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Solar cell silver-backed slurry ultralow in silver content

A technology for solar cells and back silver paste, which is applied to conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, can solve the problem of reducing the silver content of the back silver paste of solar cells and the solder resistance of the silver layer. , Adhesion and conductivity need to be further improved, silver content is reduced, etc., to achieve the effect of improving solderability and solder resistance, reducing production costs, and dense silver layer

Active Publication Date: 2013-03-27
JIANGSU RUIDE NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the silver content of the solar cell back silver paste can be reduced by mixing spherical silver powder and flake silver powder as a conductor, and the goal of forming a dense, solder-resistant, and highly conductive silver layer at a lower silver content can also be achieved, but The solder resistance, adhesion and conductivity of the silver layer need to be further improved, and the silver content needs to be further reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] The invention is a solar cell back silver paste with ultra-low silver content, its components and weight percentages are: 5% star-shaped multi-branched silver powder, 10% flake silver powder, 15% spherical or ball-like Silver powder, 1% glass powder, 10% organic binder, 59% solvent.

[0012] Among them, the average number of branches of the star-shaped multi-branched silver powder is 5-8, and the branches on a single silver powder are arranged in three dimensions, showing a three-dimensional shape emitted from a central point. The average length of a single fork is 2-5 μm, the average width is 0.5-2 μm, the average cluster size of the entire silver powder particle is 5-10 μm; the tap density of the flake silver powder is >4.5 g / cm 3 , the average thickness is 0.1-1 μm, and the average lateral dimension is 1-10 μm; the tap density of spherical or spherical silver powder is >5 g / cm 3 , the average particle size is 0.2-1.5 μm; the organic binder is acrylic resin; the solv...

Embodiment 2

[0014] A solar battery back silver paste with ultra-low silver content, its components and weight percentages are: 10% star-shaped multi-branched silver powder, 15% flake silver powder, 25% spherical or spherical silver powder, 8 % glass powder, 15% organic binder, 22% solvent, 5% additives.

[0015] Among them, the average number of branches of the star-shaped multi-branched silver powder is 5-8, and the branches on a single silver powder are arranged in three dimensions, showing a three-dimensional shape emitted from a central point. The average length of a single fork is 2-5 μm, the average width is 0.5-2 μm, the average cluster size of the entire silver powder particle is 5-10 μm; the tap density of the flake silver powder is >4.5 g / cm 3 , the average thickness is 0.1-1 μm, and the average lateral dimension is 1-10 μm; the tap density of spherical or spherical silver powder is >5 g / cm 3 , the average particle size is 0.2-1.5 μm; the organic binder is ethyl cellulose; the ...

Embodiment 3

[0017] A solar cell back silver paste with ultra-low silver content, its components and weight percentages are: 8% star-shaped multi-branched silver powder, 12% flake silver powder, 20% spherical or spherical silver powder, 4% % glass powder, 12% organic binder, 40% solvent, 4% additive.

[0018] Among them, the average number of branches of the star-shaped multi-branched silver powder is 5-8, and the branches on a single silver powder are arranged in three dimensions, showing a three-dimensional shape emitted from a central point. The average length of a single fork is 2-5 μm, the average width is 0.5-2 μm, the average cluster size of the entire silver powder particle is 5-10 μm; the tap density of the flake silver powder is >4.5 g / cm 3 , the average thickness is 0.1-1 μm, and the average lateral dimension is 1-10 μm; the tap density of spherical or spherical silver powder is >5 g / cm 3 , the average particle size is 0.2-1.5 μm; the organic binder is modified hydrogenated cas...

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Abstract

The invention relates to solar cell silver-backed slurry ultralow in silver content. The slurry is composed of, by weight, 5-10% of starlike multi-branch silver powder, 10-15% of schistose silver powder, 15-25% of spherical or ball-like silver powder, 1-8% of glass powder, 10-15% of organic binder, 22-59% of solvent and 1-5% of auxiliaries, wherein the sum of weight percentage of components is 100%, and the sum of the weight percentage of the starlike multi-branch silver powder, the schistose silver powder and the spherical silver powder is 30-50%. Compared with the prior art, a mixture of the starlike multi-branch silver powder, the schistose silver powder and the spherical silver powder is adopted as a conductive part, so that the silver content is low, cost is low, and an electrode after sintering is in a compact silver-film structure, high in adhesion force with a silicon substrate, excellent in welding resistance and weldability and capable of forming well ohmic contact with the silicon substrate.

Description

technical field [0001] The invention relates to a conductive paste, in particular to a solar battery back silver paste with ultra-low silver content. Background technique [0002] A solar cell is a semiconductor device that converts solar energy into electricity. The solar cell back silver paste is the main component of the solar cell electronic paste. It is mainly used to make the back busbar in the production of solar cells, and plays the role of converging and exporting the current collected by the aluminum back field. The silver paste on the back of the solar cell is mainly composed of silver powder, organic binder, inorganic binder, solvent and additives. As the functional phase in the paste, the silver powder plays the role of electricity conduction. Since the back bus grid needs to be welded together with metal electrodes in series to form components, the solderability, solder resistance, adhesion to the silicon substrate, and conductivity of the silver layer have b...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01L31/0224
Inventor 戈士勇
Owner JIANGSU RUIDE NEW ENERGY TECH
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