Water-based cutting fluid of hard brittle material and preparation method of water-based cutting fluid

Abstract

The invention relates to a water-based cutting fluid of a hard brittle material and a preparation method of the water-based cutting fluid, in particular to a water-based cutting fluid applied to cutting of solar crystal crystalline silicon. The water-based cutting fluid comprises the following components in percentage by weight: 10-40 percent of deionized water, 55-85 percent of dihydric alcohol, 0.001-5 percent of water-retaining agent, 0.001-5 percent of thixotropic thickening agent and 0-5 percent of washing foam controlling agent. The cutting fluid has the advantages of no loss of water in a cutting process, high specific heat capacity, good cooling property and environmental friendliness, and is a novel water-based cutting fluid with stable property.

Description

technical field [0001] The invention relates to an industrial cutting fluid, in particular to a water-based cutting fluid for cutting hard and brittle materials such as crystalline silicon. Background technique [0002] In recent years, with the development of cutting technology for hard and brittle materials, especially crystalline silicon for solar energy, the requirements for cutting fluids used in cutting hard and brittle materials are also getting higher and higher. On the basis of the original cooling, suspension, lubrication, dispersion and other performance requirements, the cutting fluid must continue to meet the changing needs of the cutting process; such as making the crystal surface smoother and easier to clean after cutting, and at the same time requiring low cost, cutting The final waste slurry is easy to regenerate and can be recycled and so on. [0003] In the past 30 years, cutting fluids have gradually developed from oily cutting fluids cleaned with organi...

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Problems solved by technology

[0005] Invention patent "A mixed additive and wire saw cutting fluid made from it" (application number 201010246708.7) The main component of the cutting fluid is still polyethylene glycol, and the additive With organic acid polymers and organic bases as the main components and a water content of 45-84%, the maximum water content in the equivalent cutting fluid is 42%. The formula product has a good ability to disperse and re-disperse abrasives, and the cost is relatively low. However, after the addition of additives, the stability of the cutting fluid itself needs to be further improved, and at the same time it increases the difficulty of the user's operation.

[0006] Invention patent "a water-based cutting fluid for silicon wafer cutting" (application number 201110174484.8) uses polyvinyl alcohol as the main thickening and lubricating component, while water The content is as high as 89.95~98%, which achieves low cost, but the thixotropy and stability of the formula need to be further improved. With the high temperature of the contact point during the cutting process, it is difficult to maintain a stable moisture

[0007]Aiming at the existing water-based cutting fluid formulations, the raw materials are generally difficult to obtain, the formulation cost is high, and the water content is gradually lost during the use of the cutting fluid, causing mortar The viscosity of the raw material is constantly increasing, which leads to unstable cutting process and difficult control of product quality. At the same time, in the process of recycling waste slurry, the lack of additive transactions makes recycling relatively difficult.

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