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Aluminum welding tin paste and preparation method thereof

A technology of solder paste and tin powder, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of unsatisfactory solder, unusable soldering or dip soldering, etc., and achieve good soldering effect

Active Publication Date: 2013-02-13
青岛英太克锡业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention proposes a soldering aluminum solder paste, which solves the problem of some metals that are difficult to solder compared to copper and cannot be used in some special soldering occasions in the prior art. Solder can not meet the problem

Method used

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  • Aluminum welding tin paste and preparation method thereof
  • Aluminum welding tin paste and preparation method thereof

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preparation example Construction

[0028] The preparation method of the hydroxylamine fluoride comprises the following steps:

[0029] 1) In terms of weight percentage, take 1-5% of ethylenediamine, 3-30% of ethanolamine, 20-90% of diethanolamine and 5-80% of triethanolamine, and mix them uniformly to obtain a mixture;

[0030] 2) Neutralize the resulting mixture with hydrofluoric acid to a pH value of 6.5-8;

[0031] 3) Evaporate the above neutralized product at a temperature of 140-160°C for 3.5-4.5 hours.

[0032] The metal active salt is one or more of tin fluoride, stannous fluoride, stannous fluoroborate, stannous chloride, zinc fluoride, zinc fluoroborate, zinc chloride and bismuth chloride combination.

[0033] The activator is one or a combination of diethylamine hydrochloride, triethylamine hydrochloride, lithium fluoride, sodium fluoride, magnesium fluoride and aluminum fluoride.

[0034] The corrosion inhibitor is benzotriazole and / or piperazine.

[0035] A method for preparing aluminum solder p...

Embodiment 1

[0043] The preparation method of hydroxylamine fluoride, it may further comprise the steps:

[0044] 1) According to weight percentage, take ethylenediamine 1%, ethanolamine 30%, diethanolamine 64% and triethanolamine 5%, mix and stir evenly to obtain a mixture;

[0045] 2) neutralize the resulting mixture with hydrofluoric acid to a pH value of 6.5;

[0046] 3) Evaporate the above-mentioned neutralized product at 140°C for 4.5 hours to remove the moisture and prevent subsequent welding spatter.

Embodiment 2

[0048]The preparation method of hydroxylamine fluoride, it may further comprise the steps:

[0049] 1) According to weight percentage, take 5% ethylenediamine, 3% ethanolamine, 84% diethanolamine and 8% triethanolamine, mix and stir evenly to obtain a mixture;

[0050] 2) Neutralize the resulting mixture to a pH value of 7 with hydrofluoric acid;

[0051] 3) Evaporate the above-mentioned neutralized product at 160°C for 3.5 hours to remove the moisture and prevent subsequent welding spatter.

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Abstract

The invention relates to an aluminum welding tin paste and a preparation method of the aluminum welding tin paste. The preparation method comprises steps of: 1) weighing 60 to 85% of fluorate hydroxylamine, 5 to 30% of metal active salt, 1 to 5% of active agent, and 0.1 to 5% of corrosion inhibitor by weight, and uniformly mixing to obtain a flux for later use; and 2) weighing 5 to 30% of flux, and 70 to 95% of tin powder by weight, adding the tin powder to the flux along with continuous agitating, and uniformly mixing, so as to obtain the aluminum welding tin paste. The aluminum welding tin paste has the following advantage that 1, a good effect is brought to an object which needs to be pre-coated by the welding flux before welding or the object which is relatively complex in welding shape, and the rate of spread of welding reaches 70 to 90%; and 2, a good welding effect is brought to some metals which are hardly welded relative to copper, such as stainless steel and aluminum.

Description

technical field [0001] The present invention relates to a paste brazing material used for soldering of electronic components, in particular to an aluminum solder paste that can meet the soldering of aluminum in special occasions or welding of other relatively difficult-to-solder metals and its preparation method . Background technique [0002] Solder paste is the solder used in reflow soldering of electronic printed circuit boards. Solder paste is made by mixing ultra-fine tin-based spherical solder powder (20-75μm) and paste solder composition (flux paste). Soldering pastes usually contain resins, thixotropes, solvents, activators, corrosion inhibitors and other additives. The solder paste has two functions in the solder paste: one is to help soldering, that is, to remove metal oxides when heated, and an activator needs to be added to the solder paste; the other is to serve as a carrier of solder powder, and the solder paste needs to be added with resin, Solvent, thixotr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/36
Inventor 刘海涛
Owner 青岛英太克锡业科技有限公司
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