Encapsulation material with high barrier properties
A packaging material and base material technology, applied in the direction of photovoltaic power generation, electrical components, circuits, etc., can solve the problems of device function degradation, insufficient function, insufficient moisture resistance, etc., and achieve the effect of reduced packaging width and excellent effect
Active Publication Date: 2016-07-13
MORESCO
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Problems solved by technology
However, devices using organic thin films have problems in that they deteriorate due to moisture, oxygen, etc., and the functions of the devices decrease, thereby reducing the lifespan.
In the case of larger fillers such as figure 2 As shown, the filler is randomly dispersed in the matrix, and the effect of inhibiting the permeation of moisture or gas is not sufficient
In addition, regarding the filler size, it is described in paragraph [0009] of Patent Document 1 that moisture resistance becomes insufficient when the average particle diameter is less than 5 μm.
Method used
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[0025] In the present invention, as the matrix polymer, as long as it has good affinity with the sheet-shaped inorganic compound, epoxy resins, modified epoxy resins, polyurethane resins, polycarbonate resins, polycarbonate resins, etc. Acrylate resin, modified olefin resin, polyester resin, etc.
[0026] Examples of the epoxy resin include epoxy resins such as bisphenol A type, bisphenol F type, novolac type, alicyclic type, glycidylamine type, hydrogenated bisphenol A type, and the like. In addition, examples of modified epoxy resins include acrylic modified epoxy resins, polybutadiene-based modified epoxy resins, graft modified epoxy resins, silylated polyepoxy resins, and the like. The epoxy resin is preferably used together with a curing accelerator, a photoradical polymerization initiator, and the like.
[0027] Examples of the polyurethane resin include polyol-based polyurethane resins, polyisocyanate-based polyurethane resins, polyether-based polyurethane resins, poly...
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Abstract
The present invention provides an encapsulating material composition for organic devices capable of sufficiently suppressing intrusion of moisture, oxygen, etc. from the outside, and an encapsulating material for organic devices having high barrier properties obtained by subjecting the composition to a crosslinking reaction. Provided are an encapsulating material composition for an organic device obtained by laminarly dispersing a sheet-like inorganic compound in a matrix polymer, and an encapsulating material for an organic device obtained by subjecting the encapsulating material composition to a crosslinking reaction.
Description
technical field [0001] The invention relates to a packaging material composition for organic devices and a packaging material with high barrier properties for organic devices obtained by subjecting the composition to a cross-linking reaction. Background technique [0002] In recent years, as devices using organic thin films, for example, photosensors, organic memory elements, display elements, organic transistors, organic thin-film solar cells, organic semiconductor elements, communication elements, etc., are attracting attention. For example, an organic thin-film solar cell is an organic device in which an organic substance is laminated in a thin film on an electrode by evaporation or the like and utilizes the principle of generating electricity by irradiation with light. By using an organic thin film, solar cells that are "thinner and more flexible" than conventional silicon-based solar cells are expected to be used in a wider range. In addition, organic thin-film solar c...
Claims
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IPC IPC(8): C08L63/00C08L63/02C08L63/10C08L75/04C08L75/14C08L69/00C08L33/04C08L23/00C08L67/00C08K3/34C08K3/36C08J3/24H01L51/42H01L51/05
CPCY02E10/549C08J3/20C08J3/24C08K3/013C08K7/00C08L101/00H10K50/8426
Inventor 管野敏之王小冬若林明伸
Owner MORESCO