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Solvent-free resin composition for vacuum impregnation

A solvent-free resin, vacuum impregnation technology, applied in the field of solvent-free impregnating resin, high-voltage motor vacuum pressure impregnation with solvent-free impregnating resin, can solve the problems of high toxicity and volatility, and achieve high curing degree, slow viscosity growth, expansion rate small effect

Active Publication Date: 2014-07-23
SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] One of the technical problems to be solved by the present invention is to provide an environmentally friendly impregnating resin that does not contain active diluents such as styrene in view of the shortcomings of existing impregnating resins that are highly toxic and volatile due to containing styrene

Method used

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  • Solvent-free resin composition for vacuum impregnation
  • Solvent-free resin composition for vacuum impregnation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A solvent-free resin composition for vacuum impregnation, the raw material formula is as follows:

[0037]Resin components: 30 parts molecular distillation low viscosity bisphenol A epoxy resin (DER332, 4000-6000mPas), 10 parts low viscosity bisphenol F epoxy resin (DER354, 3500-5700mPas), 20 parts hydrogenated bisphenol A epoxy Resin (EPALLOY5000, 1300-2500mPas), 10 parts of ethylene glycol diglycidyl ether, 10 parts of bisglycidyl ether;

[0038] Reactive diluent: 10 parts of glycidyl methacrylate, 10 parts of 2-vinylphenyl glycidyl ether;

[0039] Curing agent: 4 parts 2E4MZ-CN;

[0040] Inhibitor: 0.2 parts of hydroquinone;

[0041] Initiator: 1 part dicumyl peroxide;

[0042] Accelerator: 0.2 parts of aluminum acetylacetonate.

[0043] Before use, the above-mentioned raw materials were accurately weighed and thoroughly mixed uniformly to form a solvent-free resin composition for vacuum impregnation, and its performance parameters are shown in Table 1.

Embodiment 2

[0045] A solvent-free resin composition for vacuum impregnation, the raw material formula is as follows:

[0046] Resin components: 20 parts of molecular distillation low viscosity bisphenol A epoxy resin (DER332, 4000-6000mPas), 20 parts of low viscosity bisphenol F epoxy resin (DER354, 3500-5700mPas), 10 parts of low viscosity novolac epoxy Resin (DEN431, 1100-1700mPas), 10 parts of ethylene glycol diglycidyl ether, 10 parts of glycerin epoxy resin;

[0047] Reactive diluent: 10 parts of allyl glycidyl ether, 10 parts of 2-vinylphenyl glycidyl ether, 10 parts of 4-methyl 2-ethylphenyl glycidyl ether;

[0048] Curing agent: 5.2 parts of 2E4MZ-CN;

[0049] Inhibitor: 0.4 part p-benzoquinone;

[0050] Initiator: 2 parts of di-tert-butyl peroxide;

[0051] Accelerator: 1 part chromium acetylacetonate.

[0052] Before use, the above-mentioned raw materials were thoroughly mixed evenly to form a solvent-free resin composition for vacuum impregnation, and its performance parame...

Embodiment 3

[0054] A solvent-free resin composition for vacuum impregnation, the raw material formula is as follows:

[0055] Resin components: 30 parts molecular distillation low viscosity bisphenol A epoxy resin (DER332, 4000-6000mPas), 10 parts low viscosity novolac epoxy resin (DEN431, 1100-1700mPas), 10 parts hydrogenated bisphenol A epoxy resin (EPALLOY5000, 1300-2500mPas), 10 parts of bisglycidyl ether, 10 parts of resorcinol bisglycidyl ether;

[0056] Reactive diluent: 10 parts glycidyl methacrylate, 10 parts allyl glycidyl ether, 10 parts diallyl bisphenol A glycidyl ether;

[0057] Curing agent: 4.8 parts of 2E4MZ-CN;

[0058] Inhibitor: 0.6 parts of tert-butylhydroquinone;

[0059] Initiator: 1 part of tert-butylperoxycumene;

[0060] Accelerator: 0.8 parts of aluminum acetylacetonate.

[0061] Before use, the above-mentioned raw materials were thoroughly mixed evenly to form a solvent-free resin composition for vacuum impregnation, and its performance parameters are shown...

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Abstract

The invention relates to a solvent-free resin composition for vacuum impregnation, which comprises epoxy resins, reactive diluent, epoxy resin curing agent, polymerization inhibitor, initiator and accelerator. The solvent-free resin composition comprises the following components: 40-60 parts of I-type epoxy resin, 20-40 parts of II-type epoxy resin, 10-30 parts of non-styrene reactive diluent, 4-6 parts of latent epoxy resin curing agent, 0.2-1.0 part of polymerization inhibitor, 1-2 parts of initiator and 0.2-1.0 part of accelerator. The invention does not use volatile styrene as the diluent or use easily-hydrolyzable acid anhydride as the curing agent; and thus, the composition is non-toxic and environment-friendly, has the advantages of excellent storage stability, excellent impregnation processibility, high heat resistance, low water absorptivity, strong binding power and excellent electric insulation property, and thus, is a new-generation resin composition suitable for vacuum impregnation.

Description

technical field [0001] The invention relates to the field of electrical insulation, in particular to a vacuum pressure resin impregnation technology, in particular to a solvent-free impregnation resin, in particular to a solvent-free impregnation resin for vacuum pressure impregnation of a high-voltage motor. Background technique [0002] Vacuum Pressure Impregnation (VPI) is the best insulation treatment technology today. The insulation layer treated by VPI has the advantages of no air gap and good integrity, which improves the moisture-proof and heat dissipation performance of motors and electrical appliances, improves the reliability of operation, and enables motors and electrical appliances to operate reliably in harsh environments for a long time. [0003] The performance of VPI insulating materials depends on five major factors: (1) impregnated resin; (2) mica tape with less rubber powder; (3) VPI process; (4) VPI equipment and tape machine; (5) anti-halation technolog...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/10C08G59/40C08G59/20C08G59/32
Inventor 闵玉勤张春琪张兴宏施文磊杜滨阳徐晓风顾健峰
Owner SUZHOU TAIHU ELECTRIC ADVANCED MATERIAL CO LTD
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