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Preparation and application for white light light emitting diode (LED) fluorescent powder prefabricated components

A technology of prefabricated components and phosphors, which is applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve problems such as waste, inconsistent light and chromaticity, and performance degradation of phosphors, so as to reduce production costs, improve work efficiency, and ensure consistent effect

Inactive Publication Date: 2013-04-03
OCEAN UNIV OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the above-mentioned encapsulation process, there are three problems in phosphor coating: First, due to the inconsistency of the density of the phosphor and the glue, the phosphor will slowly precipitate in the glue, and it is difficult to maintain the consistency of the concentration during the glue dispensing process, resulting in the product Inconsistency of light and chromaticity in different batches or even in the same batch
At the same time, the remaining powder-glue mixture can no longer be used each time, resulting in waste
Second, it is difficult to control the thickness and uniformity of the fluorescent glue on the chip, which leads to the inconsistency of the light and chromaticity of LED products
Third, since the phosphor powder is in direct contact with the chip, the long-term heat generation of the chip will degrade the performance of the phosphor powder and affect the service life of the LED

Method used

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  • Preparation and application for white light light emitting diode (LED) fluorescent powder prefabricated components
  • Preparation and application for white light light emitting diode (LED) fluorescent powder prefabricated components
  • Preparation and application for white light light emitting diode (LED) fluorescent powder prefabricated components

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Such as figure 1 , using polyamide engineering plastics to make two molds, one of which is a hollow cylinder 1 with a height of 1mm; a thickness of 0.5mm and an inner diameter of 3.2mm; the other is a disc-shaped 2 with an inner diameter of 3.7mm and a thickness of 0.5mm . Coat the inner wall of the mold with a transparent epoxy resin release agent (Shengdan brand SZ-218R produced by Taixing Shengdan Mold Material Co., Ltd.), and mix the two thoroughly according to the mass ratio of epoxy photocuring adhesive: fluorescent powder = 100:40 and use them together Negative air pressure to remove air bubbles, inject the phosphor powder mixture into the hollow cylindrical or disc-shaped mold prepared above through a syringe, send the mold to a high-pressure mercury lamp for 90 seconds, and take it out to obtain a phosphor prefabricated assembly. The prefabricated component can be used for high-power structural LED packaging, and compared with traditional coating methods, it c...

Embodiment 2

[0028] One piece of mold is made of stainless steel, the size is 3mm in inner diameter; the disc shape 2 is 0.3mm in thickness. Coat the inner wall of the mold with a transparent epoxy resin release agent (Shengdan brand SZ-218R produced by Taixing Shengdan Mold Material Co., Ltd.), and mix the two fully according to the mass ratio of epoxy photocuring adhesive: fluorescent powder = 100:30 and use them together Negative air pressure to remove air bubbles, inject the fluorescent powder mixture glue into the disc-shaped mold prepared above through the syringe, send the mold to the high-pressure mercury lamp for 60 seconds, and get the phosphor prefabricated part after taking it out, which can be used for planar patch Type structure LED package.

Embodiment 3

[0030] combine figure 2 , image 3 To illustrate the application of thermal curing packaging for high-power LEDs. There are two types of prefabricated parts: hollow cylinder and disc shape. The process flow is: on the heat sink 3 of the high-power bracket 7, the blue light chip is placed on the heat sink 3 of the high-power support 4 Fix it; put the hollow cylindrical prefabricated component 1 on the heat sink 3, the edge height of the prefabricated component is slightly higher than the chip 4 by about 0.2mm; use the gold wire 5 on the ultrasonic wire bonding machine to connect the corresponding electrode of the chip 4 to the bracket Leads 6 are connected; Silicone (Dow Corning OE-6550) is poured around the chip, and the glue plane is flush with the edge of the prefabricated component 1; the disc-shaped prefabricated component 2 is covered on the prefabricated component 1; the lens cover 8 is buckled on the bracket 7; inject silica gel into the inner space of the lens cover...

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Abstract

The invention discloses a preparation and application for white light light emitting diode (LED) fluorescent powder prefabricated components. The preparation is characterized in that according to the prior high power and chip support structure, the fluorescent powder prefabricated components can be produced separately by the aid of a die and through a photo-curing method, and the fluorescent powder prefabricated components are packed to a high-power white light LED or a plane patching white light LED. By the aid of the preparation, the problem of uneven fluorescent powder of a traditional packing process is solved, the consistency of all optical characters of the LED can be guaranteed, the fluorescent powder is not direct contact with chips, the light decay is reduced, the conversion efficiency of the fluorescent powder is improved, and the preparation is simple in process, high in working efficiency, capable of greatly reducing the production cost and convenient for large-scale production.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to the preparation and application of a prefabricated assembly of white light LED phosphor powder. Background technique [0002] As a new type of light source, white LEDs are rapidly developing due to their advantages such as fast response, good shock resistance, long life, energy saving and environmental protection. Has been widely used in landscaping and indoor and outdoor lighting and other fields. [0003] At present, there are three white light LED packaging methods: low-power in-line, low-power SMD and high-power. Regardless of the method, the production of white light adopts the process of coating yellow phosphor powder on the blue light chip. The specific process is as follows: first, the chip is fixed on the bracket, and the chip electrode is connected to the bracket with a gold wire on an ultrasonic welder; A certain proportion of fluorescent powder and silica gel ...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/48
CPCH01L2224/48091H01L2224/48247H01L2924/00014
Inventor 苗洪利孙海港田庆震张勇王晶
Owner OCEAN UNIV OF CHINA