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Manufacture process for optimizing electromagnetic composite absorption materials

An absorbing material and electromagnetic composite technology, which is applied in other chemical processes, chemical instruments and methods, etc., can solve the problems of shortened reading and writing distance, inability to meet the requirements of light and thin applications, and poor label compatibility, so as to improve adhesion, Improve the effect of poor communication

Inactive Publication Date: 2013-05-01
YIBIN JINCHUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, when the commercially available flexible composite absorbent material is used for anti-metal electronic tags and is used on metal objects, the effective recognition distance can be guaranteed to reach about 40% of the designed recognition distance at most, and the thickness is generally 0.5mm, which cannot meet the requirements of light and thin applications.
CN102300446A "An Electromagnetic Wave Composite Absorbing Material for Internet of Things Radio Frequency Identification" describes that the electromagnetic wave composite absorbing material used for Internet of Things radio frequency identification materials is composed of various soft magnetic materials and their mixtures, and its essence has Certain conductivity, although a certain proportion of resin is added, because the absorbent particles are difficult to achieve uniform distribution in the adhesive, contact between adjacent absorbent particles is inevitable, and absorbent particles are inevitably exposed on the surface of the product. When the absorbent particles are in contact with the surface of the metal object, its surface resistivity is also (1.0×105~1.0×106) Ω·m, so when the material is in a high-frequency electromagnetic field, it will generate a certain amount of inductance. When the material is pasted or attached to the electronic tag, the inductance generated by the material will affect the inductance of the inherent design of the tag, thereby changing the inductance of the electronic tag, changing the impedance of the electronic tag, and generating the returned signal frequency point and design signal The frequency point shifts, which affects the exchange of communication signals. In practical applications, it is reflected as: the reading and writing distance becomes shorter or the stability of the reading and writing distance is poor or the label compatibility is poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] 1. Select acicular Fe powder with a purity of 98.5% and Ni-Zn ferrite at a ratio of 80%:20% as an electromagnetic interference absorber, and the particle size of the powder is in the range of 0.5 microns to 4 microns.

[0018] 2. Use commercially available LDPE polyethylene resin as an organic coating agent, dissolve it in benzene at 60°C or trichlorethylene at 110°C, the viscosity of the diluted resin solution is 100 mPa·s, and the amount of resin solution is based on electromagnetic interference absorption The particle volume ratio of the agent is about 6%: 94%. Add the electromagnetic interference absorber particles and mix them mechanically. After drying in a box-type drying oven, disperse them with a rotary shearing disperser to obtain an electromagnetic interference absorber after insulation wrapping treatment. Particles, the particle size is between 0.5 microns and 40 microns.

[0019] 3. Chlorinated polyethylene is selected as the adhesive, and the weight ratio ...

Embodiment 2

[0022] 1. Select Fe-Si-Al alloy flake powder (length-to-diameter ratio greater than 5) and spherical Fe powder with a purity of 98.5% in a ratio of 2:1 as the electromagnetic interference absorber. The particle size of the electromagnetic interference absorber is 0.5 microns to 40 microns range.

[0023] 2. Use commercially available 135A CPE resin as an organic coating agent, dissolve in commercially available aromatic hydrocarbons or halogenated hydrocarbons, the viscosity of the resin solution is 150mPa·s, and then add electromagnetic interference absorber particles, the amount of resin solution is based on electromagnetic interference absorption The particle volume ratio of the agent is about 5%:95%. Dry and disperse in a boiling dryer, and the temperature of the hot air is controlled at 50-120°C to obtain electromagnetic interference absorber particles after insulation wrapping treatment, with a particle size of 0.5 microns to Between 40 microns.

[0024] 3. Polyurethane...

Embodiment 3

[0026] 1. Fe-Mg-Zn-Cu soft magnetic ferrite and Fe-Si alloy flake powder (length-to-diameter ratio greater than 5) are mixed in a ratio of 1:4 as the electromagnetic interference absorber, and the particle size of the electromagnetic interference absorber is 0.9 The range of microns to 40 microns.

[0027] 2. Use commercially available PVP as the organic coating agent and ethanol as the organic solvent. The viscosity of the diluted organic coating agent is 200mPa·s. The amount of the diluted organic coating agent is about 3.5%: 96.5% according to the particle volume ratio of the electromagnetic interference absorber , and then add electromagnetic interference absorber particles, mix, dry and disperse in a vacuum rake dryer to obtain electromagnetic interference absorber particles after insulation wrapping treatment, with a particle size between 0.5 microns and 40 microns.

[0028] 3. Epoxy resin is selected as the adhesive, and the weight ratio of absorbent particles after ins...

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PUM

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Abstract

The invention provides a manufacture process for optimizing electromagnetic composite absorption materials. Soft magnetic ferrite particles and soft magnetic metals are made into micrometer level mixtures to be used as electromagnetic interference absorption particles, the electromagnetic interference absorption particles are mixed with organic covering agents, the mixtures are dried and dispersed, absorption agent particles after the insulation covering treatment are obtained, bonding agents are added into the absorption agent particles subjected to the insulation covering treatment, in addition, the materials are uniformly mixed, the composite electromagnetic shielding absorption raw materials are obtained, the composite electromagnetic shielding absorption raw materials are made into various electromagnetic composite absorption material products in various modes including thickness film screen printing or rolling process preparation, extrusion process, compression and forming process and the like according to requirements. The manufacture process provided by the invention has the advantages that the bonding performance between the electromagnetic interference absorption agents and the bonding agents can be improved, the dispersion degree and the space of the electromagnetic interference absorption agent particles in the whole system are controlled, and the communication unsmoothness caused by impedance change when metal anti-metal electronic labels are attached onto metal type back plates can be avoided.

Description

technical field [0001] The invention relates to a manufacturing process for optimizing electromagnetic absorbing materials, mainly a manufacturing process for improving composite electromagnetic shielding absorbing materials used for radio frequency identification anti-metal electronic tags of the Internet of Things. Background technique [0002] Radio Frequency Identification (RFID) technology is an important part of the Internet of Things, and Radio Frequency Identification (RFID) technology is essentially an automatic identification technology. Usually, the RFID system consists of three main parts: electronic tags, readers and data management systems. The electronic tag consists of an antenna and an RFID chip, and each chip contains a unique identification code, which is used to indicate the object to which the electronic tag is attached. The reader is used to read and write the information in the electronic tag. The reader communicates with other computers or systems th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/00
Inventor 曾华宋强胡健徐晓利黄道平
Owner YIBIN JINCHUAN ELECTRONICS
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