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Adhesive composition and semiconductor device using the same

A composition and adhesive technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of weak adhesion, wire drawing, and inability to obtain reliability at the gold-plated interface. Achieve high adhesion and high conductivity

Inactive Publication Date: 2013-05-15
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the filling amount of silver particles is increased, there is a problem that stringing occurs at the time of liquid dispensing due to an increase in viscosity, and operability cannot be ensured.
However, when mounting PKG such as power ICs or LEDs on a board, there is a problem that the junction is re-melted due to the heat history of exposure to 260°C in a reflow furnace, and reliability cannot be obtained.
However, as a result of research by the inventors of the present invention, it is clear that a gold-plated silicon wafer (size: 2mm x 2mm ) and silver-plated copper lead frame are bonded in an oven at 180°C for 1 hour, and the adhesion to the gold-plated interface is weak

Method used

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  • Adhesive composition and semiconductor device using the same
  • Adhesive composition and semiconductor device using the same
  • Adhesive composition and semiconductor device using the same

Examples

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Effect test

Embodiment

[0071] Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited by these examples. The materials used in the Examples and Reference Examples were produced or purchased as follows.

[0072] (1) Alcohols or carboxylic acids with a boiling point of 300°C or higher: stearic acid (boiling point: 376°C, Wako Pure Chemical Industries, Ltd.), tetraethylene glycol (boiling point: 327°C, hereinafter referred to as TEG, Wako Pure Chemical Industries, Ltd. Industrial Co., Ltd.), Isobornylcyclohexanol (boiling point: 308°C, hereinafter referred to as MTPH)

[0073] (2) Volatile components: dipropylene glycol dimethyl ether (boiling point: 175°C, hereinafter referred to as DMM, Daicel Chemical Co., Ltd.), γ-butyrolactone (boiling point: 204°C, hereinafter referred to as GBL, Sankyo Chemical Co., Ltd.), triethylene glycol butyl methyl ether (boiling point: 261°C, hereinafter referred to as BTM, Toho Chemical Industry Co., Ltd.),...

Embodiment 9

[0091] Use the adhesive composition of embodiment 1~8 that obtains above, manufacture such as Figure 7 semiconductor device shown. Specifically, the adhesive compositions of Examples 1 to 8 were coated on an Ag-plated Cu lead frame, an Au-plated semiconductor element was mounted thereon, and it was heat-treated in a clean oven at 180° C. for 1 hour, whereby the Semiconductor elements are attached to the lead frame. Thereafter, after going through a wire bonding process using Au wires, sealing is performed by a normal method, thereby manufacturing a semiconductor device.

[0092] In addition, using the adhesive composition of Examples 1 to 8 obtained above, the following Figure 8 semiconductor device shown. Specifically, the adhesive compositions of Examples 1 to 8 were coated on an Ag-plated Cu lead frame, an Au-plated LED chip was mounted thereon, and it was heat-treated in a clean oven at 180° C. for 1 hour, whereby the The LED chip is attached to the lead frame. Ther...

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PUM

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Abstract

Disclosed is an adhesive composition having high electrical conductivity and thermal conductivity even with no load and at curing temperatures of less than or equal to 200C, and having a high adhesive strength even at 260C; also disclosed is a semiconductor device produced using said adhesive composition. The adhesive composition contains (A) silver particles with a state ratio of oxygen derived from silver oxide of less than 15% when measured with X-ray photoelectron spectroscopy, and (B) an alcohol or carboxylic acid having a boiling point at or above 300C.

Description

technical field [0001] The present invention relates to an adhesive composition excellent in electrical conductivity, thermal conductivity, and adhesiveness. More specifically, it relates to an adhesive combination suitable for bonding semiconductor elements such as ICs, LSIs, and light-emitting diodes (LEDs) to substrates such as lead frames, ceramic wiring boards, glass epoxy wiring boards, and polyimide wiring boards. objects and semiconductor devices using them. Background technique [0002] As a method of bonding semiconductor elements and lead frames (supporting members) when manufacturing semiconductor devices, there is a method of dispersing fillers such as silver powder in resins such as epoxy resins and polyimide resins to form a paste (such as silver paste) and then use it as an adhesive. In this method, a paste-like adhesive is applied to a die pad of a lead frame using a dispenser, a printing machine, a stamping machine, etc., and then the semiconductor elemen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00C09J9/02C09J11/06H01B1/22H01L21/52
CPCH01L2224/2949H01L24/85C08K2003/0806H01L24/83H01L24/29H01L2224/73265H01L2224/05644H01L24/45H01L33/641H01L2224/32225H01L2224/27334H01L2924/15747H01L2224/48091H01L24/05H01L2224/2731H01L2224/83439C09J11/04H01L2224/8384H01L24/48H01L2224/32245H01L2224/29339H01L2924/10253H01L2224/2732H01L2224/83192H01L24/81H01L2924/12041H01L2224/45144H01L33/62H01L2224/29294H01L2224/92247H01L2224/2939H01L2224/04026C09J9/02H01L2224/48247H01L24/32H01L2224/48227H01L23/295H01L23/3121H01L2224/45139H01L2224/48644H01L2924/181H01L2924/12042H01L2924/14Y10T428/31678H01L2924/00014H01L2924/00H01L2924/00012H01B1/22
Inventor 今野馨林宏树
Owner RESONAC CORPORATION
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