Bidirectional pulse plating switch power source based on complex programmable logic device (CPLD) control

Abstract

The invention discloses a full-bridge conversion and chopper circuit which achieves pulse-width modulation (PWM) trigger pulse control through complex programmable logic device (CPLD) and relates to a bidirectional pulse plating switch power source based on CPLD control. A feedback control system with a singlechip as a core is adopted, amplitude and width of the pulse voltage can be automatically controlled accurately by means of matching between the singlechip and the CPLD through a fuzzy proportional-integral-derivative (PID) algorithm, and the amplitudes of a positive pulse and a negative pulse are not equivalent and maintained on the corresponding values. Simultaneously, the system is provided with a protection circuit for detecting the current and the voltage, and abnormal states of overcurrent, overvoltage and the like in the system are protected timely, so that a driving circuit is ensured to drive an insulated gate bipolar translator (IGBT) pipe of a conversion bridge and a metal-oxide-semiconductor field effect transistor (MOSFET) pipe of a chopper circuit effectively and accurately. Corresponding conversion frequency and dead time are arranged in a digital PWM chip to ensure a full-bridge conversion circuit and an H-bridge chopper circuit to work safely. The bidirectional pulse plating switch power source is applicable to development and research of the electroplate technology of industrial development and scientific research institutions.

Description

technical field [0001] The invention relates to the application and research of electroplating technology in industrial production and scientific research institutes. Background technique [0002] In traditional direct current electroplating, the metal ions in the electroplating solution around the cathode are continuously precipitated under the action of direct current, which destroys the uniformity of the electrolyte concentration in the electroplating tank and produces a certain concentration difference. Finally, the amount of hydrogen precipitation on the plated parts increases, the quality of the coating deteriorates, and problems such as pinholes, pitting, roughness and blistering appear in the coating. The "timed reverse current pulse" method, that is, the bidirectional pulse plating method can well solve the problems caused by DC plating. In fact, pulse plating can be regarded as a kind of on-off DC plating. The forward pulse process is equivalent to DC electroplat...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the deficiencies in the DC electroplating process in the laboratory and electroplating industry in the past, that is, the main problems such as the deterioration of the coating quality, and the "timed reverse current pulse" method, that is, the bidirectional pulse electroplating method can well solve the problem of direct current electroplating. Problems caused by electroplating

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