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Organosilicon polyimide benzimidazole photoconductive fiber coating layer and preparation method thereof

A technology of silicon polyimide and benzimidazole, which is applied in the field of optical fiber coating layer and its preparation, can solve the problems of application limitation, low temperature resistance level, poor resistance to cold and heat alternating cycle, etc. Fewer types, easy to recycle, and good application prospects

Inactive Publication Date: 2013-02-27
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the temperature resistance level of the above resin is not high, and the alternating cold and heat resistance is not good, so its application is limited, especially in high-tech fields such as aerospace

Method used

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  • Organosilicon polyimide benzimidazole photoconductive fiber coating layer and preparation method thereof
  • Organosilicon polyimide benzimidazole photoconductive fiber coating layer and preparation method thereof
  • Organosilicon polyimide benzimidazole photoconductive fiber coating layer and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] At room temperature, put 7.7 g (0.01 mol) of organosilicon diamine (YASI), 2000 g of N-ethyl-2-pyrrolidone (NMP) and 300 g of tetrahydrofuran (THF) into the reaction kettle, stir and dissolve, then add 344.1 g (1.11 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride (ODPA), and after stirring for 1 hour, 22.4 g (0.1 moles) of 2-(4-aminophenyl)-5 -Aminobenzimidazole (APABI) and 200.0 g (1.0 mole) 4,4'-diaminodiphenyl ether (DADPE), after stirring for 5 hours, 2874.2 g of homogeneous transparent viscous silicone polyamic acid phenyl And imidazole resin solution, the solid content is 20%, recorded as PSIMZ-20.

Embodiment 2

[0057] At room temperature, put 76.6 g (0.1 mole) of organosilicon diamine (YASI), 5800 g of N,N-methylacetamide (DMAc) and 700 g of methyltetrahydrofuran (MTHF) into the reaction kettle, stir and dissolve, Add 322.2 g (1.0 mol) of 3,3',4,4'-tetracarboxybenzophenone dianhydride (BTDA), 87.2 g (0.4 mol) of pyromellitic dianhydride (PMDA), and stir for 2 hours , add 22.4 g (0.1 mole) 2-(4-aminophenyl)-5-aminobenzimidazole (APABI) and 20.0 g (0.1 mole) 3,4'-diaminodiphenyl ether (34DADPE), 51.8 g (0.1 mol) 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (BAPFP), 200.0 g (1.0 mol) 4,4'-diaminodiphenyl ether (DADPE), After stirring and reacting for 4 hours, 7280.2 g of a homogeneous transparent and viscous organosilicon polyamic acid benzimidazole resin solution with a solid content of 10.7% was obtained, designated as PSIMZ-10.

Embodiment 3

[0059] At room temperature, mix 76.6 g (0.1 mol) of silicone diamine (YASI), 1000 g of N-methyl-2-pyrrolidone (NMP), 1000 g of N,N-methylacetamide (DMAc) and 400 g of methyl Put tetrahydrofuran (MTHF) into the reaction kettle, stir and dissolve, add 156.0 g (0.3 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA), 218.0 grams (1.0 moles) of pyromellitic dianhydride (PMDA), after stirring for 1 hour, add 22.4 grams (0.1 moles) of 2-(4-aminophenyl)-5-aminobenzimidazole (APABI) and 51.8 g (0.1 mole) 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (BAPFP), 200.0 g (1.0 mole) 4,4'-diaminodiphenyl ether (DADPE) After stirring and reacting for 5 hours, 2874.2 grams of homogeneous transparent and viscous organosilicon polyamic acid benzimidazole resin solution was obtained, with a solid content of 23.2%, which was designated as PSIMZ-23.

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Abstract

The invention relates to an organosilicon polyimide benzimidazole photoconductive fiber coating layer represented by the following molecular structural general formula and a preparation method thereof. The preparation method comprises the following steps: dissolving silane containing diamino in an organic mixed solution, adding aromatic dianhydride, stirring at room temperature to react for 1-2 h, then adding 2-(4-hydroxyphenyl)-5-aminobenzimidazole monomer and aromatic diamine monomer, stirring to react for 4-5h to obtain an organosilicon polyimide benzimidazole resin solution, homogeneously coating the organosilicon polyimide benzimidazole resin solution on the surface of photoconductive fibers, and thermocuring to obtain the organosilicon polyimide benzimidazole photoconductive fiber coating layer. According to the invention, the coating layer disclosed herein had the advantages of simple curing process, excellent high temperature resistance, extremely excellent mechanical property and electrical property, etc.; the preparation method is simple, the comprehensive performance is excellent, and the coating layer and the preparation method have good market prospect.

Description

technical field [0001] The invention belongs to the field of optical fiber coating layer and its preparation, in particular to an organosilicon polyimide benzimidazole optical fiber coating layer and its preparation method. Background technique [0002] The optical fiber for optical communication is made of quartz glass (multi-component quartz glass) or glass doped with rare earth elements after melting and drawing. In order to ensure the original strength of the optical fiber, the surface must be coated with a protective material - optical fiber coating. Only in this way can environmental stress and water molecules corrode the microcracks on the surface of the optical fiber and the "hydrogen damage" caused by hydrogen in the air to the optical fiber can be avoided. Optical fiber coatings can provide strength protection, waterproof and stress buffering for optical fibers, so as to maintain the excellent mechanical and optical properties of optical fibers. [0003] Optical f...

Claims

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Application Information

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IPC IPC(8): C03C25/40
Inventor 虞鑫海吴冯
Owner DONGHUA UNIV
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