Electrolytic copper-clad plate by taking polymethyl methacrylate as medium, printed circuit board and manufacturing method thereof

Abstract

The invention relates to a method for manufacturing a copper-clad plate. The method comprises the following steps of: providing a substrate; manufacturing a polymethyl methacrylate material, and roughening the surface of the polymethyl methacrylate material; performing electroless plating copper treatment on the roughened surface of the polymethyl methacrylate material, and forming an electroless plating copper substrate; electroplating the formed electroless plating copper substrate, and forming the copper-clad plate. The invention also provides a method for manufacturing a circuit board on the basis of the method for manufacturing the copper-clad plate. The invention further provides a copper-clad plate and a printed circuit board. The printed circuit board has the advantages of excellent electrical properties and mechanical properties, wide application range and low cost.

Description

technical field [0001] The invention relates to a copper-clad laminate, a printed circuit board and a manufacturing method thereof, in particular to a copper-clad laminate, a printed circuit board and a manufacturing method thereof with PMMA (polymethyl methacrylate) material as a substrate. Background technique [0002] Printed Circuit Board (PCB) is the basis of almost any electronic product. With the rapid development of the electronics industry, printed circuit boards, as the basic components of electronic products, are more and more widely used. Although the functions of electronic products are not only enhanced, the application With the expansion of the field, especially driven by the development of the high-speed information age, there are more and more requirements for printed circuit boards used in electronic products, especially the requirements for printed circuit boards in terms of signal transmission quality and speed. constantly improving. [0003] In the prio...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, epoxy resin as the main body (FR-4) is currently the largest and most widely used type of product for printed circuit boards. However, printed circuit boards made of FR-4 materials have high cost and large dielectric loss. And the electrical performance is poor, and FR-4 has a series of shortcomings such as easy water absorption, easy aging, and poor voltage resistance, which makes the printed circuit boards made of it not suitable for special environments, especially humid environments, aerospace, high-speed, etc. Communications, space or radioactive medical devices) and other fields require materials with light density, low transmission dielectric loss, strong corrosion resistance, environmental protection, and high insulation.

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