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Composite thermally conductive copper foil substrate

A copper foil substrate, composite technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of unfavorable high-temperature process processability, unsatisfactory heat conduction effect, poor thermal stability, etc., to achieve thinner thickness and increase insulation The effect of high performance and thermal conductivity

Active Publication Date: 2015-10-28
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the need to solve the problem of insulation properties (breakdown voltage; Breakdown Voltage) of traditional epoxy resin thermally conductive materials, the thickness of the thermally conductive adhesive used to bond the copper foil layer needs to be 60 to 120um to meet the insulation requirements. Therefore, the total thickness of the product It will be very large, and the heat conduction effect is not ideal
At the same time, due to the low glass transition temperature (Tg) of the type of epoxy resin, it is usually necessary to face a high temperature process in the process of flexible circuit boards; among them, the thermal stability of the epoxy resin that plays the role of the adhesive is poor (that is, the glass transition temperature lower Tg); not conducive to processability on some high-temperature processes

Method used

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  • Composite thermally conductive copper foil substrate
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  • Composite thermally conductive copper foil substrate

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Embodiment 1

[0024] Embodiment 1: A composite heat-conducting copper foil substrate, which is composed of a copper foil layer 1, an insulating polymer layer 2, and a heat-conducting adhesive layer 3. The heat-conducting adhesive layer includes polyimide resin and polyimide resin dispersed in In the heat dissipation powder 5, the insulating polymer layer is fixedly sandwiched between the copper foil layer and the thermally conductive adhesive layer.

[0025] The copper foil used for the copper foil layer in this embodiment can be one of electrolytic copper foil (ED copper foil) and rolled copper foil (RA copper foil). Generally speaking, the thickness of the copper foil layer 1 is 12.5 to 70 microns , and preferably 35 microns.

[0026] The insulating polymer layer 2 can be made of polyimide, preferably a halogen-free thermosetting polyimide material, more preferably a self-adhesive and halogen-free thermosetting polyimide material. The thickness of the insulating polymer layer is preferab...

Embodiment 2

[0032] Embodiment 2: A composite thermally conductive copper foil substrate, which is composed of a copper foil layer 1, an insulating polymer layer 2, a thermally conductive adhesive layer 3, and a metal layer 4. The thermally conductive adhesive layer includes polyimide resin and polyimide resin dispersed in polyimide heat dissipation powder 5 in imide resin, the insulating polymer layer is fixedly sandwiched between the copper foil layer and the thermally conductive adhesive layer, and the thermally conductive adhesive layer is sandwiched between the insulating polymer layer and the thermally conductive adhesive layer between the metal layers.

[0033] The copper foil used for the copper foil layer in this embodiment can be one of electrolytic copper foil (ED copper foil) and rolled copper foil (RA copper foil). Generally speaking, the thickness of the copper foil layer 1 is 12.5 to 70 microns , and preferably 35 microns.

[0034]The insulating polymer layer 2 can be made ...

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Abstract

The invention discloses a compound heat-conducting copper foil substrate, which comprises a copper foil layer, an insulating polymer layer and a heat-conducting adhesion layer, wherein the heat-conducting adhesion layer comprises polyimide resin and radiating powder which is dispersed into the polyimide resin; and the insulating polymer layer is fixedly clamped between the copper foil layer and the heat-conducting adhesion layer. The heat-conducting adhesion layer in the compound heat-conducting copper foil substrate disclosed by the invention contains heat-conducting powder, the polyimide resin has higher heat resistance and higher working quality, and the insulating polymer layer plays a role in insulating and resisting voltage breakdown, so that a product has the advantages of smaller overall thickness, higher flexibility, wide application, high heat-conducting efficiency and increased insulating property, and can be applied to different electronic products which have high power and require heat radiation.

Description

technical field [0001] The invention relates to a composite heat-conducting copper foil substrate, which is suitable for use in substrates requiring heat conduction on electronic products such as LEDs to solve the problem of heat dissipation. Background technique [0002] With the increasing awareness of global environmental protection, energy saving and carbon reduction have become the current trend. The LED industry is one of the most watched industries in recent years. So far, LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle and environmental protection benefits without mercury. However, usually only about 20% of the input power of LED high-power products can be converted into light, and the remaining 80% of the electrical energy is converted into heat energy. [0003] Generally speaking, if the heat energy generated by LEDs cannot be dissipated, the junction temperature of LEDs will be too high, which...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L33/00
Inventor 张孟浩李建辉
Owner KUSN APLUS TEC CORP