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Conductive silver adhesive for micropore filling and preparation method thereof

A conductive silver glue and microporous technology, applied in the field of conductive glue, can solve the problems of low viscosity, complex conductive composition system, limited applicability, etc., and achieve the effects of low volatility, excellent dimensional stability, and high connection strength.

Inactive Publication Date: 2013-07-03
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive composition system it adopts is relatively complicated and the conditions are relatively strict, including bisphenol glycidyl ether epoxy resin, long-chain aliphatic alcohol glycidyl ether epoxy resin with more than 8 carbon chains, and an average molecular weight of 600-10000 Resins composed of epoxy oligomers
In the patent, the viscosity of the conductive adhesive is below 2000Pa·S, and the filled pore size is 200μm. When the pore size of the micropore is less than 100μm, its applicability may be limited, so lower viscosity is required, and it is suitable for printing to fill the micropore. glue

Method used

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  • Conductive silver adhesive for micropore filling and preparation method thereof
  • Conductive silver adhesive for micropore filling and preparation method thereof
  • Conductive silver adhesive for micropore filling and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] 100 parts by weight of glycidyl phthalate epoxy resin with an epoxy equivalent of 150, 15 parts of liquid crystal epoxy polymer, 8 parts of dispersant and antioxidant, stirring and mixing at a temperature of 90-150 ° C Uniform; cool down naturally, after cooling down to room temperature, add 35 parts of curing agent 4,4'diaminodiphenylmethane (DDM), curing accelerator 2, 4, 6-tri-(dimethylaminomethyl)-phenol 6 parts, stir and mix evenly; then add 500 parts of silver powder, stir thoroughly, and then put it into a three-roller machine and mix evenly to obtain conductive silver glue A1. The conductive silver paste was cured at 80°C for 2 hours, and then completely cured at 150°C for 4 hours.

Embodiment 2

[0053] Glycidyl phthalate epoxy resin with an epoxy equivalent of 150 in a weight ratio of 100 points, 30 parts of a liquid crystal epoxy polymer, and 10 parts of a dispersant and an antioxidant are stirred and mixed at a temperature of 90-150°C Uniform; natural cooling, after cooling down to room temperature, add 40 parts of curing agent 4,4'diaminodiphenylmethane (DDM), curing accelerator 2, 4, 6-tri-(dimethylaminomethyl)-phenol 8 parts, stir and mix evenly; then add 600 parts of silver powder, stir thoroughly, and then put it into a three-roller machine and mix evenly to obtain conductive silver glue A2. The conductive silver paste was cured at 80°C for 2 hours, and then completely cured at 150°C for 4 hours.

Embodiment 3

[0055] Glycidyl phthalate epoxy resin with an epoxy equivalent of 150 in a weight ratio of 100 points, 5 parts of a liquid crystal epoxy polymer, and 5 parts of a dispersant and an antioxidant are stirred and mixed at a temperature of 90-150°C Uniform; natural cooling, after cooling down to room temperature, add 25 parts of curing agent 4,4'diaminodiphenylmethane (DDM), curing accelerator 2, 4, 6-tri-(dimethylaminomethyl)-phenol 5 parts, stir and mix evenly; then add 450 parts of silver powder, stir thoroughly, and then put it into a three-roll machine and mix evenly to obtain conductive silver glue A3. The conductive silver paste was cured at 80°C for 2 hours, and then completely cured at 150°C for 4 hours.

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Abstract

The invention discloses a conductive silver adhesive for micropore filling and a preparation method of the conductive silver adhesive. The conductive silver adhesive comprises epoxy resin, a liquid crystal epoxy polymer, a curing agent, a curing accelerator and a conductive material, wherein the conductive material is silver powder. The preparation method comprises the following steps of: 1) taking the epoxy resin and liquid crystal epoxy polymer, stirring at the temperature of 90-150 DEG C so as to uniformly mix; 2) naturally cooling down, adding the curing agent and the curing accelerator when the temperature is decreased to the room temperature, and sufficiently stirring; 3) adding the silver powder into the obtained system, sufficiently stirring, and putting a three-roller machine to uniformly mix; and 4) curing for 2 hours at 80 DEG C, and curing for 4 hours at 150 DEG C. Compared with the prior art, the conductive silver adhesive has the benefits of low viscosity, low volatility, high connection strength, thermal compact resistance and applicability to micropore filling.

Description

Technical field [0001] The present invention involves conductive glue, especially the conductive silver gum and its preparation method for microphone filling. Background technique [0002] With the development of modern electronic products to the trend of portable, miniaturized, high integration, and high performance, the key to the small and higher demand for circuit boards and the key to improving the small level of circuit boards is the narrower lineBetween width and different levels, smaller and smaller miniature over -holes and blind holes.Micro -holes is a key technology to achieve any interconnection structure, and it is also the basic needs to ensure the integrity of signal.The use of conductive glue to fill the micro -hole, starting between the layers and the layers, has an excellent heat dissipation and structural design advantage, and avoids the treatment of metal waste liquid in the metalization process of electroplating, which is conducive to environmental protection...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02
Inventor 刘萍张双庆
Owner GUANGDONG DANBOND TECH
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