Integrated LED illuminating assembly

A technology of LED lighting and LED circuits, which is applied to the components of lighting devices, lighting devices, semiconductor devices, etc., and can solve problems such as reducing the service life, durability and reliability of LEDs, being difficult to adapt to welding LEDs, and being difficult to install and carry. , to achieve the effect of saving process cost, good light transmission performance and improving heat dissipation performance

Inactive Publication Date: 2013-02-13
田茂福
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, this kind of insulating layer materials all have a common disadvantage, that is, their thermal conductivity is very poor. Generally speaking, their thermal conductivity is generally between about 0.08-0.3W/m·K
This will cause heat dissipation problems where the heat is not easily dissipated when the LED is working, thereby reducing the service life, durability and reliability of the LED
Theref

Method used

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  • Integrated LED illuminating assembly
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Embodiment Construction

[0034] The present invention will be described in more detail below.

[0035] Glass is a transparent, airtight, and hard material. Glass is chemically inert in everyday environments and does not interact with living things. Glass is generally insoluble in acid (exception: hydrofluoric acid reacts with glass to form SiF 4 , leading to corrosion of the glass); but soluble in strong bases such as cesium hydroxide.

[0036] Glass in a narrow sense is defined as: an inorganic substance that does not crystallize during the cooling of the melt. According to this definition, amorphous substances produced by methods other than melting, such as vacuum evaporation, radiation exposure, gel heating, etc., cannot be called glass. There are also amorphous metals and amorphous polymer materials that are different from inorganic substances in composition and cannot be called glass. However, the broad definition of glass scientifically classifies glass according to the state and properties ...

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Abstract

The invention relates to an integrated LED (Light Emitting Diode) illuminating assembly. The integrated LED illuminating assembly comprises an LED circuit, a glass carrier for bearing the LED circuit as well as an LED chip which is in conductive connection and is packaged on the LED circuit, wherein the LED circuit and the LED chip are integrated on the glass carrier. According to the integrated LED illuminating assembly, the heat radiating performance of the LED lamp is greatly improved and a traditional LED circuit board structure is omitted, so that materials and the labor cost are greatly saved. The glass has favorable light emitting performance, so that the glass can be used as an outer protecting structure of the LED lamp, fox example, the glass is directly used as a lamp tube of the LED lamp. Therefore, the materials, the price and the mounting cost are further saved.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a novel integrated LED lighting assembly. Background technique [0002] LED lighting fixtures in the prior art are generally formed by packaging LEDs on an independent traditional (flexible) circuit board and then connecting an external circuit. [0003] The flexible circuit boards in the prior art, whether single-sided, double-sided or multi-sided, generally use copper or copper alloy materials as circuit layer materials. For example, in a traditional double-sided flexible circuit board, the structure of the flexible circuit board is an insulating layer (for example, made of a typical PI material) in the middle, and a circuit layer made of copper foil is respectively provided on both sides of the insulating layer. , on the outside of the two layers of circuit layers (such as bonding, coating, coating or printing) protective cover film layer (typically CVL or related high temperature...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00F21V23/00H01L33/48H01L33/62H01L33/64F21Y101/02F21K9/20F21V29/85F21Y115/10
Inventor 田茂福
Owner 田茂福
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