Fe-Si-Al ternary amorphous thin film with adjustable band gap width and preparation method of thin film
A fe-si-al, amorphous thin film technology, applied in the direction of ion implantation plating, coating, metal material coating process, etc., can solve multi-phase hybrid deterioration, large film base mismatch, prone to stacking faults, Twins and other problems can be avoided to avoid multi-phase mixing, avoid lattice mismatch, and ensure the effect of composition and performance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] Embodiment 1: Fe is prepared by magnetron sputtering method 37.6 Si 60.7 al 1.7 film
[0032] (1) Preparation of alloy sputtering target, the steps are as follows:
[0033] 1. material preparation: according to the atomic percentage of Fe and Al being 4:0.15 to take each component value, the purity of Fe and Al metal raw materials to be used: Fe is 99.99%, and Al is 99.999%;
[0034] ② Fe 4 al 0.15 Melting of alloy ingots: Put the metal mixture in the water-cooled copper crucible of the melting furnace, and use the method of vacuum arc melting to melt under the protection of argon. First, vacuumize to 10 -2 Pa, then filled with argon until the pressure is 0.03±0.01MPa, the control range of melting current density is 150±10A / cm 2 After melting, continue to smelt for 10 seconds, turn off the power, let the alloy cool down to room temperature with the copper crucible, then turn it over, put it back in the water-cooled copper crucible, and carry out the second smeltin...
Embodiment 2
[0045] Embodiment 2: Fe is prepared by magnetron sputtering method 33.6 Si 61.3 al 5.1 film
[0046] The preparation process is the same as in Example 1, only the Fe of the combined alloy sputtering target is adjusted. 4 al z Number of alloy sheets and Z value: from 5.5 sheets of Fe 4 al 0.5 The alloy sheet is pasted on the basic Si target used for sputtering. According to EPMA analysis, the contents of Fe, Si and Al in the film are 33.6at.%, 61.3at.%, and 5.1at.%. The XRD and TEM results showed that the Fe 33.6 Si 61.3 al 5.1 No crystal information was found in the sample, indicating that the prepared amorphous film was prepared. The bandgap width was measured to be 0.60eV.
Embodiment 3
[0047] Embodiment 3: Fe is prepared by magnetron sputtering method 25.8 Si 66.2 al 8.0 film
[0048] The preparation process is the same as in Example 1, only the Fe of the combined alloy sputtering target is adjusted. 4 al z Number of alloy sheets and Z value: 4 sheets of Fe 4 al 1 The alloy sheet is pasted on the basic Si target used for sputtering. According to EPMA analysis, the contents of Fe, Si, and Al in the film are 25.8 at.%, 66.2 at.%, and 8.0 at.%. The XRD and TEM results showed that the Fe 25.8 Si 66.2 al 8.0 No crystal information was found in the sample, indicating that the prepared amorphous film was prepared. The bandgap width was measured to be 0.50eV.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com