Low dielectric, low expansion and low temperature co-fired ceramic material and preparation method thereof

A low-temperature co-fired ceramic and low-expansion technology, which is applied in the field of ceramic materials, can solve problems such as limited applications, and achieve the effects of reducing the dielectric constant, high filling amount, and low dielectric constant

Active Publication Date: 2013-04-03
(CNBM) BENGBU DESIGN & RES INST FOR GLASS IND CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The representative of this system material is the product 951AT of Dupont Company of the United States, which is made of Al 2 o 3 Powder and lead borosilicate glass, its thermal expansion coefficient is 5.8×10 –6 /°C, which is close

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The borosilicate glass content of the composite phase material is 60wt%, and the spherical fused silica micropowder content of the filling phase material is 40wt%.

[0023] 1. Preparation of borosilicate glass powder

[0024] The following raw materials in parts by weight: H3BO3 (20~30), SiO2 (50~70), Al2O3 (10~15), MgCO3 (7~12), K2CO3 (3~5), Na2CO3 (3~5) well mixed;

[0025] The mixed powder was placed in a platinum crucible from room temperature to 1550°C at a rate of 5°C / min, and kept for 2 hours, and the prepared glass liquid was quickly and evenly poured into deionized water to obtain glass shards;

[0026] The prepared glass shards are crushed several times with corundum counter-rollers to obtain coarse glass powder with a particle size range of about 0.5-1mm;

[0027] Deionized water is used as grinding aid, ZrO2 balls are used as grinding media, the mass ratio of glass coarse powder: ZrO2 balls: deionized water is 1:2.5:0.8, and the material is discharged afte...

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PUM

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Abstract

The invention relates to a low dielectric, low expansion and low temperature co-fired ceramic material and a preparation method thereof. The method comprises the steps of a, mixing (60-80)wt% of borosilicate glass powder with (20-40)wt% of spherical fused quartz micro powder to obtain low-temperature co-fired ceramic powder, b, adding a solvent, an adhesive agent, a plasticizer and a dispersing agent to the low temperature co-fired ceramic powder, obtaining casting slurry, and preparing the casting ceramic slurry into a green ceramic tape, and c, placing the green ceramic tape into an electric furnace for sintering to form the low temperature co-fired ceramic material. According to the low dielectric, low expansion and low temperature co-fired ceramic material and the preparation method thereof, a high-purity superfine spherical fused quartz material is added to representative borosilicate glass, so that the dielectric constant and the thermal expansion coefficient of an LTCC (low temperature co-fired ceramic) substrate material are reduced, and the low temperature sintering of the spherical fused quartz material is achieved. The prepared low temperature co-fired ceramic material has the dielectric constant of 5.1(1MHz) and the thermal expansion coefficient of 4.2*10<-6>K<-1>, and has a good application prospect.

Description

technical field [0001] The invention relates to the field of ceramic materials, in particular to a low-medium and low-expansion low-temperature co-fired ceramic material and a preparation method thereof. Background technique [0002] The electronic substrate is the carrier of the semiconductor chip package, carrying the support of electronic components and forming the base of the electronic circuit. Low-temperature co-fired multilayer ceramic substrates, as the fifth-generation assembly technology substrates, have attracted great attention from researchers at home and abroad, and have been widely used in the fields of aerospace, aviation, communications and large-scale computers. The development of microelectronics technology has put forward higher and higher requirements for electronic packaging substrate materials, including: low dielectric constant (ε r <9) to reduce the delay time of the signal in transmission and increase the transmission speed; the coefficient of t...

Claims

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Application Information

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IPC IPC(8): C04B35/16C04B35/622C03C12/00
Inventor 彭寿王芸方亮曹志强
Owner (CNBM) BENGBU DESIGN & RES INST FOR GLASS IND CO LTD
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