Screen printing conductive printing ink composition and preparation method thereof

A conductive ink and screen printing technology, applied in ink, household utensils, applications, etc., can solve the problems of long curing time, high brittleness of cured film, high curing temperature, etc., and achieve stable electrical performance, good printing performance and high mechanical strength Effect

Active Publication Date: 2013-06-12
NAT UNIV OF DEFENSE TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in general, the curing temperature of thermosetting resin is hi

Method used

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  • Screen printing conductive printing ink composition and preparation method thereof
  • Screen printing conductive printing ink composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A screen printing conductive ink composition of the present invention, the conductive ink composition comprises the following components in parts by mass (see Table 1 below):

[0039] Flake silver powder Ferro SF70A 100 parts;

[0040] Alicyclic trifunctional epoxy resin TDE-85 11.20 parts;

[0041] Epoxy resin latent curing agent (Shenzhen Chuang Chou Applied Materials Co., Ltd. ICAM-8409) 0.33 parts;

[0042] 3.36 parts of ternary vinyl acetate resin;

[0043] 10.26 parts of isophorone;

[0044] 20.55 parts of dipropylene glycol methyl ether;

[0045] 5.13 parts of 150# solvent oil;

[0046] 5.60 parts of core-shell structure rubber micro-nano particle modified epoxy resin;

[0047] Thixotropic agent BYK-410 (BYK company) 1.00 parts;

[0048] Antioxidant SRE-701 (Serui Technology, USA) 0.80 parts; and

[0049] Defoamer SRE-2022A (Serui Technology, USA) 0.80 parts.

[0050] The preparation method of the screen printing conductive ink composition of the present ...

Embodiment 2

[0059] A screen printing conductive ink composition of the present invention, the conductive ink composition comprises the following components in parts by mass (see Table 1 below):

[0060] Flake silver powder Ferro SF70A 100 parts;

[0061] Epoxy resin DER-331 (Dow chemical bisphenol A epoxy resin) 9.97 parts;

[0062] Epoxy resin latent curing agent (ICAM-8403) (Shenzhen Chuang Chou Applied Materials Co., Ltd.) 2.09 parts;

[0063] PVB (B-98) (Yiston Chemical New Materials Co., Ltd.) 2.98 copies;

[0064] DBE 5.94 copies;

[0065] 23.73 parts of dipropylene glycol methyl ether;

[0066] 5.94 parts of 150# solvent oil;

[0067] Nitrile rubber modified epoxy resin 861340 (Shenzhen Jiadida Chemical Co., Ltd.) 3.99 parts;

[0068] Thixotropic agent BYK-410 (BYK company) 0.90 parts;

[0069] Antioxidant SRE-701 (Serui Technology, USA) 0.80 parts; and

[0070] Defoamer SRE-2022A (Serui Technology, USA) 0.50 parts.

[0071] The preparation method of the screen printing con...

Embodiment 3

[0080] A screen printing conductive ink composition of the present invention, the conductive ink composition comprises the following mass ratio components (see Table 1 below):

[0081] Flake silver powder Ferro SF70A 100 parts;

[0082] Epoxy resin DER-331 8.82 parts;

[0083] Epoxy resin latent curing agent (Shenzhen ICAM-8403) 3.14 parts;

[0084] 3.17 parts of ternary vinyl acetate resin;

[0085] 9.46 parts of isophorone;

[0086] 18.92 parts of dipropylene glycol methyl ether;

[0087] 150# solvent oil 4.73 parts;

[0088] Nitrile rubber modified epoxy resin 861340 (Shenzhen Jiadida Chemical Co., Ltd.) 4.41 parts;

[0089] Thixotropic agent BYK-410 (BYK company) 1.10 parts;

[0090] Antioxidant SRE-701 (Serui Technology, USA) 0.80 parts; and

[0091] Defoamer SRE-2022A (Serui Technology, USA) 0.80 parts.

[0092] The preparation method of the screen printing conductive ink composition of the present embodiment comprises the following steps:

[0093] 1. Preparation ...

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PUM

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Abstract

The invention discloses a screen printing conductive printing ink composition which comprises the following components in percentage by mass: 20-70 percent of conductive material powder, 1-20 percent of epoxy resin, 0.2-15 percent of epoxy resin latent curing agent, 1-30 percent of thermoplastic resin, 5-60 percent of organic solvent and 0-5 percent of epoxy resin flexibilizer. The preparation method comprises the following steps: mixing the thermoplastic resin powder and the organic solvent, mixing the epoxy resin, the epoxy resin flexibilizer and the epoxy resin latent curing agent to obtain a thermoplastic resin system, adding the conductive material powder to the thermoplastic resin system, mixing the conductive material powder with the thermoplastic resin system; and finally, adding the organic solvent to regulate the viscosity, thus obtaining the screen printing conductive printing ink composition. The product has the advantages of high mechanical strength, stable electrical properties, excellent chemical resistance, high base material adhesion force, low volatile organic compound (VOC) content and the like.

Description

technical field [0001] The invention relates to a printing ink composition and a preparation method thereof, in particular to a conductive ink composition and a preparation method thereof. Background technique [0002] Conductive ink is a special ink with a certain degree of conductivity. It is a conductive composite material formed by dispersing conductive particles (silver, copper, carbon) in the connecting material. After printing on the substrate, it acts as a wire, antenna, etc. role. [0003] In general, conductive ink should have good bending resistance, and the conductive lines printed on flexible substrates (PET and other plastic films) should not be broken at the bend or have a large change in resistance; in addition, conductive ink It should have a wide range of adaptability to various substrates and have strong adhesion to the substrate; the lower the resistivity of the conductive ink itself, the better, which is conducive to reducing costs; because some plastic...

Claims

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Application Information

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IPC IPC(8): C09D11/10C09D11/52
Inventor 秦峻堵永国刘阳张磊刘卓峰张为军
Owner NAT UNIV OF DEFENSE TECH
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