Ring varistor and preparation method thereof
A piezoresistor and ring-shaped technology, which is applied in the direction of resistors, resistance manufacturing, non-adjustable metal resistors, etc., can solve the problem that the mechanical strength and flexural strength of ring-shaped piezoresistors are reduced, and the mechanical strength of ring-shaped piezoresistors cannot meet the requirements. To meet the actual needs and other issues, to achieve the effect of improving mechanical strength and simple operation
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no. 1 approach
[0038] According to the first embodiment of the present invention, the manufacturing method of the ring varistor includes the following steps:
[0039] Step 1. Mix zinc oxide, cobalt oxide, manganese carbonate and silicon dioxide at a molar ratio of 95:3:1.5:0.5. The spray-dried powder is dry pressed to prepare the ring varistor Porcelain blank
[0040] Step 2. Debinding the porcelain blank prepared in step 1 at 600°C;
[0041] Step 3. The debinding porcelain blank prepared in step 2 is sintered in the air at 1300°C to form a ceramic substrate;
[0042] Step 4. Use a screen printing process to make a glass paste prepared by weight ratio of 70% B-Bi-Si glass powder, 3% ethyl cellulose, 15% terpineol, and 12% dibutyl citrate The screen is printed on the ring resistor body and dried at 150°C. In the screen printing process, a pattern with a specific shape is used to cover the surface of the annular resistor, so that the glass paste cannot print the position of the annular resistor for ...
Embodiment 2
[0052] Figure 4 Shown is a schematic structural diagram of a ring varistor made according to the second embodiment of the present invention, which includes a ring resistor 10, electrodes 20 distributed on the upper end surface of the ring resistor 10, and distributed on the lower end surface of the ring resistor 10 The glass paste 30.
[0053] Compared with the first embodiment of the present invention, the second embodiment of the present invention is different in that: the arrangement of the annular resistor 10 and the electrode 20 is different; the distribution position of the glass paste 30 is different; the glass paste is screen-printed The sintering temperature of the annular resistor body is 650° C., and other preparation processes are the same as the first embodiment of the present invention, and will not be repeated.
[0054] According to experimental testing, the bending strength comparisons of the ring varistors of various sizes prepared according to the second embodime...
Embodiment 3
[0060] Figure 5 Shown is a schematic structural view of a ring varistor made according to the third embodiment of the present invention, which includes a ring resistor body 10, electrodes 20 distributed on the upper end surface of the ring resistor body 10, and distributed on the lower end surface of the ring resistor body 10 And the glass paste 30 on the outer side.
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