0003] Electroplating soft gold is the process of first plating nickel on the copper surface, and then plating pure gold on the nickel surface. However, the electroplating nickel gold solution usually only considers electroplating the surface, and the hole filling ability of the solut...

Claims

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Application Information

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IPC IPC(8): H05K3/42
Inventor 张子超
Owner GULTECH WUXI ELECTRONICS CO LTD
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